4. Mounting and Environment
There are typically no thermal hazards when desktop equipment is used as intended and with reasonable care on the
desktop.
Rack mounted systems will need to provide clearance sufficient for the power cord connector, so that there is no danger of
crimping and damaging the power conductors to create a risk of short circuits and fire.
If there is an external enclosure into which an xDAP unit is mounted, there must be sufficient separation between the
enclosure door and xDAP front panel to avoid damaging front panel cables and connectors. Some separation might be
needed between the enclosure's door and cables to avoid coupling of electrical ground noise into sensitive signal paths.
The processor chip inside of the xDAP unit will generate a significant amount of heat. The maximum safe ambient
temperature is given in the technical specifications, but will typically be around 50 degrees Centigrade. In general,
temperatures that are safe for humans are also safe for operating the xDAP units, but sustained operation at relatively high
ambient temperatures could accelerate degradation of materials in electronic components, thus impairing the product
lifetime.
For equipment mounted in an enclosure, there must be adequate air flow to carry away generated heat and avoid an
excessive temperature rise inside of the enclosure. The air intake is through the bottom plate. The primary fan for drawing
air and processor heat out of the unit is on the back of the xDAP unit. It is particularly important that these air flow paths are
not obstructed.
If it is necessary to unmount the unit, the recommended sequence of actions is:
1. stop software processing first if you can
2. turn off the front panel illuminated switch
3. turn off the back panel power supply switch
4. disconnect the power cable
The unit is not isolated from environmental hazards. Take appropriate precautions to prevent liquids and other contaminants
from getting into the equipment and causing harm to sensitive electronic components.
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