Baseband Troubleshooting Instructions
CCS Technical Documentation
Page 34
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Nokia Corporation
Issue 1 10/02
General instructions
Most semiconductors are static discharge sensitive! ESD protection must be taken care
of during repair (ground straps and ESD soldering irons). HAGAR, PA, UEM, UPP, and Flash
are moisture sensitive and must be pre-baked prior to soldering, if they have been out of
their vacuum package longer than the specified time.
• Connect test jig to computer with DAU-9S cable or to FPS-8 Flash Prommer with
AXS-4 serial cable.
• Make sure that you have PKD-1 dongle connected to computer’s parallel port.
• Connect DC power supply to module test jig with FLC-2 cable.
• Set the DC supply voltage to 3.9 V and set the module test jig (MJS-46) jumper
connector to ”bypass” position. VBAT must not exceed 5.15 V to avoid damaging
the power amplifier (PA), if PA is active.
•MJS-46’s current consumption is ~ 9 mA. Note that MJS-46 is not protected
against reverse voltage and there is a 2 A fuse which may blow if the phone
is short-circuited.
• When doing BB energy management (EM) calibrations use JBV-1 jig and DC sup-
ply voltage 12 – 15 V.
•JBV-1’s current consumption is ~ 40 mA with 3.9 V supply voltage and ~ 80
mA with 15 V supply voltage.
• Set the phone module to test jig and start Phoenix service software. Initialize
connection to phone (use FBUS driver when using DAU-9S and COMBOX driver
when using FPS-8).
Note! If a “No power” problem is found, please check the A-cover fit. For more information see sec-
tion Assembly & Disassembly Instructions of NSM-9DX Service Manual, page 9.
PROGRAMMING FLASH
Fails in Programming Flash -Start:
•
Most probably the phone has not started up properly for flashing.
•
Try flashing with Phoenix (Figure 46).
•
If flashing with Phoenix is not OK, check error code from the Phoenix
window (Figure 47) and check (Table 2: Flash Programming error
codes) for what is not working properly.
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