MOTOROLA
Chapter 8. Package Description
8-1
Chapter 8
Package Description
•
Section 8.1, “256 MAPBGA Package Parameter Summary”
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Section 8.2, “Nomenclature and Dimensions of the 256 MAPBGA Package”
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Section 8.3, “Package Thermal Characteristics”
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Section 8.4, “MC92603Chip Pinout Listing”
The following section provides the package parameters and mechanical dimensions of the
MC92603device. The MC92603 is offered in a 256 MAPBGA package. The 256
MAPBGA utilizes an aggressive 1 mm ball pitch and 17 mm body size for applications
where board space is limited.
8.1
256 MAPBGA Package Parameter Summary
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Package Type—Fine pitch ball grid array
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Package Outline—17 mm x 17 mm
•
Package Height—1.60 mm maximum
•
Number of Balls—256
•
Ball Pitch—1 mm
•
Ball Diameter—0.40–0.60 mm
Содержание MC92603
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