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90-0761 V4
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Proprietary and Confidential
Page 19 of 22
3.
The
chip sealer assembly
can be cleaned by immersing in suitable solvents and sonicated, or by
heating (up to 150
C).
Exposure to vacuum (e.g. in vacuum oven) is
not
recommended and may distort the chip mount.
Ensure the
chip sealer assembly
is completely dry before applying FAIMS waveforms to the cleaned
chip.
Further advice on cleaning can be found on the Owlstone support website
https://support.owlstonenanotech.com/hc/en-us/categories/201660986
4.
To replace the
chip sealer assembly
in the cap, align the alignment feature (bump) in the PTFE
mount with the corresponding recess in the inner ring of the cap and push it into place.
Handle chip
sealer assembly
by edges
NOT
connector pins
Align location
features