9
3 Service Navigation
3.1.
Introduction
This service manual contains technical information, which allow service personnel’s to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.
If the circuit is changed or modified, the information will be followed by service manual to be controlled with original service manual.
3.2.
About Lead Free Solder (PbF)
Distinction of PbF PCB:
PCBs (manufactured) using lead free solder will have a PbF stamp on the PCB.
Caution:
• Pb free solder has a higher melting point than standard solder, Typically the melting point is 50-70
°
F (30-40
°
C) higher.
Please use a high temperature soldering iron. In case of soldering iron with temperature control, please set it to 700±20
°
F
(370±10
°
C).
• Pb free solder will tend to splash when heated too high (about 1100
°
F/600
°
C).
When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat the sol-
dering points with the Pb free solder until it melts enough.
3.3.
Important Notice 1:(Other than U.S.A. and Canadian Market)
1. The service manual does not contain the following information, because of the impossibility of servicing at component level.
a. Schematic diagram, Block Diagram and PCB layout of Main PCB.
b. Parts list for individual parts of Main PCB.
When a part replacement is required for repairing Main PCB, replace as an assembled parts. (Main PCB)
2. The following category is/are recycle module part. please send it/them to Central Repair Center.
• MAIN PCB (VEP56025A) : Excluding replacement of Lithium Battery
Содержание DMCFZ30PP - DIGITAL STILL CAMERA
Страница 8: ...8 NOTE Above caution is applicable for a battery pack which is for DMC FZ30 series as well ...
Страница 12: ...12 4 Specifications ...
Страница 13: ...13 5 Location of Controls and Components ...
Страница 14: ...14 ...
Страница 15: ...15 ...
Страница 23: ...23 8 Disassembly and Assembly Instructions 8 1 Disassembly Flow Chart 8 2 PCB Location ...
Страница 25: ...25 8 3 1 Removal of the Rear Cover Unit Fig D1 Fig D2 8 3 2 Removal of the Top Case Unit Fig D3 ...
Страница 26: ...26 Fig D4 8 3 3 Removal of the LCD Case Unit Fig D5 ...
Страница 30: ...30 8 3 13 Removal of the Flash PCB Fig D15 8 3 14 Removal of the LCD Unit Fig D16 ...
Страница 31: ...31 Fig D17 8 3 15 Removal of the EVF Unit Fig D18 8 3 16 Removal of the Top Operation Unit Fig D19 ...
Страница 32: ...32 8 3 17 Removal of the Mic FPC PCB Fig D20 8 3 18 Removal of the Hot Shoe Unit Fig D21 ...
Страница 40: ...40 8 5 5 Assembly for the 4th Lens Frame Unit and Thrust Ring 8 5 6 Assembly for the Inside Frame ...
Страница 42: ...42 8 5 10 Assembly for the Zoom Encoder Unit 8 5 11 Assembly for the Lens Ring Base and Master Frange Unit ...