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Specifications
B-2
B
Operating temperature (refer
to Cooling Requirements
section)
0° to 55° C at point of exit of forced air
(approximately 490 LFM)
Storage temperature
-40° to +85° C
Relative humidity
5% to 90% (non-condensing)
Physical dimensions
(Processor/Memory
mezzanine module only)
Width
Depth
Height
144 mm (5.63 inches)
133 mm (5.2 inches)
15.0 mm (0.59 inches) (maximum, PM603)
25.4 mm (1.0 inches) (maximum, PM604)
Table B-2. RAM104 Specifications
Characteristics
Specifications
Power requirements
(DRAM Memory
module only)
+5 Vdc (
±
2.5%), 1.0 A typical, 1.5 A max.
Operating temperature (refer
to Cooling Requirements
section)
0° to 55° C at point of exit of forced air
(approximately 490 LFM)
Storage temperature
-40° to +85° C
Relative humidity
5% to 90% (non-condensing)
Physical dimensions
(DRAM Memory
module only)
Width
Depth
Thickness (PWB only)
119 mm (4.70 inches)
64 mm (2.50 inches)
2.03 mm (0.080 inches)
Table B-1.
PM603/PM604 Specifications (Continued)
Characteristics
Specifications
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