QSOP24 NB
CASE 492B
−
01
ISSUE A
DATE 06 MAY 2008
SCALE 2:1
E
M
0.25
C
A1
A
C
DETAIL A
DETAIL A
h x 45
_
DIM
MAX
MIN
MILLIMETERS
A
1.35
1.75
b
0.20
0.30
L
0.40
1.27
e
0.635 BSC
h
0.22
0.50
C
0.19
0.25
A1
0.10
0.25
M
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT EX
CEED 0.15 PER SIDE. DIMENSION E1 DOES NOT
INCLUDE INTERLEAD FLASH OR PROTRUSION. IN
TERLEAD FLASH OR PROTRUSION SHALL NOT EX
CEED 0.15 PER SIDE. D AND E1 ARE DETERMINED
AT DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
_
_
b
L
6.40
24X
0.42
24X
1.12
0.635
DIMENSIONS: MILLIMETERS
24
PITCH
SOLDERING FOOTPRINT
13
1
12
D
D
24X
SEATING
PLANE
0.10 C
E1
A
A-B D
0.20 C
e
1
12
24
13
24X
C
M
xxx
= Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
Y
= Year
WW
= Work Week
xxxxxxxxx
AWLYWW
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb
−
Free indicator, “G”, may
or not be present.
D
8.65 BSC
E
6.00 BSC
E1
3.90 BSC
L2
0.25 BSC
D
0.25 C D
B
0.20 C D
2X
2X
2X 12 TIPS
0.10 C
H
L2
GAUGE
PLANE
C
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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DOCUMENT NUMBER:
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PAGE 1 OF 1
QSOP24 NB
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