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AN10343

MicroPak soldering information

Rev. 3.0 — 31 May 2021

application note

Document information

Information

Content

Keywords

MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale Package (WLCSP)

Abstract

This application note describes evaluation of recommended solder land patterns for mounting

MicroPak packages.

Содержание AN10343

Страница 1: ...application note Document information Information Content Keywords MicroPak footprint Ball Grid Array BGA Wafer Level Chip Scale Package WLCSP Abstract This application note describes evaluation of recommended solder land patterns for mounting MicroPak packages ...

Страница 2: ...ems such as cellular phones pagers and portable consumer products CD players VCRs cameras hard disks notebook computers PC cards CD ROMs and Personal Digital Assistants PDAs They can also be used as simple glue repair logic to implement last minute design changes or to eliminate dependence on intricate line layout patterns and to simplify routing This application note describes the following mount...

Страница 3: ...OT1116 019aab125 SOT1116 0 35 0 5 0 35 SOT891 SOT1202 019aab126 SOT891 SOT1202 SOT1089 SOT1203 019aab127 SOT1089 SOT1203 SOT1081 1 019aab128 SOT1081 0 5 Dual in line 0 5 SOT886 019aab129 SOT886 SOT833 1 019aab130 SOT833 AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 3 32 ...

Страница 4: ...16 0 5 0 5 SOT902 1 019aab131 SOT902 SOT1049 1 019aab132 SOT1049 SOT1039 1 019aab133 SOT1039 0 5 VSSOP8 replacement 0 5 SOT996 2 019aab134 SOT996 AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 4 32 ...

Страница 5: ...ure of around 217 C and requires a reflow temperature of more than 235 C Table 2 Typical solder paste characteristics Solder near eutectic alloys Melting temperature Minimum peak reflow temperature SnPb 183 C 215 C SAC 217 C 235 C A no clean solder paste does not require cleaning after reflow soldering and is therefore preferred provided that this is possible within the process window If a no clea...

Страница 6: ...rough an oven and exposing them to a temperature profile that varies in time A temperature profile essentially consists of three phases 1 Preheat the board is warmed up to a temperature that is lower than the melting point of the solder alloy 2 Reflow the board is heated to a peak temperature that is well above the melting point of the solder but below the temperature at which the components and b...

Страница 7: ... most temperature sensitive component used on the board 1 reflow atmosphere general purpose reflow is under air atmosphere nitrogen reflow is allowed 1 Delta between Tp min and Tp max preferably limited to 10 C Additional soldering information and guidelines for board mounting of surface mount IC packages are described in AN10365 Surface mount reflow soldering description 3 6 MicroPak soldering in...

Страница 8: ... in mm Fig 2 MicroPack footprint 001aac256 0 5 mm solder land pattern package footprint Fig 3 MicroPack SOT886 on BGA footprint 0 5 mm 0 225 mm 001aac257 solder land pattern package footprint Fig 4 BGA on MicroPack footprint 001aan102 0 5 mm solder land pattern package footprint Fig 5 MicroPack SOT833 1 on BGA footprint 3 7 SOT996 2 MicroPak soldering information for VSSOP8 footprint Fig 6 a shows...

Страница 9: ...neral replacing a defective component on a soldered board during repair or rework can be carried out either manually or with a dedicated repair station The rework process should consist of the following steps 1 Dry bake the board and the new component if necessary 2 Mark the position of the old component 3 Remove the old component 4 Prepare the site 5 Print solder paste on the new component 6 Refl...

Страница 10: ...IR GUN DE SOLDER OLD COMPONENT WITH INFRARED PLACE NEW COMPONENT MANUALLY PLACE NEW COMPONENT USING REPAIR STATION DRY BAKE BOARD AND NEW COMPONENT INSPECTION SOLDER NEW COMPONENT WITH HOT AIR GUN SOLDER NEW COMPONENT WITH INFRARED Fig 7 Rework process steps AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev ...

Страница 11: ... SOT833 1 07 11 14 07 12 07 DIMENSIONS mm are the original dimensions XSON8 plastic extremely thin small outline package no leads 8 terminals body 1 x 1 95 x 0 5 mm D E e1 e A1 b L L1 e1 e1 0 1 2 mm scale Notes 1 Including plating thickness 2 Can be visible in some manufacturing processes UNIT mm 0 25 0 17 2 0 1 9 0 35 0 27 A1 max b E 1 05 0 95 D e e1 L 0 40 0 32 L1 0 5 0 6 A 1 max 0 5 0 04 1 8 2 ...

Страница 12: ... oa 2 100 2 150 pa oa 0 300 4 0 125 4 solder land solder paste placement area occupied area Dimensions in mm 0 025 Fig 9 SOT833 1 XSON8 solder footprint AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 12 32 ...

Страница 13: ...otes 1 Including plating thickness 2 Can be visible in some manufacturing processes XSON6 plastic extremely thin small outline package no leads 6 terminals body 1 x 1 45 x 0 5 mm SOT886 A1 b 0 25 0 20 0 17 D E e e1 0 5 L L1 terminal 1 index area D E e1 e A1 b L L1 e1 0 1 2 mm scale 1 6 2 5 3 4 6x 2 4x 2 A Fig 10 SOT886 XSON6 package outline AN10343 All information provided in this document is subj...

Страница 14: ...paste solderland Dimensions in mm 0 425 6 1 250 0 675 1 700 0 325 6 0 270 6 0 370 6 0 500 0 500 Fig 11 SOT886 XSON6 solder footprint AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 14 32 ...

Страница 15: ...5 mm D E e1 e A1 b L L1 e1 0 1 2 mm scale DIMENSIONS mm are the original dimensions UNIT mm 0 20 0 12 1 05 0 95 0 35 0 27 A1 max b E 1 05 0 95 D e e1 L 0 40 0 32 L1 0 35 0 55 A max 0 5 0 04 1 6 2 5 3 4 A 6 1 4 1 Note 1 Can be visible in some manufacturing processes Fig 12 SOT891 XSON6 package outline AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 202...

Страница 16: ...older land plus solder paste Dimensions in mm 0 25 6 0 15 6 0 5 6 0 6 6 0 7 0 35 1 4 1 05 Fig 13 SOT891 XSON6 solder footprint AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 16 32 ...

Страница 17: ... quad flat package no leads 8 terminals UTLP based body 1 6 x 1 6 x 0 5 mm b D L e1 1 65 1 55 e E L1 v 0 1 0 55 0 5 w 0 05 y 0 05 0 05 y1 0 1 2 mm scale X C y C y1 terminal 1 index area terminal 1 index area B A D E detail X A A1 b 8 7 6 5 e1 e1 e e A C B v M C w M 4 1 2 3 L L1 metal area not for soldering Fig 14 SOT902 1 XQFN8U package outline AN10343 All information provided in this document is ...

Страница 18: ...imensions in mm 0 450 8 0 400 8 0 220 7 0 270 8 1 900 1 900 0 110 0 500 1 000 1 200 0 320 0 500 1 200 sot902 1_fr Fig 15 SOT902 1 XQFN8U solder footprint AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 18 32 ...

Страница 19: ...iginal dimensions XSON8 plastic extremely thin small outline package no leads 8 terminals body 3 x 2 x 0 5 mm SOT996 2 A1 b 0 35 0 15 D E e e1 L L1 L2 v 0 1 w y 0 05 y1 0 1 0 1 2 mm scale C y C y1 X terminal 1 index area B A D E detail X A A1 b 1 4 8 5 e1 e A C B v C w L2 L1 L Fig 16 SOT996 2 XSON8U package outline AN10343 All information provided in this document is subject to legal disclaimers N...

Страница 20: ...sions in mm sot996 2_fr 0 025 0 025 0 250 2 000 2 000 4 000 3 400 pa oa 4 250 0 900 2 400 pa oa 0 500 0 500 Fig 17 SOT996 2 XSON8U solder footprint AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 20 32 ...

Страница 21: ...ed extremely thin quad flat package no leads 16 terminals UTLP based body 3 x 3 x 0 5 mm 0 2 5 5 mm scale b D 3 1 2 9 Dh E Eh e e1 1 5 e2 L L1 0 1 0 0 v w 0 05 y 0 05 y1 0 1 C y C y1 X b e2 e1 e e 1 2 e 1 2 e A C B v M C w M terminal 1 index area Dh Eh L1 L 9 8 13 16 12 4 1 5 B A terminal 1 index area D E detail X A1 A Fig 18 SOT1039 1 HXQFN16U package outline AN10343 All information provided in t...

Страница 22: ... 125 around occupied area solder paste deposit 0 02 around copper stencil thickness 0 1 0 0125 0 0125 0 500 0 240 0 500 1 500 2 000 4 250 3 300 pa oa 0 240 0 500 0 500 1 500 2 000 3 300 pa oa 4 250 0 800 0 350 0 800 0 350 1 800 2 300 4 000 1 800 1 500 2 300 4 000 Fig 19 SOT1039 1 HXQFN16U solder footprint AN10343 All information provided in this document is subject to legal disclaimers Nexperia B ...

Страница 23: ... 1 16 e3 L L1 0 15 0 08 0 00 v w 0 05 y 0 1 y1 0 05 XQFN10U plastic extremely thin quad flat package no leads 10 terminals UTLP based body 2 x 1 55 x 0 5 mm C y C y1 X terminal 1 index area B A D E detail X A A1 terminal 1 index area e2 e1 e3 e 1 2 e1 A C B v M C w M L1 L b 1 2 3 4 5 6 7 8 9 10 08 02 28 10 02 05 SOT1049 1 Fig 20 SOT1049 1 XQFN10U package outline AN10343 All information provided in...

Страница 24: ...mm sot1049 1_fr 1 100 0 500 0 500 2 000 2 300 pa oa 3 250 3 000 0 800 2 600 2 850 1 900 pa oa 0 0125 0 0125 0 250 Fig 21 SOT1049 1 XQFN10U solder footprint AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 24 32 ...

Страница 25: ...stic extremely thin small outline package no leads 10 terminals UTLP based body 1 x 1 7 x 0 5 mm A1 b 0 20 0 15 0 10 D E e e1 e2 0 6 L L1 L2 0 45 0 35 0 25 v w 0 05 y 0 05 y1 0 1 0 0 5 1 mm scale C y C y1 B A terminal 1 index area D E detail X A A1 b e2 e1 e A C B v M C w M L L2 L1 1 5 6 10 08 03 28 08 04 18 Fig 22 SOT1081 1 XSON10U package outline AN10343 All information provided in this document...

Страница 26: ... solder land plus solder paste occupied area solder land solder paste deposit solder resist Hx By Hy 0 05 C P D 0 05 Ay Dimensions in mm Ay By C D Hy 1 26 0 26 0 5 0 15 P 0 35 1 4 Hx 1 75 Generic footprint pattern Refer to the package outline drawing for actual layout Fig 23 SOT1081 1 XSON10U solder footprint AN10343 All information provided in this document is subject to legal disclaimers Nexperi...

Страница 27: ...isible depending upon used manufacturing technology XSON8 extremely thin small outline package no leads 8 terminals body 1 35 x 1 x 0 5 mm SOT1089 A1 b L1 0 40 0 35 0 32 0 20 0 15 0 12 D E e e1 L 0 0 5 1 mm scale terminal 1 index area E D detail X A A1 L L1 b e1 e terminal 1 index area 1 4 8 5 4 2 8 2 X Fig 24 SOT1089 XSON8 package outline AN10343 All information provided in this document is subje...

Страница 28: ...7 1 4 1 4 Fig 25 SOT1089 XSON8 solder footprint 6 Revision history Table 7 Revision history Revision number Date Description 3 0 2021 05 31 Document revised to use latest Nexperia branding and legal information 2 0 2010 12 30 text and graphics updated to latest standards AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved applicat...

Страница 29: ... result in personal injury death or severe property or environmental damage Nexperia and its suppliers accept no liability for inclusion and or use of Nexperia products in such equipment or applications and therefore such inclusion and or use is at the customer s own risk Applications Applications that are described herein for any of these products are for illustrative purposes only Nexperia makes...

Страница 30: ...e classification reflow temperatures from J STD 020D 5 Table 4 Typical stencil thicknesses 6 Table 5 Typical placement accuracies 6 Table 6 Explanation of the reflow temperature profile 7 Table 7 Revision history 28 AN10343 All information provided in this document is subject to legal disclaimers Nexperia B V 2021 All rights reserved application note Rev 3 0 31 May 2021 30 32 ...

Страница 31: ... SOT891 XSON6 package outline 15 Fig 13 SOT891 XSON6 solder footprint 16 Fig 14 SOT902 1 XQFN8U package outline 17 Fig 15 SOT902 1 XQFN8U solder footprint 18 Fig 16 SOT996 2 XSON8U package outline 19 Fig 17 SOT996 2 XSON8U solder footprint 20 Fig 18 SOT1039 1 HXQFN16U package outline 21 Fig 19 SOT1039 1 HXQFN16U solder footprint 22 Fig 20 SOT1049 1 XQFN10U package outline 23 Fig 21 SOT1049 1 XQFN1...

Страница 32: ...SOT996 2 MicroPak soldering information for VSSOP8 footprint 8 4 Manual repair of leadless MicroPak 9 5 Package outline and PCB footprint 11 6 Revision history 28 7 Legal information 29 Nexperia B V 2021 All rights reserved For more information please visit http www nexperia com For sales office addresses please send an email to salesaddresses nexperia com Date of release 31 May 2021 AN10343 All i...

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