2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and has
an excess amount of solder.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Reflow Soldering Method
Dimensions
Part Number
GC
□
31
3.2×1.6
2.2
～
2.4
0.8
～
0.9
1.0
～
1.4
GC
□
32
3.2×2.5
2.0
～
2.4
1.0
～
1.2
1.8
～
2.3
(in mm)
2.0×1.25
1.0
～
1.2
0.6
～
0.7
0.8
～
1.1
GC
□
18
GC
□
21
1.6×0.8
0.6
～
0.8
Notice
a
b
0.6
～
0.7
0.6
～
0.8
Chip
（
L×W
）
c
Chip Capacitor Land
Solder Resist
a
b
C
JEMCGC-4642B
23
