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2-4

EP757

SERVICE MANUAL

Introduction

Fundamental Principle

Mechanical Construction Procedure of Disassembly Function of Boards Specifications

Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix

2-1.2 Thermal Board Block Diagram

THERMAL BOARD Interface

FAN 1-4

THERMAL

SWITCH

THERMAL

SENSOR

LM75

MAIN

BOARD

KEY PAD

20P Connector to
Formatter Board

16P Connector

3P Connector *4

2P Connector

4P Connector *2

STB

ECON

KEY 7PIN

ERR_OUT

LAMPMISS

POWER 15V, 5VA

STANDBY

ERR_OUT

IR_ON

Содержание EP756

Страница 1: ... of single panel 250 watt long life UHP lamp The manual gives you a brief description of basic technical information to help in service and main taining the product Your customers will appreciate the quick response time when you immedi ately identify problems that occur with our products We expect your cus tomers will appreciate the service that you offer them This manual is for technicians and pe...

Страница 2: ... 768 resolution True colors With up down left and right screen reverse XGA SVGA VGA MAC iMAC PC98 FM Towns VESA compatibility with XGA compression 120 Hz High Refresh Compatible Auto image re sizing to True XGA 1024 x 768 Addressable Pixels screen Auto detection of computer signal input Auto Image Auto tracking Frequency Position adjustment Powerful enlarge and freeze function Automatically saves ...

Страница 3: ... g a m I e c n a t s i D n o i t c e j o r P 4 2 0 2 e c n a t s i D n o i t c e j o r P x a M e z i S e g a m I n i M e z i S e g a m I 8 8 4 4 4 7 3 m 4 1 1 1 5 0 8 2 8 3 3 2 m 3 1 7 0 5 7 3 3 2 8 4 9 1 m 4 9 5 0 4 7 8 7 4 5 6 m 0 2 3 1 2 9 4 0 0 1 4 m 0 5 2 1 0 1 0 1 4 7 1 4 3 m 2 4 0 1 1 1 8 1 1 4 8 9 m 0 3 9 1 8 3 7 0 5 1 6 m 5 7 8 1 6 1 5 1 6 5 2 1 5 m 3 6 5 1 8 4 7 5 1 2 1 3 1 m 0 4 5 2 4 8...

Страница 4: ... 1 x e p y T k c a j A C R t u p n i o e d i V 3 x e p y T k c a j e n o h P t u p n i o i d u A 1 x t u p t u O e s u o M e t o m e R c e p s l a n g i s t u p n I z H k 0 0 1 5 1 y c n e u q e r F c n y s H z H 0 2 1 3 4 y c n e u q e r F c n y s V C P B G R l a n g i S o e d i V m h o 5 7 p p V 7 0 B G R g o l a n A l a n g i s c n y S m h o 5 7 p p V 1 B G R g o l a n A c n y S V H L T T e t a...

Страница 5: ...l p p u s r e w o p p m a L 1 2 4 Environmental Features e r u t a r e p m e T 5 3 5 g n i t a r e p O o C 0 6 0 1 e g a r o t S o C y t i d i m u H m u m i x a M 5 3 5 g n i t a r e p O o g n i s n e d n o c n o n x a M H R 0 8 C 0 6 0 1 e g a r o t S o g n i s n e d n o c n o n x a M H R 0 8 C l e v e l e s i o n c i t s u o c A 2 3 2 r e d n U l a c i p y T A B d 1 7 3 o C d l u o h s d e t h g...

Страница 6: ...ations Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix This section provides the conceptual drawing about optics of projector You can realize optical projection system through the following diagram and the integral part of configuration too Fundamental Principle 2 2 2 2 2 ...

Страница 7: ...and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 2 1 Whole System Block Diagram D Sub Output S Video Video Audio DVI D Sub Mouse RS232 Input Speaker Front End Board Inter Lock Switch LVPS Module IR Receiver Fan Thermal Board Thermal Sensor Formatter Board Module Lamp Ballast Module Keypad Photo Sensor LAMP Module Color Wheel Thermal Switch ...

Страница 8: ...ure Appendix 2 1 1 Front End Board Block Diagram D Sub output Analog Input Digital Input Video Decoder Memory Image Process MIS Thermal Board LVPS Module DMD Module R G B H Vsync Digital R G B data H Vsync SDA SCL GCLK y 0 7 UV 0 7 GM VHS GM VVS GM VPEN GM VCLK Standby out 7 Sec RESET MCLK DCLK KDS 0 3 KDR 0 2 ERR Standby 1 ECOMODE LAMP Lit Digital R G B Data DCLK0 DENR DVS DHS LAMP ON Lamp Lit RE...

Страница 9: ... Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 2 1 2 Thermal Board Block Diagram THERMAL BOARD Interface FAN 1 4 THERMAL SWITCH THERMAL SENSOR LM75 MAIN BOARD KEY PAD 20P Connector to Formatter Board 16P Connector 3P Connector 4 2P Connector 4P Connector 2 STB ECON KEY 7PIN ERR_OUT LAMPMISS POWER 15V 5VA STANDBY ERR_OUT IR_ON ...

Страница 10: ...OLLER CONTROL FPGA CONFIG SEQUENCE PROM CUSTOMER INTERFACE CONNECTOR VCC2 DMD VCC2 ASIC VOFFSET VBIAS VRESET 5V 12V CLOCK OSC DPF2A CONTROL VSYNCZ HSYNCZ ACTDATA TFIELD OLACT SYNCVAL LAMP CONTROL STATUS COLOR WHEEL INDEX FPGA CLK FLASH PROGRAMMING HEADER IIC BUS HITACHI DOWNLOAD HEADER CLKIN COLOR WHEEL CONTROL COLOR WHEEL STATUS CWRSTZ VOLTAGE ENABLES BIAS BIN BIAS RESET CONTROL DMD CONTROL PBUS2...

Страница 11: ...fications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 1 Lamp Module 7 Relay Lens 2 2 Lamp Cover Glass 8 Condenser 3 Color Wheel 9 DMD 4 Hollow Rod 10 Mirror 5 Relay Lens 4 11 Projection Lens 6 Relay Lens 3 2 2 Optics 2 2 1 Conceptual Drawing 2 3 1 5 4 9 8 6 7 10 11 ...

Страница 12: ...DDC Key In Procedure Appendix Lamp Module The light source Lamp Cover Glass Protecting system components if the lamp explodes Color Wheel Separating the light beam into and produce R G B colors Hollow Rod Making the light beam uniform Relay Lens Relay the object Condenser Condensing the light beam DMD Module Displaying component Mirror Folding optical path Projection Lens Projecting image on the s...

Страница 13: ...eshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix This section provides the package and exploded overview replaceable parts list and recommendatiom parts list for the portable projector You can place an order for correct parts in the recommendation parts list Mechanical Construction 3 3 3 3 3 ...

Страница 14: ... Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 3 1 Package Overview ...

Страница 15: ... R O T K C A J I N I M E L B A C 0 1 2 0 0 0 1 1 0 5 2 4 B O E D I V P P L m m 0 0 5 1 A C R E L B A C 1 1 1 0 0 5 1 7 0 8 2 4 B m m 0 0 8 1 A C R O T K C A J I N I M E L B A C 2 1 1 0 0 0 1 9 1 8 2 4 B M 8 1 B U S D E P Y T A B S U O T P 8 N I D I N I M E L B A C Y O S U R A C 3 1 1 5 0 1 0 0 3 5 2 4 B K C A L B 5 C 3 M 8 1 P 5 1 A G V E L B A C 4 1 2 0 0 1 0 4 3 8 5 4 A 5 3 7 o r P z E L E B A L...

Страница 16: ... 6 8 5 3 A 7 5 7 P E 7 5 7 P E A M O T P O E T A L P E M A N L E B A L 3 1 0 0 7 0 6 3 8 1 5 A 5 5 7 o r P z E A 1 2 T C L Y R O N R E V O C P M A L M T B 4 1 0 0 6 3 6 3 8 1 5 A 5 5 7 o r P z E R E V O C P M A L R O F R O T A L U S N I 5 1 0 0 1 1 5 0 8 1 6 A K C A L B 4 8 3 M H C E M N A P W E R C S 6 1 0 0 3 1 5 6 8 0 7 A 7 5 7 P E E L U D O M G N I S U O H M O T T O B Y S S A 7 3 0 0 6 1 6 3 8...

Страница 17: ...A C P K C A B T E N C I T S A L P 7 1 0 0 9 3 6 3 8 1 5 A 5 5 7 o r P z E R O T A L U S N I T H G I L D A P Y E K 8 1 0 0 6 0 6 3 8 2 5 A 5 5 7 o r P z E T F E L R O T A L U S N I R E B B U R R E K A E P S 9 1 0 0 7 0 6 3 8 2 5 A 5 5 7 o r P z E T H G I R R O T A L U S N I R E B B U R R E K A E P S 0 1 1 0 0 8 0 6 3 8 2 5 A 5 5 7 o r P z E t 0 1 5 5 M S R O T A L U S N I D R A O B D M D 1 1 1 0 0 ...

Страница 18: ...damental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 3 2 2 Bottom Housing Module ...

Страница 19: ...o r P z E C P R E V O C T C E T O R P E D I S 0 1 1 0 0 9 2 0 0 0 1 6 i N 8 D 5 3 M h c e M n a P w e r c S 1 1 1 0 0 7 2 9 1 8 1 6 A O S U R A C n Z R E H S A W 2 1 1 0 0 5 1 6 3 8 1 6 A 5 5 7 o r P z E R E P P O C m m 8 5 L R E C A P S X E H 3 1 1 0 0 4 2 6 3 8 1 6 B 5 5 7 o r P z E t 8 0 C C E S T E K C A R B T E K C O S R E W O P 4 1 1 0 0 1 1 5 6 8 0 7 A 7 5 7 P E E L U D O M R O T C E N N O ...

Страница 20: ... 6 3 8 1 5 B 5 5 7 o r P z E A 9 1 T C S B A C P R E V O C T N O R F 1 1 1 0 0 8 3 6 3 8 1 5 t 5 0 P P R F r o t a l u s n I t h g i L e n i g n E 2 1 1 0 0 3 4 6 3 8 1 5 A 5 5 7 o r P z E t 3 0 P P R F R A L Y M D R A O B R O T C E N N O C 3 1 0 0 4 4 6 3 8 1 5 2 A 5 5 7 P E t 0 5 R E B B U R T R O P P U S D R A O B N I A M 4 1 1 0 0 5 0 6 3 8 2 5 A 5 5 7 o r P z E R E B B U R E N O C I L I S G N...

Страница 21: ...3 6 3 8 1 5 A 5 5 7 o r P z E L Y R O N T N O R F R E D I U G N A F 3 1 0 0 2 4 6 3 8 1 5 A 5 5 7 o r P z E L A E S N A F T E L T U O 4 1 0 0 4 0 6 3 8 2 5 A R A E R R E B B U R 5 5 7 o r P z E K C A L B T O O F 5 2 5 A R A E R R E T S U J D A 5 5 7 o r P Z E K C A L B T O O F 6 1 0 0 6 3 0 0 0 1 6 A N P S G N I R G N I K C O L F L E S F 0 3 7 1 0 0 0 1 6 3 8 1 6 B 5 5 7 o r P z E T E N N O R I 8 ...

Страница 22: ... t I N P v e R n o i t p i r c s e D 1 0 0 1 1 5 6 8 0 7 A 7 5 7 P E E L U D O M R O T C E N N O C 1 1 0 0 4 5 6 3 8 1 5 A 5 5 7 o r P z E A 1 2 T C S B A C P R E V O C V A R O T C E N N O C 2 1 0 0 2 0 0 0 0 1 6 A O I X E H i N 5 7 L 5 H C N U 0 4 4 3 1 0 0 4 0 5 6 8 0 8 A 7 5 7 P E D R A O B V A R O T C E N N O C A B C P 4 0 4 0 G A 5 0 0 5 8 A K O L Y N 5 5 L 4 H C N U 0 4 4 L E E T S O I W E R...

Страница 23: ...nment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Replacement Parts List m e t I N P v e R n o i t p i r c s e D 1 1 0 0 1 0 0 0 0 1 5 A 0 8 J Y G P E I T E L B A C 2 1 0 0 5 6 0 0 0 1 5 d o o g n i P S 2 B A t n u o M d e k c a B e v i s e h d A 3 1 0 0 9 0 6 3 8 0 8 A 0 9 D I 5 5 7 o r P z E D B R O S N E S L A M R E H T A B C P 3 2 6 Thermal Sensor Board ...

Страница 24: ... m e t I N P v e R n o i t p i r c s e D 1 0 0 6 2 6 3 8 0 7 A 5 5 7 o r P z E E L U D O M N A F L A I X A Y S S A 1 1 0 0 2 0 6 3 8 9 4 A m m 5 1 0 5 0 5 A 1 V H P 5 0 2 1 M G N A F S S E L H S U R B C D N O N U S 5 5 7 o r P z E 2 1 0 0 2 1 6 3 8 1 6 B 5 5 7 o r P z E t 8 0 L A T E K C A R B N A F L A I X A 3 0 1 1 0 2 1 A Y 5 8 A i N 1 1 5 4 M P A T T A L F W E R C S 4 1 0 0 9 0 6 3 8 0 8 A 0 9...

Страница 25: ...g Procedure DDC Key In Procedure Appendix Replacement Parts List m e t I N P v e R n o i t p i r c s e D 1 0 0 1 2 6 3 8 0 7 A 5 5 7 o r P z E E L U D O M R E V O C R I T N O R F Y S S A 1 1 0 0 6 1 6 3 8 1 5 A 5 5 7 o r P z E D E R C P T N O R F R E V O C R I 2 1 0 0 7 0 0 6 8 0 8 B S A L L A C D R A O B R O S N E S R I A B C P 3 0 5 0 6 2 1 A W 5 8 A i N 5 6 2 M P A T N A P W E R C S 3 2 8 Front...

Страница 26: ...eplacement Parts List m e t I N P v e R n o i t p i r c s e D 1 0 0 5 1 5 6 8 0 7 A 7 5 7 o r P z E E L U D O M D R A O B L A M R E H T 1 0 0 9 0 6 3 8 2 4 2 A 5 5 7 P E M C 0 2 L m m 5 0 P 6 1 C F F E L B A C 2 1 0 0 6 1 6 3 8 1 6 L A t 8 0 d r a o B l a m r e h T t e k c a r B 3 1 0 0 5 1 5 6 8 0 7 A 7 5 7 o r P z E E L U D O M D R A O B L A M R E H T 4 0 5 0 3 2 3 A 0 5 8 A 5 5 7 o r P z E K C ...

Страница 27: ...ndix 3 2 10 Back IR Cover Module Replacement Parts List m e t I N P v e R n o i t p i r c s e D 1 0 0 0 2 6 3 8 0 7 A 5 5 7 o r P z E E L U D O M R E V O C R I K C A B Y S S A 1 1 0 0 1 1 6 3 8 1 5 B 5 5 7 o r P z E D E R C P K C A B R E V O C R I 2 1 0 0 7 0 0 6 8 0 8 B S A L L A C D R A O B R O S N E S R I A B C P 3 0 5 0 6 2 1 A W 5 8 A i N 5 6 2 M P A T N A P W E R C S 4 9 4 6 3 8 1 5 3 0 0 A ...

Страница 28: ...R E S U M C 1 0 0 5 0 5 6 8 6 3 A 7 5 7 o r P z E L A U G N I L I T L U M D R A C T R A T S K C I U Q M C 2 0 0 0 1 1 0 5 2 4 B O E D I V P P L m m 0 0 5 1 A C R E L B A C M C 1 0 0 5 1 1 0 5 2 4 B 4 1 S I 0 3 P S m m 0 3 8 1 D R O C R E W O P E L B A C M C 1 1 0 9 0 2 0 5 2 4 B 0 0 6 o r P z E M 2 S H V S E L B A C M C 1 5 0 1 0 0 3 5 2 4 B K C A L B 5 C 3 M 8 1 P 5 1 A G V E L B A C M C 2 0 0 0 ...

Страница 29: ...8 0 8 G 6 5 H D R A O B D N E T N O R F A B C P W S 1 1 0 1 0 5 6 8 0 8 C 7 5 7 P E D R A O B D M D A B C P W S 1 0 0 5 1 5 6 8 0 7 A 7 5 7 o r P z E E L U D O M D R A O B L A M R E H T W S 1 1 0 3 0 6 3 8 5 7 B 0 0 P 0 0 2 C U E S P I L I H P W 0 0 2 T S A L L A B P M A L Y S S A W S 3 0 0 6 0 6 3 8 5 7 A 5 5 7 P E E L U D O M R O T A V E L E Y S S A Y U B M C 1 0 0 7 0 6 3 8 5 7 A 5 5 7 o r P z ...

Страница 30: ... T T A L F W E R C S M C 5 2 0 1 2 1 A Y 5 8 A i N 5 2 7 1 M P A T D A E H T A L F W E R C S M C 3 0 0 6 1 6 3 8 0 7 A S P I L I H P R O F 5 5 7 P E G N I S U O H P O T Y S S A W S 1 0 0 4 2 5 6 8 0 7 A 7 5 7 P E B 7 1 T C G S H M T B Y L N O Y S S A W S Note SW Swap Spare Parts CM Consume Spare Parts You can place an order for swap or consume spare parts to do replacement Or just return swap spar...

Страница 31: ...cedure Appendix This section provides disassembly procedures for EP757 Micro Portable XGA DLP Projector Before you begin any of these procedures be sure to turn off the power computer system and other attached devices then disconnect the power cable from the electronically outlet Moreover when you disassemble the projector be sure to put the screws in a safe place and separate them according to gr...

Страница 32: ...n Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Tools Needed Hex Sleeves 5mm Top Screw Bit 102 Screw Bit 107 Angle Cutting Nipper Left Long Nose Nipper Right ...

Страница 33: ...ocedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 4 1 Disassemble Top Cover Module Keypad Board and Speaker 1 Remove three screws and one long screw from Bottom Housing 2 Remove four screws beside Top Housing 3 Lift up Top Housing and unplug three wires to Thermal Board IR Cover Module and Speaker Board Bottom Housing Top Housing IR Cover Module Speaker Board Keypad Board ...

Страница 34: ...e of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 4 Unscrew one screw to remove Speaker Board Unscrew four screws to remove IR Cover Module Vent Speaker Board IR Cover Module Vent ...

Страница 35: ...on Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Keypad Board Speaker Speaker Rubber Left Speaker Rubber Right 5 Tear off Keypad Light Insulator then remove four screws of Keypad Board and tear off 3M Tape then unscrew two screws of Speaker Holders to remove speaker Tape 3M J350 17 60mm Keypad Light Insulator Speaker Holder ...

Страница 36: ...ment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 4 2 Disassemble AV Module and Connector Board 1 Turn over Bottom Housing and remove four screws from Bottom Housing 2 Unscrew two screws of Label Connector Module to remove Label Connector Module and remove two screws from Connector Cover Clamp Take off Side Vent Connector Cover Clamp Bottom Housing Side Vent ...

Страница 37: ...n of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Connector Board Label Connector Module 3 Remove two screws and four long screws from Label Connector Module 4 Unscrew four screws of Connector Board to remove it Connector Board ...

Страница 38: ...tion Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Lamp Housing 3M Tape Lamp Ballast 4 3 Disassemble Lamp Ballast and Power Supply 1 Remove two screws from Lamp Housing Unplug one wire to Lamp 2 Tear of 3M Tape unplug three wires and unscrew four screws of Ballast Bracket to remove Ballast Module Ballast Bracket Insulator ...

Страница 39: ...ifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Power Supply Insulator Power Socket Bracket 3 Remove two screws from Power Socket Bracket and take off it 4 Loosen one screw of Power supply from grounding 5 Unscrew four hex screws of Power Supply to remove it ...

Страница 40: ...s Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 4 4 Disassemble Lamp Module and Thermal Board 1 Turn over Bottom Housing and loosen two screws of Lamp Cover from Bottom Housing and take off Lamp Cover 2 Loosen three screws of Lamp to remove Lamp Bottom Housing Lamp Lamp Cover ...

Страница 41: ...ment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Engine Module Fan 3 Unplug seven cables from Thermal Board 4 Remove one screw from Thermal Sensor Board Unscrew one screw and one hex screw to remove Thermal Board The one hex screw is under one screw of Thermal Sensor Board 5 Unscrew three screws of Fan to remove Fan Thermal Board Thermal Sensor Board Bracket ...

Страница 42: ...Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 1 Remove two screws from Fan Module and take off it 2 Unscrew four screws and one long screw of Engine Module 3 Unscrew two screws to remove Fan Module 4 5 Disassemble Fan Module and Front End Board Fan ...

Страница 43: ...anical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 4 Unscrew two screws to remove Front End Board from Engine Front End Board ...

Страница 44: ...of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 1 Unscrew one hex screw from Engine Module 2 Unscrew three screws to remove Fan from Engine Module 3 Unscrew one screw to remove Fan 4 6 Disassemble Formatter Board Fan Engine Module ...

Страница 45: ...of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Engine Module Safe Switch Formatter Board Heat Sink 4 Unscrew two screws to remove Heat Sink 5 Unscrew four screws to remove Formatter Board 6 Unscrew two screws to remove Safe Switch ...

Страница 46: ...l Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Engine Module 4 7 Disassemble Engine Module ...

Страница 47: ...ntroduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix ...

Страница 48: ...n of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix This section provides each connector location on boards signal and function of each board They will be useful for your detecting the defective boards Function Of Boards 5 5 5 5 5 ...

Страница 49: ...The Location of Connector IR1 J7 J6 J6 JP2 JP1 J5 J3 5 1 2 J8 To Video n i P e m a N l a n g i S n o i t c n u F 1 D N G d n u o r G 2 D N G d n u o r G 3 O I D U A t u p n I t f e L o i d u A 4 O I D U A t u p n I t h g i R o i d u A 5 D N G d n u o r G n i P e m a N l a n g i S n o i t c n u F 6 D N G d n u o r G 7 P M O C t u p n I o e d i V e t i s o p m o C 8 A M U L t u p n I l a n g i S e c...

Страница 50: ... t n o C d a P y a K n i P e m a N l a n g i S n o i t c n u F 1 1 N A F V 2 1 n a F V 2 1 2 1 N A F V 2 1 n a F V 2 1 3 1 D N G d n u o r G 4 1 0 S D K c n y S l o r t n o C d a p y e K 5 1 1 S D K c n y S l o r t n o C d a p y e K 6 1 2 S D K c n y S l o r t n o C d a p y e K 7 1 3 S D K c n y S l o r t n o C d a p y e K 8 1 D N G d n u o r G 9 1 1 R D K c n y S l o r t n o C d a p y e K 0 2 2 R...

Страница 51: ...i L p m a L 4 E D O M O C E y t p m E 5 D O O G R W P c n y S d o o G r e w o P 6 D N G d n u o r G 7 D N G d n u o r G 8 I D V 5 I D V 5 9 I D V 5 I D V 5 0 1 D N G d n u o r G 1 1 D N G d n u o r G 2 1 D A V 5 D A V 5 n i P e m a N l a n g i S n o i t c n u F 3 1 I V 3 3 I V 3 3 4 1 D N G d n u o r G 5 1 I V 3 3 I V 3 3 6 1 I V 3 3 I V 3 3 7 1 D N G d n u o r G 8 1 D N G d n u o r G 9 1 I V 2 1 ...

Страница 52: ...2 X R t u p n I c n y S l a t i g i D I V D 7 2 2 X R t u p n I c n y S l a t i g i D I V D 8 2 D N G d n u o r G 9 2 1 X R t u p n I c n y S l a t i g i D I V D 0 3 1 X R t u p n I c n y S l a t i g i D I V D n i P e m a N l a n g i S n o i t c n u F 1 3 D A V 5 D A V 5 2 3 D N G d n u o r G 3 3 D X T M c n y S 2 3 2 S R 4 3 D X R M c n y S 2 3 2 S R 5 3 S T R c n y S 2 3 2 S R 6 3 D N G d n u o ...

Страница 53: ... o r G 8 1 I D V 5 I D V 5 9 1 I V 3 3 I V 3 3 0 2 D N G d n u o r G 1 2 D N G d n u o r G 2 2 I D V 5 I D V 5 3 2 I V 3 3 I V 3 3 4 2 D N G d n u o r G 5 2 D N G d n u o r G n i P e m a N l a n g i S n o i t c n u F 6 2 I D V 5 I D V 5 7 2 I V 3 3 I V 3 3 8 2 D N G d n u o r G 9 2 D N G d n u o r G 0 3 I D V 5 I D V 5 1 3 D N G d n u o r G 2 3 D N G d n u o r G 3 3 D N G d n u o r G 4 3 D N G d n...

Страница 54: ... D e u l B 6 6 2 D B a t a D e u l B 7 6 3 D B a t a D e u l B 8 6 D N G d n u o r G 9 6 D N G d n u o r G 0 7 4 D B a t a D e u l B 1 7 5 D B a t a D e u l B 2 7 6 D B a t a D e u l B 3 7 7 D B a t a D e u l B 4 7 D N G d n u o r G 5 7 D N G d n u o r G n i P e m a N l a n g i S n o i t c n u F 6 7 0 D R a t a D d e R 7 7 1 D R a t a D d e R 8 7 2 D R a t a D d e R 9 7 3 D R a t a D d e R 0 8 D N...

Страница 55: ...Mechanical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 5 2 Formatter Board 5 2 1 The Location of Connector J503 J502 JP6 ...

Страница 56: ... V 5 9 1 I V 3 3 I V 3 3 0 2 D N G d n u o r G 1 2 D N G d n u o r G 2 2 I V 5 I V 5 3 2 I V 3 3 I V 3 3 4 2 D N G d n u o r G 5 2 D N G d n u o r G n i P e m a N l a n g i S n o i t c n u F 6 2 I V 5 I V 5 7 2 I V 3 3 I V 3 3 8 2 D N G d n u o r G 9 2 D N G d n u o r G 0 3 I V 5 I V 5 1 3 D N G d n u o r G 2 3 D N G d n u o r G 3 3 D N G d n u o r G 4 3 D N G d n u o r G 5 3 D N G d n u o r G 6 3...

Страница 57: ... a t a D e u l B 6 6 2 U B a t a D e u l B 7 6 3 U B a t a D e u l B 8 6 D N G d n u o r G 9 6 D N G d n u o r G 0 7 4 U B a t a D e u l B 1 7 5 U B a t a D e u l B 2 7 6 U B a t a D e u l B 3 7 7 U B a t a D e u l B 4 7 D N G d n u o r G 5 7 D N G d n u o r G n i P e m a N l a n g i S n o i t c n u F 6 7 0 V R a t a D d e R 7 7 1 V R a t a D d e R 8 7 2 V R a t a D d e R 9 7 3 V R a t a D d e R 0...

Страница 58: ... n g i S n o i t c n u F 1 R T C W C l a n g i S e v i r D r o t o M l e e h W r o l o C 2 C 1 C W C l a n g i S e v i r D r o t o M l e e h W r o l o C 5 2 4 J503 n i P e m a N l a n g i S n o i t c n u F 1 D N G d n u o r G 2 V 3 P 3 P V 3 3 n i P e m a N l a n g i S n o i t c n u F 3 C 2 C W C l a n g i S e v i r D r o t o M l e e h W r o l o C 4 C 3 C W C l a n g i S e v i r D r o t o M l e e ...

Страница 59: ... Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 5 3 Thermal Board 5 3 1 The Location of Connector J1 J2 J3 J10 J4 J5 J8 J7 5 3 2 J1 n i P e m a N l a n g i S n o i t c n u F 1 R E W O P _ N A F r e w o P 1 n a F 2 1 N A F c n y S t c e t e D 1 n a F n i P e m a N l a n g i S n o i t c n u F 3 D N G d n u o r G ...

Страница 60: ... N l a n g i S n o i t c n u F 1 R E W O P _ N A F r e w o P 3 n a F 2 3 N A F c n y S t c e t e D 3 n a F 5 3 5 J10 n i P e m a N l a n g i S n o i t c n u F 1 R E W O P _ N A F r e w o P 4 n a F 2 4 N A F c n y S t c e t e D 4 n a F 5 3 6 J4 n i P e m a N l a n g i S n o i t c n u F 1 D A V 5 V 5 2 D N G d n u o r G n i P e m a N l a n g i S n o i t c n u F 3 D N G d n u o r G n i P e m a N l a ...

Страница 61: ...O c n y S r o r r E 5 Y B D N A T S c n y S y b d n a t S 6 N O _ R I l o r t n o C y b d n a t S l o r t n o C e t o m e R 7 B T S c n y S y b d n a t S 8 S S I M P M A L c n y S k c a b d e e F t h g i L s s i M p m a L 9 D N G d n u o r G 0 1 0 R D K c n y S d a p y e K n i P e m a N l a n g i S n o i t c n u F 3 A D S a t a D l a i r e S 4 L C S k c o l C l a i r e S n i P e m a N l a n g i S ...

Страница 62: ...ple Mechanical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 5 4 Data Connector Board 5 4 1 The Location of Connector J2 ...

Страница 63: ...n u o r G 6 2 2 X R t u p n I c n y S l a t i g i D I V D 7 2 2 X R t u p n I c n y S l a t i g i D I V D 8 2 D N G d n u o r G 9 2 1 X R t u p n I c n y S l a t i g i D I V D 0 3 1 X R t u p n I c n y S l a t i g i D I V D n i P e m a N l a n g i S n o i t c n u F 1 3 D A V 5 V 5 2 3 D N G d n u o r G 3 3 D X T M c n y S 2 3 2 S R 4 3 D X R M c n y S 2 3 2 S R 5 3 S T R c n y S 2 3 2 S R 6 3 D N ...

Страница 64: ...of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix This chapter provides DMD Lamp Lamp Driver and DC DC specifications All specifications are for your reference Specifications 6 6 6 6 6 ...

Страница 65: ... 1 s e e r g e D t f e l r e w o l o t t h g i r r e p p u n o i t a t o r f o s i x A 4 4 5 4 6 4 s e e r g e D y a r r a r o r r i m l a t o t r e v o t n e i d a r g s s e n t a l F 1 0 n g i s e d y b r o t c a f l l i f a e r a e v i t c A 2 5 8 m n 0 0 7 0 2 4 y t i v i t c e l f e r r a l u c e p s l a t e m r o r r i M 4 9 8 A e p y T n o i t a n g i s e d l a i r e t a m w o d n i W g n i...

Страница 66: ...thout electronic duty cycle effects i e measure using 100 duty cycle The specified specular reflectivity applies to any arbitrary point on the DMD active area Note 3 Window Transmittance Angle of incidence 0o 45o at 42 680nm Double pass system Two AR coating surfaces at 0 5 reflectivity per AR coating Note 4 Thermal Performance The DMD is designed to conduct absorbed and dissipated heat to the bac...

Страница 67: ... r k c a b d a e R 5 0 5 4 C D V T S R B M e g a t l o V t u p n I 8 2 8 2 V s t u p n i r e h t o e g a t l o V t u p n I 5 0 5 4 C D V t n e r r u c t u p t u o t i u c r i c t r o h S 5 2 A m 3 2 1 s t n i o p d n a y a r r a r o f e r u t a r e p m e t g n i t a r e p O 0 5 6 o C e c n e r e f e r e h t f o o w t y n a e r u t a r e p m e t l a i t n e r e f f i D 3 2 1 s t n i o p 5 1 o C e r...

Страница 68: ...troduction Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix ...

Страница 69: ...t and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix This chapter provides technicians and people who have an electronic back ground a primary description about maintaining the product Moreover you can get the appropriate operation to solve some complicated problems of component repairing and professional problems Troubleshooting 7 7 7 7 7 ...

Страница 70: ...n Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 7 1 Equipment Needed EP757 Projector VESA M1 to VGA Cable PC Personal Computer Audio Input Video Input Screw Drivers 7 2 Main Procedure Connect Power cord analog or digital signal and audio signal then turn power on Start Is Lamp light on A Power Troubleshooting Yes No Continue ...

Страница 71: ...oubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix C Function Troubleshooting Is function OK No Is Image OK B Image Performance Troubleshooting Yes No Yes No Fault Found Is Audio OK Is Remote Control OK D Audio Troubleshooting E Remote Control Troubleshooting End Continue No Yes No Yes ...

Страница 72: ...oting Is LED indicator OK Lamp Replacement Cover assembly OK Reassembly lamp Replacement Cover Start Is Fan working No Yes No No Yes Yes Yes Is Lamp lit No Yes End Check power cord input power voltage Supply AC Power Change DC DC No Change Thermal BD Change Ballast Change DC DC No Change Main BD Change Ballast No No Change Fan Module Can hear the sound of lamp ignition No No Change Thermal BD No C...

Страница 73: ...cedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 7 2 2 B Performance Troubleshooting Start Have image Uniformity OK Is color OK Have garbage pattern No Change M B No Change DMD Board Yes No Change DMD Board No Change Engine Module Change DMD Board Yes No Yes Yes No No Color Adjust Procedure Note 1 Change M B Continue No Change DMD CHIP Change Photo Sensor No Change M B No ...

Страница 74: ...tions Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Have line bar Dot defect isn t compliant with the spec Yes Change DMD CHIP Yes Adjust frequency Yes No Yes Adjust tracking No No Change M B No Change M B Have noise End No Continue No Change DMD Board No Change DMD CHIP ...

Страница 75: ...Press Up Up Left button when the No Signal show on the screen 2 Choose Display Source 3 Choose Color Wheel Index 4 Press Left or Right button to adjust 4Note 1 It may need to be used when you replace Main Board or Optical Engine alone 7 2 3 C Function Troubleshooting Does OSD show up Start Is KeyPad Board OK No Yes Is Remote Controller OK Yes Change Main Board Change Key Pad Board Can function be ...

Страница 76: ...Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 7 2 4 D Audio Troubleshooting Can hear sound Start Sound is clear without noise Yes Yes Change Speaker Change Main Board End Change Spearker Change M B No No No No ...

Страница 77: ...embly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix 7 2 5 E Remote Control Troubleshooting Start End Replace the battery No Change Remote Controller Yes No Change IR Board No Change Main Board Yes Yes Yes ...

Страница 78: ...ons Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix This chapter provides equipment conditions patterns and procedure needed for Function Test and Alignment It also includes compatible modes All information is for your reference Function Test and Alignment Procedure 8 8 8 8 8 ...

Страница 79: ...tance Brightness Dark room less than 60 lux Inspection Distance 2 0m Screen Size 60 inches diagonal wide Before function test and alignment each H50 should be run in and warmed up for at least 30 minutes with following conditions 1 In room temperature 2 With cycled display colors R G B White 3 With cycled display modes 640 x 350 H 31 5 KHz V 70 Hz 640 x 400 H 31 5 KHz V 70 Hz 640 x 480 H 37 5 KHz ...

Страница 80: ... V 0 0 4 x 0 2 7 5 8 9 7 3 A G V 0 0 6 x 0 0 8 6 5 2 5 3 A G V S 0 0 6 x 0 0 8 0 6 9 7 3 A G V S 0 0 6 x 0 0 8 2 7 1 8 4 A G V S 0 0 6 x 0 0 8 5 7 9 6 4 A G V S 0 0 6 x 0 0 8 5 8 7 3 5 A G V S 8 6 7 x 4 2 0 1 4 3 4 5 5 3 A G X 8 6 7 x 4 2 0 1 0 6 4 8 4 A G X Analog n o i t u l o s e R z H c n y S V c n y S H z H K y t i l i b i t a p m o C 8 6 7 x 4 2 0 1 0 7 5 6 5 A G X 8 6 7 x 4 2 0 1 5 7 0 0 6 ...

Страница 81: ... A G V 0 5 3 x 0 4 6 5 8 9 7 3 A G V 0 0 4 x 0 4 6 0 7 5 1 3 A G V 0 0 4 x 0 4 6 5 8 9 7 3 A G V 0 8 4 x 0 4 6 0 6 5 1 3 A G V 0 8 4 x 0 4 6 2 7 9 7 3 A G V 0 8 4 x 0 4 6 5 7 5 7 3 A G V 0 8 4 x 0 4 6 5 8 3 3 4 A G V 0 0 4 x 0 2 7 0 7 5 1 3 A G V 0 0 4 x 0 2 7 5 8 9 7 3 A G V 0 0 6 x 0 0 8 6 5 2 5 3 A G V S 0 0 6 x 0 0 8 0 6 9 7 3 A G V S 0 0 6 x 0 0 8 2 7 1 8 4 A G V S 0 0 6 x 0 0 8 5 7 9 6 4 A G...

Страница 82: ...s i u g n i t s i d e b d l u o h s s l e v e l y a r G 2 e r u g i F 3 e t i h W d n a B G R e c n a m r o f r e P r o l o C d n a B G R r o l o C e t i h W l a m r o n e b d l u o h s r o l o c B G R h c a E Fi e r u g 6 3 4 y t i m r o f i n U n e e r c S r e k c i l F e t i h W l l u F c e p s e h t h t i w t n a i l p m o c e b d l u o h S Fi e r u g 6 5 l e x i P h s i m e l B d a e D e t i ...

Страница 83: ... Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Fine Line Morie Pattern Figure 1 Contrast Brightness Figure 2 R Color Pattern Figure 3 G Color Pattern Figure 4 ...

Страница 84: ...sembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix B Color Pattern Figure 5 Full White Pattern Figure 6 Dark Pattern Figure 7 Gary 30 Pattern Figure 8 Blue 180 Pattern Figure 9 Boundary Frame Figure 10 ...

Страница 85: ... Test Hi Pot Specification 1 5kVAC 10mA 2 seconds Grounding Specification 12VDC 25A 0 1 ohm Clock and Clock Phase Test Signal 1024 x 768 85Hz Test Pattern Line Moire Pattern Check and see if image sharpness and focus is well performed If not readjust by following steps Enter Digital Conversion menu and select Clock Function to adjust the total pixel num ber of pixel clock in one line period Then s...

Страница 86: ...ad pixels should be complaint with specification Check for Secondary Display Modes Test signal 1 640 x 350 70 85Hz 2 640 x 400 70 85Hz 3 640 x 480 72 75 85Hz 4 720 x 400 70 85Hz 5 800 x 600 56 60 72 75 85Hz 6 1024 x 768 43 4 60 70 75 85Hz 7 1280 x 1024 60 75Hz Normally when the primary mode 1024 x 768 85Hz is well adjusted and complaint with the specification then the secondary display modes will ...

Страница 87: ...n Fundamental Principle Mechanical Construction Procedure of Disassembly Function of Boards Specifications Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key In Procedure Appendix Appendix 9 9 9 9 9 ...

Страница 88: ...EM Product code ex 865 EP757 Y Last number of the year ex 2003 3 Week of year Panel vendor code Electrical classification 1 110V 2 220V 0 universal B BIOS version E PCB board version M Mechanical version O Optical version Serial code from 0001 EX A865309T0AAAA1001 This label A865309T0AAAA1001 represents the whole serial number for EP757 including Ver 1st of BIOS and Ver 1 of PCB Board Both mechani...

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