Nexperia
AN10343
MicroPak soldering information
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT1049-1
- - -
MO-255
- - -
UNIT
mm
max
nom
min
0.50
0.05
0.03
0.00
1.65
1.55
1.45
2.1
2.0
1.9
0.58
0.5
1.5
0.4
0.3
0.2
0.1
A
DIMENSIONS (mm are the original dimensions)
0
2.5 mm
scale
A
1
b
0.30
0.23
0.15
D
E
e
e
1
e
2
1.16
e
3
L
L
1
0.15
0.08
0.00
v
w
0.05
y
0.1
y
1
0.05
XQFN10U: plastic extremely thin quad flat package; no leads; 10 terminals;
UTLP based; body 2 x 1.55 x 0.5 mm
C
y
C
y
1
X
terminal 1
index area
B
A
D
E
detail X
A
A
1
terminal 1
index area
e
2
e
1
e
3
e
1/2 e
1
A
C
B
v
M
C
w
M
L
1
L
b
1
2
3
4
5
6
7
8
9
10
08-02-28
10-02-05
SOT1049-1
Fig. 20. SOT1049-1 (XQFN10U) package outline
AN10343
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©
Nexperia B.V. 2021. All rights reserved
application note
Rev. 3.0 — 31 May 2021
23 / 32