Nexperia
AN10343
MicroPak soldering information
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT902-1
MO-255
- - -
- - -
SOT902-1
05-11-25
07-11-14
UNIT
A
max
mm
0.5
A
1
0.25
0.15
0.05
0.00
1.65
1.55
0.35
0.25
0.15
0.05
DIMENSIONS (mm are the original dimensions)
XQFN8U: plastic extremely thin quad flat package; no leads;
8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm
b
D
L
e
1
1.65
1.55
e
E
L
1
v
0.1
0.55
0.5
w
0.05
y
0.05
0.05
y
1
0
1
2 mm
scale
X
C
y
C
y
1
terminal 1
index area
terminal 1
index area
B A
D
E
detail X
A
A
1
b
8
7
6
5
e
1
e
1
e
e
A
C
B
∅
v
M
C
∅
w
M
4
1
2
3
L
L
1
metal area
not for soldering
Fig. 14. SOT902-1 (XQFN8U) package outline
AN10343
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©
Nexperia B.V. 2021. All rights reserved
application note
Rev. 3.0 — 31 May 2021
17 / 32