Copyright © 2020 NEXCOM International Co., Ltd. All Rights Reserved.
2
PEAK 779VL2 User Manual
Chapter 1: Product Introduction
Hardware Specifications
CPU Support
▪
Support Intel
®
LGA1155, 3rd generation Intel
®
Core™ processor
▪
Intel
®
Core i7-3770 (4C/8M cache/3.4GHz/Max. TDP 77W)
▪
Intel
®
Core i5-3550S (4C/6M cache/3.0GHz/Max. TDP 65W)
▪
Intel
®
Core i3-3220 (2C/3M cache/2.4GHz/Max. TDP 55W)
▪
Intel
®
Pentium
®
G2120 (2C/3M cache/1.6GHz/Max. TDP 65W)
Main Memory
▪
Dual DDR3/DIMMs, support 1333/1600MHz non-ECC system memory
up to 16GB
Platform Control Hub
▪
Intel
®
B75 PCH chipset
BIOS
▪
AMI System BIOS
▪
Plug and play support
▪
Advanced power management and advanced configuration & power
Display
▪
Intel
®
HD graphics with DX11 support up to two independent displays
▪
Supports VGA and DVI/HDMI interfaces
Audio
▪
HDA interface with pin header
Onboard LAN
▪
Intel
®
82579LM Gigabit Ethernet
▪
Intel
®
82574l Gigabit Ethernet
▪
Support PXE boot from LAN, wake on LAN function
I/O Interface
▪
USB 3.0: 2 x ports through I/O bracket/2 x ports through JST connector
▪
USB 2.0: 4 x ports through 2.5mm JST connectors
▪
Four SATA ports: one SATA 3.0/three SATA 2.0
▪
Four PCI interfaces/three ISA interfaces (through ITE8888)
▪
Two RJ45 Gigabit Ethernet LAN ports
▪
Four serial ports (COM2 supports RS232/422/485, RI pin can supply 5V/12V
voltage)
▪
Parallel port through box header
▪
Keyboard/mouse interface
▪
HDA interface through pin header for audio function (optional)
Power Requirements
▪
+12V, +5V, +3.3V, +5VSB, +3.3V RTC power
▪
Power source from backplane through golden finger and AUX +12V
▪
Support ATX/AT power supplies
Dimensions
▪
338.58mm (L) x 122mm (W)
Environment
▪
Board level operating temperatures: -15°C to 60°C
▪
Storage temperatures: -20°C to 80°C
▪
Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
Certifications
▪
Meet CE
▪
FCC Class A