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Cautions for Use of Solid State Relays

ASCTB400E 201806-T

14. Soldering

1) When soldering surface-mount terminals, the following
conditions are recommended.
(1) IR (Infrared reflow) soldering method
(Recommended condition reflow: Max. 2 times, measurement
point: soldering lead)

(2) Other soldering methods
Other soldering methods (VPS, hot-air, hot plate, laser heating,
pulse heater, etc.) affect the relay characteristics differently,
please evaluate the device under the actual usage.
(3) Soldering iron method
Tip temperature: 350 to 400

662 to 752

Wattage: 30 to 60 W
Soldering time: within 3 s

2) When soldering standard PC board terminals, the following
conditions are recommended.
(1) DWS soldering method
(Recommended condition number of times: Max. 1 time,
measurement point: soldering lead *1)

(2) Other dip soldering method (recommended condition: 1 time)
Preheating: Max. 120

248

, within 120 s, measurement

point: soldering lead
Soldering: Max. 260

500

, within 5 s*, measurement area:

soldering temperature

*Phototriac coupler and AQ-H: within 10 s

(3) Manual soldering method
Tip temperature: 350 to 400

662 to 752

Wattage: 30 to 60 W
Soldering time: within 3 s

• We recommend one with an alloy composition of
Sn3.0Ag0.5Cu.

15. Others

1) If an SSR is used in close proximity to another SSR or heat-
generating device, its ambient temperature may exceed the
allowable level. Carefully plan SSR layout and ventilation.
2) Terminal connections should be made by referring to the
associated wiring diagram.
3) For higher reliability, check device quality under actual
operating conditions.
4) To prevent the danger of electrocution, turn off the power
supply when performing maintenance. Although AQ-A (DC
output type) is constructed with insulation for the input/output
terminals and the rear aluminum plate, the insulation between
the input/output and the rear aluminum plate is not UL approved.

16. Transportation and storage

1) Extreme vibration during transport may deform the lead or
damage the device characteristics. Please handle the outer and
inner boxes with care.
2) Inadequate storage condition may degrade soldering,
appearance, and characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45

32 to 113

• Humidity: Max. 70%RH
• Atmosphere: No harmful gasses such as sulfurous acid gas,

minimal dust.

3) Storage of Phototriac coupler (SOP type)
In case the heat stress of soldering is applied to the device
which absorbs moisture inside of its package, the evaporation of
the moisture increases the pressure inside the package and it
may cause the package blister or crack. This device is sensitive
to moisture and it is packed in the sealed moisture-proof
package. Please make sure the following condition after
unsealing.
• Please use the device immediately after unsealing.
(Within 30 days at 0 to 45

32 to 113

and Max. 70%RH)

• If the device will be kept for a long time after unsealing, please
store in the another moisture-proof package containing silica
gel. (Please use within 90 days.)

17. Water condensation

Water condensation occurs when the ambient temperature
changes suddenly from a high temperature to low temperature
at high humidity, or the device is suddenly transferred from a low
ambient temperature to a high temperature and humidity.
Condensation causes the failures such as insulation
deterioration. Panasonic Corporation does not guarantee the
failures caused by water condensation.
The heat conduction by the equipment the SSR is mounted may
accelerate the water condensation. Please confirm that there is
no condensation in the worst condition of the actual usage.
(Special attention should be paid when high temperature heating
parts are close to the SSR.)