OXTS xOEM500, Руководство по интеграции оборудования

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Oxford Technical Solutions Ltd www.oxts.com Page 19 of 22
Heat dissipation
The upper operating temperature of the xOEM board set is 70°C, therefore it should be mounted in a
location where this temperature will not be exceeded. The xOEMcore is designed so that the excess
heat is dissipated into its frame. The most effective way to keep the xOEMcore cool is to mount the
frame to something thermally conductive and cool. General xOEM cooling can be aided by mounting
in an area where air can circulate. It is also recommended that the metal canned DCDC converter on
the bottom of the xOEM board set is thermally connected to something for cooling if possible. The
SOM should also have heat sinking applied as well as being held in place. OxTS recommend using a
GapPad to a metal surface below it to achieve this fixing and ideal heat dissipation.
Power consumption
As with other electronic devices the power consumption of the xOEM is affected by the environmental
conditions it is operating in and by its power source. Tests carried out by OxTS have shown that the
best power consumption is achieved with a 12 V power input and at room temperature (20
–25°C). It is
also recommended to not use excessively long antenna or power cables to reduce power loss in
cabling.
Internal storage
The xOEM uses a 32 GB eMMC for storage of hardware information, configuration files, and
navigation data. Files can be sent to or retrieved from the card via FTP or with the software utilities
provided (NAVconfig for configuration files and NAVsolve for data files).