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Operation manual for Narrow-pitch connectors A35US

Panasonic Corporation
industrial.panasonic.com/ac/e/

©

Panasonic Corporation 2015

ACCTF14E-3 201509

- 13 -

Recommended specifications for PC-board and metal mask opening area

When designing please verify with the product specification sheets

Applicable product:A35US narrow-pitch connector socket

（

Mated height

：

0.6mm

）

Recommended PC-board pattern (Mount-pad layout)

Recommended metal mask pattern

When the metal mask thickness is 100



m

(Terminal section opening area: 70%)

(Metal section opening area: 46%)

Insulation area

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Содержание A35US

Страница 1: ...ACCTF14E 3 2015 09 industrial panasonic com ac e A35US Narrow pitch Connectors onnector Operation manual ...

Страница 2: ...e Panasonic Corporation 2015 ACCTF14E 3 201509 1 Contents 01 Introduction 2 02 Precautions for product design 3 03 Precautions for mounting and reflow soldering 15 04 Precautions for mating and unmating 25 Points which particularly need to be confirmed before designing products are bold and underlined ...

Страница 3: ... conditions of use Read this document before designing a product and starting production A35US A35S Space saving Excellent Width 2 2mm Very good Width 2 5mm Low profaile Excellent Mated height 0 6mm Very good Mated height 0 8mm Wiring underneath Good Exposed metal part on the rear face Exposed metal part Good Exposed metal part on the rear face Exposed metal part Contact reliability Excellent Exce...

Страница 4: ...the connector in the mounting process Design multi pin connector layouts that do not require a swinging movement during pickup and mounting In many cases deviation of the connector mounting position is caused by the inertia of the swinging movement of the mounter A layout that does not require swinging is thus required Example of a connector layout requiring a swinging movement in the mounting pro...

Страница 5: ...tor may damage it Pay attention to the following points Cushioning material Casing Sub board flexible board Connector Reinforcing plate Motherboard When an impact such as dropping as shown in the drawing is applied 1 If both boards are not sufficiently fixed the connector will be damaged due to the impact applied to the connector 2 In particular if there is no gap between the casing and sub board ...

Страница 6: ...acilitate the mating of connectors we recommend that you pay attention to the following points when designing the motherboard Provide a reference mark Design a layout that allows easy checking of the connector mating condition Examples of reference mark Flexible board Reinforcing plate Motherboard Provide a reference mark Silk printing Pattern copper foil ...

Страница 7: ... for preventing solder from peeling off the terminal Make sure to design a foot pattern for the holding metal 3 Pay attention to the following points when providing a through hole by extending the foot pattern If a through hole is created simply by extending the foot pattern by the same width solder is absorbed into the through hole during the reflow process which may cause defective or poor solde...

Страница 8: ...eve the minimum area on the premise that the reflow soldering process is used For manual soldering or for ensuring solder reworkability make a longer pattern at the terminal tip 6 When it is needed to provide pattern wiring and through hole underneath the socket it is possible to use it by designing the pattern as shown below in case insulation underneath the socket is not assured Secure space for...

Страница 9: ...c com ac e Panasonic Corporation 2015 ACCTF14E 3 201509 8 7 Resist between pins When it is needed to provide resist between the pins there is a way to adopt the overresist method as below If the resist is out of alignment the pattern width 0 20mm would not change Copper foil Overresist Resist ...

Страница 10: ...hinEtsu Polymer In case of a one sided FPC board warpage is more likely to occur if a pattern is laid in a line or if the copper foil is applied over the entire FPC board for noise prevention purposes Since the FPC is soft it is difficult to keep it flat Typical transfer jigs for the board mounting process Magic resin Daisho Denshi Keiju board Mitsubishi Resin Assist carrier ShinEtsu Polymer To ke...

Страница 11: ...bout 30 μm including the adhesive If the thickness exceeds 30 μm design the board so as to remove the coverlay under the connector 3 This connector is often used for connecting the motherboard and FPC board In this case if the FPC board is too short a load that causes deviation will be applied to the connector Make sure to create a design that provides some allowance in the FPC board Connector ter...

Страница 12: ...ay occur depending on the direction the reinforcing plate on material was cut Accordingly make sure to indicate the direction of the material Rolled sheets generate warpage depending on material direction so therefore make sure to warpage reduction into consideration 4 For using an ultra thin reinforcing plate for slimming a product one way is to use metals such as stainless steel for the reinforc...

Страница 13: ...g Make sure to adjust the amount of solder applied after checking the finish quality in a test run 2 Compared with natural air reflow soldering N2 reflow soldering can reduce oxidization of the melted solder surface This significantly improves the solder wettability Therefore make sure to apply an appropriate amount of solder 3 Do not apply an excessive amount of solder otherwise solder or flux ma...

Страница 14: ...s for PC board and metal mask opening area When designing please verify with the product specification sheets Applicable product A35US narrow pitch connector socket Mated height 0 6mm Recommended PC board pattern Mount pad layout Recommended metal mask pattern When the metal mask thickness is 100 m Terminal section opening area 70 Metal section opening area 46 Insulation area ...

Страница 15: ...1509 14 Recommended specifications for PC board and metal mask opening area Applicable product A35US narrow pitch connector header Mated height 0 6mm Recommended PC board pattern Mount pad layout Recommended metal mask pattern When the metal mask thickness is 100 m Terminal section opening area 70 Metal section opening area 77 Insulation area ...

Страница 16: ...oints to consider when selecting a pickup nozzle for mounting Select a pickup nozzle with a suction area that demonstrates a theoretical lifting force at least 10 times greater than the connector weight Theoretical lifting force g Vacuum pressure mmHG 760 1 033 Nozzle area cm2 Example of machine vacuum pressure setting 480 520 mmHg 1 Picking up the socket 1 The suction area on the socket is 0 6 mm...

Страница 17: ...oration 2015 ACCTF14E 3 201509 16 Examples of suction nozzle shape Connector weight socket Number of pins 10 20 30 40 50 60 Weight 0 008 0 011 0 014 0 017 0 020 0 023 Elongated hole Circular hole Available for less than 50 pins and except for the case of connector turning around when mounted Unit g Mated height 0 6mm ...

Страница 18: ...n area on the header is 0 8 mm in the shorter direction If it is difficult to reliably insert the nozzle to the connector bottom face of 0 8 mm widthwise the header can be picked up by converting the entire top face of the connector as shown below 2 Dimension of the socket Header Suction area Terminal coplanarity Unit mm Post and soldering terminal Cross section view Mated height 0 6mm ...

Страница 19: ...6 20 4 5 1 8 2 5 0 6 30 6 5 1 8 4 5 0 6 40 8 0 1 8 6 0 0 6 50 10 0 1 8 8 0 0 6 60 11 5 1 8 9 5 0 6 Connector weight header Number of pins 10 20 30 40 50 60 Weight 0 003 0 004 0 006 0 007 0 009 0 010 Elongated hole Circular hole Available for less than 50 pins and except for the case of connector turning around when mounted Unit mm It is available to suck the connector s whole top surface Unit g Ma...

Страница 20: ...ion then excessive solder may have been applied or the wicking phenomenon may have occurred Check the amount of solder applied the position and the temperature profile at the mounted connector position In particular be careful not to apply excessive solder when the N2 reflow furnace is used 4 Extending the screen pattern outward and providing a solder application position on the outer side can hel...

Страница 21: ...t 2 During solder rework solder is supplied at and the soldering iron is applied to the tip of each pattern Make sure that solder and the soldering iron do not contact the terminal 3 When carrying out manual soldering or rework avoid using flux if possible in order to prevent it from rising to the contact section For details see the next page 4 When using flux apply as little as possible to the ti...

Страница 22: ...ount of flux e g BON 102F Japan Bonkote 2 Selection of soldering iron For narrow pitch connectors with a 0 35 mm pitch we recommend An iron tip with a retractable knife shape Ex Japan Bonkote With a temperature sensor on the iron tip Temperature controllable iron tip It is also necessary to check that there are no differences between the indicated temperature and the actual temperature of the iron...

Страница 23: ... on the foot pattern along the terminals without touching them Apply the soldering iron to the foot pattern to heat it Complete soldering in 1 or 2 seconds Connector s resistance to soldering heat 300 C 5 sec max 350 C 3 sec max Thin wire solder with a diameter of 0 3 0 4 mm is recommended Final soldering is recommended after provisionally soldering the terminals at both ends Note that when the so...

Страница 24: ...duct 1 In order to keep the solvent purity and to enhance cleaning prepare equipments such as boil ultrasonic cleaning with cold solvent and vapor washing 2 Keep the cleaning solvent clean and prevent the connector contacts from contamination 3 Some cleaning solvents are strong and they may dissolve the molded part and characters so pure water passed liquid solvent is recommended 4 When cleaning b...

Страница 25: ...aning frequency of the mask Considering solder particle diameter and running we recommend the setup as below Solder Cleaning frequency 21 powder Approx third consecutive cleanings 32 powder Max tenth consecutive cleanings 2 Mask opening width Considering solder particle diameter and pattern width we recommend the setup as below Suitable mask opening width for pattern width 0 20mm 3 Pealing force P...

Страница 26: ...d posts of both connectors are completed A snapping sound will indicate that the simple locking sections are completely mated 4 After completing the mating process check that the clearance between the FPC board and the motherboard is visibly even in both the X and Y directions If the space is not even mating may not be completed Unmate the connectors once check that there is no damage and press th...

Страница 27: ... unmating 1 Hold the reinforcing plate at unmating the connector 2 Lift straight up to unmate 3 If the method of unmating described above is not feasible due to a lack of space around the connector please lift around one of the shorter sides of the connector to unmate it Please avoid completely lifting from the other longer side to unmate which risks damaging the connector Lift up ...

Страница 28: ...poration industrial panasonic com ac e Panasonic Corporation 2015 ACCTF14E 3 201509 27 Amendment history Manual No Date Changes ACCTF14E 1 October 2013 Company name and format change ACCTF14E 2 June 2015 Division name change ACCTF14E 3 September 2015 Drawing change ...

Страница 29: ...ACCTF14E 3 201509 ...

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