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Operation manual for “High Current connectors B01/B02”

©

Panasonic Corporation 2017

ACCTF34E 201710

Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/

12

Recommended specifications for PC-board and metal mask opening area

When designing please verify with the product specification sheets

①

B01 Socket [mating height 0.6mm/0.8mm]

Recommended PC-board pattern (Mount-pad layout)

（

TOP VIEW

）

Recommended metal mask pattern
When the metal mask thickness is 100

μm

  (Power contact section opening area: 88%)
  (Signal contact section opening area: 83%)
  (Metal section opening area: 100%)

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Содержание B01

Страница 1: ...ACCTF34E 2017 10 industrial panasonic com ac e B01 B02 High Current Connectors Operation manual ...

Страница 2: ...romechanical Control Business Division industrial panasonic com ac e 1 Contents 01 Introduction 2 02 Precautions for product design 3 03 Precautions for mounting and reflow soldering 13 04 Precautions for mating and unmating 20 Points which particularly need to be confirmed before designing products are bold and underlined ...

Страница 3: ...ness of the molded part has been further reduced Accordingly pay attention when using the connector and read this document before designing a product and starting production B01 B02 A35US Application For Battery Power connect For Signal connect Space saving Excellent Width B01 2 4mm B02 2 2mm Excellent Width 2 2mm Low profile Excellent Mated height B01 0 6mm 0 8mm B02 0 7mm Excellent Mated height ...

Страница 4: ... make sure to consider preventive measures against the detachment of mated connectors during practical use Make sure to eliminate any gaps between the casing and board We recommend that the holding force is set greater than the insertion force of the connector Select an appropriate cushioning material with a suitable shape and dimensions and hold down the connector at the center If the holding pos...

Страница 5: ...pact applied to the connector 2 In particular if there is no gap between the casing and sub board A B the sub board side will hit the casing wall first This impact may damage the connector Preventive measures Securely fix both the motherboard and sub board 1 Fixing motherboard Prevents inertial movement by drop impact by fixing the side with a greater mass 2 Hold down the sub board to prevent it f...

Страница 6: ...onic com ac e 5 3 To facilitate the mating of connectors we recommend that you pay attention to the following points when designing the motherboard Provide a reference mark Design a layout that allows easy checking of the connector mating condition Examples of reference mark Flexible board Reinforcing plate Motherboard Provide a reference mark Silk printing Pattern copper foil ...

Страница 7: ...When designing the terminal foot pattern check the latest specifications and examine the recommended foot pattern and dimensions of the metal mask opening The current recommendations are indicated on pages 12 to 15 2 The power terminal consists of 4 pins When designing in order to prevent an excessive temperature rise use 2 terminals for each positive terminal and negative terminal of battery Pin ...

Страница 8: ...ttern peeling preventive measure when removing the connector Make the foot pattern length longer than the coverlay opening In general at least 0 3 mm 5 Foot pattern dimensions indicated in the drawings are intended to achieve the minimum area on the premise that the reflow soldering process is used For manual soldering or for ensuring solder reworkability make a longer pattern at the terminal tip ...

Страница 9: ...f the Assist carrier ShinEtsu Polymer In case of a one sided FPC board warpage is more likely to occur if a pattern is laid in a line or if the copper foil is applied over the entire FPC board for noise prevention purposes Since the FPC is soft it is difficult to keep it flat Typical transfer jigs for the board mounting process Magic resin Daisho Denshi Keiju board Mitsubishi Resin Assist carrier ...

Страница 10: ...thickness is set to about 30 μm including the adhesive If the thickness exceeds 30 μm design the board so as to remove the coverlay under the connector 3 This connector is often used for connecting the motherboard and FPC board In this case if the FPC board is too short a load that causes deviation will be applied to the connector Make sure to create a design that provides some allowance in the FP...

Страница 11: ...ss or poor soldering may occur depending on the direction the reinforcing plate on material was cut Accordingly make sure to indicate the direction of the material Rolled sheets generate warpage depending on material direction so therefore make sure to warpage reduction into consideration 4 For using an ultra thin reinforcing plate for slimming a product one way is to use metals such as stainless ...

Страница 12: ... after reflow soldering Make sure to adjust the amount of solder applied after checking the finish quality in a test run 2 Compared with natural air reflow soldering N2 reflow soldering can reduce oxidization of the melted solder surface This significantly improves the solder wettability Therefore make sure to apply an appropriate amount of solder 3 Do not apply an excessive amount of solder other...

Страница 13: ...mmended specifications for PC board and metal mask opening area When designing please verify with the product specification sheets B01 Socket mating height 0 6mm 0 8mm Recommended PC board pattern Mount pad layout TOP VIEW Recommended metal mask pattern When the metal mask thickness is 100μm Power contact section opening area 88 Signal contact section opening area 83 Metal section opening area 100...

Страница 14: ...ustrial panasonic com ac e 13 Recommended specifications for PC board and metal mask opening area B01 Header mating height 0 6mm 0 8mm Recommended PC board pattern Mount pad layout TOP VIEW Recommended metal mask pattern When the metal mask thickness is 100μm Power contact section opening area 73 Signal contact section opening area 75 Metal section opening area 100 ...

Страница 15: ...Recommended specifications for PC board and metal mask opening area When designing please verify with the product specification sheets B02 Socket mating height 0 7mm Recommended PC board pattern Mount pad layout TOP VIEW Recommended metal mask pattern When the metal mask thickness is 100μm Power contact section opening area 86 Signal contact section opening area 81 Metal section opening area 32 ...

Страница 16: ...industrial panasonic com ac e 15 Recommended specifications for PC board and metal mask opening area B02 Header mating height 0 7mm Recommended PC board pattern Mount pad layout TOP VIEW Recommended metal mask pattern When the metal mask thickness is 100μm Power contact section opening area 71 Signal contact section opening area 75 Metal section opening area 100 ...

Страница 17: ...adhered to the embossed carrier tape or the cover tape in dry condition Recommended humidity is from 40 RH to 60 RH and please remove static electricity by ionizer in manufacturing process 03 2 Points to consider when selecting a pickup nozzle for mounting Select a pickup nozzle with a suction area that demonstrates a theoretical lifting force at least 10 times greater than the connector weight Th...

Страница 18: ...onic com ac e 17 Examples of suction nozzle shape Connector weight socket Number of pins 6 Number of pins 6 Weight 0 010 Weight 0 013 Number of pins 8 Weight 0 012 Elongated hole Circular hole Available for except for the case of connector turning around when mounted Mated height 0 6mm 2 0 Unit g Unit g Mated height 0 8mm B02 Mated height 0 7mm Mated height 0 7mm Unit g B01 B02 ...

Страница 19: ...e 18 2 Picking up the header 1 The suction area on the header is 0 7 mm in the shorter direction If it is difficult to reliably insert the nozzle to the connector bottom face of 0 7 mm widthwise the header can be picked up by converting the entire top face of the connector as shown below 2 Dimension of the Header Header Unit mm B01 0 7mm B01 Mated height 0 6mm 0 8mm B02 M ated height 0 7mm ...

Страница 20: ...zzle shape Pins A B C D 6 8 3 4 1 8 2 0 0 5 Connector weight header Number of pins 6 Number of pins 6 Weight 0 004 Weight 0 005 Number of pins 8 Weight 0 005 Elongated hole Circular hole Available for less except for the case of connector turning around when mounted Unit mm It is available to suck the connector s whole top surface Mated height 0 6mm Unit g Unit g Mated height 0 8mm B01 Mated heigh...

Страница 21: ...solder may have been applied or the wicking phenomenon may have occurred Check the amount of solder applied the position and the temperature profile at the mounted connector position In particular be careful not to apply excessive solder when the N2 reflow furnace is used 4 Extending the screen pattern outward and providing a solder application position on the outer side can help secure a large fr...

Страница 22: ...ise the resin will melt 2 During solder rework solder is supplied at and the soldering iron is applied to the tip of each pattern Make sure that solder and the soldering iron do not contact the terminal 3 When carrying out manual soldering or rework avoid using flux if possible in order to prevent it from rising to the contact section For details see the next page 4 When using flux apply as little...

Страница 23: ...pply an appropriate amount of flux e g BON 102F Japan Bonkote 2 Selection of soldering iron For narrow pitch connectors with a 0 35 mm pitch we recommend An iron tip with a retractable knife shape Ex Japan Bonkote With a temperature sensor on the iron tip Temperature controllable iron tip It is also necessary to check that there are no differences between the indicated temperature and the actual t...

Страница 24: ... to slide the iron tip on the foot pattern along the terminals without touching them Apply the soldering iron to the foot pattern to heat it Complete soldering in 1 or 2 seconds Connector s resistance to soldering heat 300 C 5 sec max 350 C 3 sec max Thin wire solder with a diameter of 0 3 0 4 mm is recommended Final soldering is recommended after provisionally soldering the terminals at both ends...

Страница 25: ...tive effect to the product 1 In order to keep the solvent purity and to enhance cleaning prepare equipments such as boil ultrasonic cleaning with cold solvent and vapor washing 2 Keep the cleaning solvent clean and prevent the connector contacts from contamination 3 Some cleaning solvents are strong and they may dissolve the molded part and characters so pure water passed liquid solvent is recomme...

Страница 26: ...etween the contacts and posts of both connectors are completed A snapping sound will indicate that the simple locking sections are completely mated 4 After completing the mating process check that the clearance between the FPC board and the motherboard is visibly even in both the X and Y directions If the space is not even mating may not be completed Unmate the connectors once check that there is ...

Страница 27: ...the electrified connector in the state of carrying current or applying voltage 7 Electric Shock Hazard Power terminal of header side is exposed So if you touch the power terminal with finger ex mating operation the battery may electrical short and get an electrical shock To avoid electrical shock hazard mounting a header on main PWB and mounting a socket on battery side is recommended Batte Batter...

Страница 28: ...cautions for connector unmating 1 Hold the reinforcing plate at unmating the connector 2 Lift straight up to unmate 3 If the method of unmating described above is not feasible due to a lack of space around the connector please lift around one of the shorter sides of the connector to unmate it Please avoid completely lifting from the other longer side to unmate which risks damaging the connector Li...

Страница 29: ...t connectors B01 B02 Panasonic Corporation 2017 ACCTF34E 201710 Panasonic Corporation Electromechanical Control Business Division industrial panasonic com ac e 28 Amendment history Manual No Date Changes ACCTF34E Oct 2017 Preliminary ...

Страница 30: ...ACCTF34E 201710 2017 ...

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