AN10365_3
© NXP B.V. 2008. All rights reserved.
Application note
Rev. 03 — 22 April 2008
4 of 24
NXP Semiconductors
AN10365
Surface mount reflow soldering description
Examples of other issues in board quality are tolerances on the pad and solder resist
dimensions and component placement, maximum board dimensions, and flatness.
A footprint design describes the recommended dimensions of the solder lands on the
PCB, to make reliable solder joints between the IC package and the PCB. The PCB
footprints of NXP Semiconductors packages can be found by clicking ‘Package
Information’ on the ‘Product Information’ page of the NXP Semiconductors web site at the
URL given in “Contact information” at the bottom of page 2. The unique identifier for the
PCB footprint is the NXP package outline code (the package SOT number). The next
paragraph explains how to read the PCB footprint.
shows an example of a PCB
footprint, as found on the NXP Semiconductors web site.