
MAINTENANCE
MTP850
TETRA Handportable Terminal / Basic Service Manual
6 - 3
Pre-baking of Integrated Circuits
Electronic components are generally coated with plastic material which has the
nature of not being waterproof. If kept unsealed the components can absorb
humidity. When soldered to the board (especially with reflow techniques) the
sudden change in temperature can cause fissure or crack which can result in
malfunction or damage.
To avoid this problem these moisture sensitive components (MS) should be
stored and shipped in a sealed wrapping (dry pack). Processing must take place
only with dry components when an uninterrupted dry storage can be guaranteed,
otherwise the components have to be pre-baked.
If a reflow procedure takes place close to MS components the whole board must be
pre-baked.
Please refer to the following table:
For 1W radios
For 1.8W radios
P/N
MSL*
DESCRIPTION
5104932K08
3
Tomahawk, U200
5186988J77
3
Javelin, U900
5108683Y44
2
TETRA PA, U901
5185941F32
3
PCAP 2.4
5187943V03
3
Patriot ROM3
5115443M01
3
LNA- Life, U500
5187512V01
3
Half-Life, U501
5109509A69
3
PSRAM
51012033001
3
FLASH 32M
5189378V12
3
EEPROM
5188450M52
3
SiRF Instant GSCi-5000 IC
5114004M42
1
Backlight Booster
P/N
MSL*
DESCRIPTION
5104932K08
3
Tomahawk, U200
5186988J77
3
Javelin, U900
5171354L01
2
TETRA PA, U901
5185941F32
3
PCAP 2.4
5171266M01
3
Patriot ROM3
5115443H02
3
LNA- Life, U502
5187512V01
3
Half-Life, U507
5164852H34
3
PSRAM, U402
51012033001
3
FLASH 32M
5189378V12
3
EEPROM
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