9
6. Bring the tip of the handpiece to a distance of 2.5cm (1 inch) from the
component leads (or terminations). Press the finger switch to begin air
flow. Direct the air flow to one side of the component and begin to heat
the leads and lands in a side to side sweeping motion across the lead (or
termination) or along the length of one row of leads. After evaporation of
solder paste flux is observed, move the tip closer to the component with a
continuous air flow until complete solder reflow occurs.
7. Continue to heat the lead/land contact area(s) until formation of shiny
solder fillets is observed. Fillets on chip components and SOICs will be
slightly concave on each lead; fillets on extended lead devices should
cover the sides, toe and heel of each lead.
8. Release the finger switch to stop air flow.
9. Repeat the above procedure for leads on all sides of the component.
10. Clean and inspect per your company specifications.
NOTE
If this process has not been successful, preheating of the PC Assembly
and/or adjustment of the Controllable
PRESSURE
Port may be required.
SPECIAL APPLICATIONS
If you require assistance in the use of this handpiece or require assistance with a
special application, contact PACE Applications Engineering at:
Tel:
(301) 490 - 9860
Fax:
(301) 604 - 9215