3.11
REPLACEMENT OF THE I/O BOARD (BACK)
Before disassembling the I/O board located on the back, the cover of the base module must be removed as
described above.
To remove the board I/O (back), proceed as follows:
•
Disconnect all the connections present on the board.
•
Remove the twelve hex screws
A
.
•
Back off the four screws
B
and remove the board.
A
A
A
Figure
3-27
DISCONNECT
DISCONNECT
DISCONNECT
A
A
A
B
B
B
B
Figure 3-28
•
For re-assembly, reverse the above operations.
3-16
XZAC3273
Содержание Explora 200
Страница 1: ...Web Cash Explor 200 300 SERVICE MANUAL Code XZAC3273...
Страница 6: ...VI XZAC3273...
Страница 10: ...1 4 XZAC3273 IDE1 2 1 2 3 System View of the inside Figure 1 8 FAN HEAT SINK CPU RAM MOTHER BOARD...
Страница 44: ...Figure 2 16 TEST KEYBOARD TEST BADGE READER Figure 2 17 XZAC3273 Service Manual 2 11...
Страница 49: ...2 16 XZAC3273...
Страница 62: ...C Explor 300 Figure 3 22 C C C C C C For re assembly reverse the above operations XZAC3273 Service Manual 3 13...
Страница 72: ...Explor 300 Figure 3 41 D E E E C D E XZAC3273 Service Manual 3 23...
Страница 76: ...Remove the LCD panel G G Figure 3 48 For re assembly reverse the above operations XZAC3273 Service Manual 3 27...
Страница 82: ...UPDATING STATUS DATE UPDATED PAGES PAGES CODE 6 2006 1st EDITION 82 XZAC3273...
