EVBUM2769/D
11
Table 5. BILL OF MATERIALS FOR THE MAIN BOARD OF LC786830 DEMO BOARD KIT
Designator
Value
MFR
MFG P/N
Description
IC101
ON Semiconductor
LC786830W
IC102
ON Semiconductor
CAT24C256WI
−
GT3
IC103
Winbond
W25Q16JVSSIQ
For your application
software.
IC104
Winbond
W25Q32JVSSIQ
Don’t overwrite.
IC105
IPUS
IPS6404L
−
SQ
−
SPN
Not mounted, PSRAM
IC106
ON Semiconductor
NCP380HSNAJAAT1G
IC107
ON Semiconductor
74FST3257DR2G
IC201
nFore
NF2210EZ (2.4 GHz, Stamp
−
40)
Bluetooth module on
Board
IC501, IC502, IC503, IC505
ON Semiconductor
NCP59302DSADJR4G
IC504
Rohm
BD12IC0MEFJ
−
ME2
IC601, IC602, IC603
TI
PCM5142PWR
IC604, IC605, IC606, IC607,
IC608, IC609
ON Semiconductor
NLASB3157DFT2G
IC610
TI
OPA344NA/250
X101
NDK
NX3215SA
−
32.768 kHz
−
STD
−
MUS
−
2
X102
NDK
NX3225GA
−
24.000 MHz
−
STD
−
CRG
−
2
D191
ON Semiconductor
1N5819
Schottky Diode, 40 V, 1 A
D101, D192, D211
Sanyo
GMA01U
−
BT
D212
−
−
Not mounted, LED
R101, R102, R103, R118,
R119, R120, R121, R122,
R123, R158, R213, R214,
R215, R216, R224, R230,
R231, R461, R462, R463,
R500, R501, R502, R504,
R505, R506, R517, R518,
R527, R528, R529, R537,
R541, R553, R557, R608,
R628, R648, R666, R667,
R681, R682, R684, R685,
R686, R687, R821, R862,
R864, R870, C218
0
W
Rohm
MCR03EZPJ000
R106, R111
22
W
Rohm
MCR03EZPJ220
R171, R172, R173, R174,
R175, R176, R177, R178,
R179, R180, R181, R182
47
W
Rohm
MCR03EZPJ470
R167, R168, R191, R470,
R471, R472, R473, R474
100
W
Rohm
MCR03EZPJ101
R113, R226, R227, R228,
R229
220
W
Rohm
MCR03EZPJ221
R602, R603, R622, R623,
R642, R643
470
W
Rohm
MCR03EZPJ471
R673, R674, R677, R678,
R680
680
W
Rohm
MCR03EZPJ681
R108, R110, R115, R135,
R136, R225, R662
1.0 k
W
Rohm
MCR03EZPJ102
R515, R525
1.2 k
W
Rohm
MCR03EZPJ122
R117
1.5 k
W
Rohm
MCR03EZPJ152
R217, R555
1.8 k
W
Rohm
MCR03EZPJ182
R133, R134, R161, R162,
R533, R112, R116, R155,
R156, R157, R661
2.2 k
W
Rohm
MCR03EZPJ222