2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec
trostatically Sensitive (ES) Devices.
Examples of typical ES devices are 1C (integrated circuits) and some field-effect transistors and
semiconductor “chip” components.
The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge
(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf
ficient to damage an ES device).
4
Содержание DMP-BD45EE
Страница 37: ...11 1 2 Checking and Repairing of BDP Digital P C B Module 37 ...
Страница 49: ...S3 3 Analog Video Audio Block Diagram DMP BD45 BD65 ANALOG VIDEO AUDIO CIRCUIT BLOCK DIAGRAM S 5 ...
Страница 50: ...S4 Schematic Diagram S4 1 Interconnection Diagram DMP BD45 BD65 INTERCONNECTION DIAGRAM S 6 ...
Страница 51: ...S 7 ...
Страница 52: ...S4 2 Power_Wide P Schematic Diagram N M K H G 1 4 DMP BD45EG BD65EG Series Power_Wide Schematic Diagram P L J ...
Страница 57: ...S 13 ...
Страница 58: ...S5 Print Circuit Board S5 1 Power P C B N M K H G 1 4 DMP BD45EG BD65EG Series Power P C B Component Side L J ...
Страница 59: ...2 4 DMP BD45EG BD65EG Series Power P C B Foil Side ...
Страница 73: ...S8 Exploded View S8 1 Frame and Casing Section S 29 ...
Страница 74: ...S8 2 Mechanism Section S 30 ...
Страница 75: ...S8 3 Packing Parts and Accessories Section A a i A2 S 31 ...