L306 Hardware Design
Copyright © Shanghai Mobiletek Communication Ltd 0
GSM/WCDMA Module Series
Version
：
V1.8
Date
2018-03-06
Shanghai Mobiletek Communication Ltd
Страница 1: ...L306 Hardware Design Copyright Shanghai Mobiletek Communication Ltd 0 L306 Hardware Design GSM WCDMA Module Series Version V1 8 Date 2018 03 06 Shanghai Mobiletek Communication Ltd ...
Страница 2: ... using or communication of the contents thereof are forbidden without express authority Offenders are liable to the payment of damages All rights reserved in the event of grant of patent or the registration of a utility model or design All specification supplied herein are subject to change without notice at any time DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED AS IS EXCEPT AS REQUIRED BY A...
Страница 3: ...he boot circuit Rc dong 2017 06 25 V1 5 Modify chapter storage and production add the PIN definition of the L306G Add description of L306G Delete L306M H information Add description of the Ring signal Rc dong Lb xu 2017 07 14 V1 6 Adjust the direction of the module package Rc dong 2017 10 10 V1 7 Modify chapter storage and production add label description delete SD card and SPI update Log Rc dong ...
Страница 4: ...n description 21 3 1 3 Hardware Power On Off 21 3 1 4 Hardware reset 22 3 2 USIM Interface 23 3 2 1 Pin Description 23 3 2 2 USIM application 23 3 3 USB Interface 24 3 4 PCM Interface 25 3 5 IIC Interface 26 3 6 UART Interface 27 3 6 1 Pin Description 27 3 6 2 UART application 28 3 7 Interactive Application Interface 29 3 8 LED Interface 29 3 8 1 LED Control circuit 29 3 8 2 LED State description ...
Страница 5: ...Features 38 5 1 Frequency Band 38 5 2 Data link 39 5 3 Antenna Design 40 6 Storage and Production 44 6 1 Storage 44 6 2 Production 44 6 2 1 Module confirmation and moisture 45 6 2 2 SMT reflow attentions 46 6 2 3 SMT stencil design and the problem of less tin soldering 47 6 2 4 SMT attentions 47 L Y N Q C O N F I D E N T I A L ...
Страница 6: ... module for LCC package with stable and reliable performance It supports UMTS HSDPA HSUPA900 850 2100 1900 and can be completely compatible with existing GSM GPRS EDGE networks 1 1 Hardware Diagram Figure 1 1 L306 functional architecture 1 2 Main features CPU ARM Cortex R4 481MHz L Y N Q C O N F I D E N T I A L ...
Страница 7: ...G GSM GSM850 MHZ EGSM900 MHZ DCS1800 MHZ PCS1900 MHZ WCDMA UMTS850 MHZ UMTS900 MHZ UMTS1732 MHZ UMTS1900 MHZ UMTS2100 MHZ HSPA HSDPA HSUPA 1 3 Specifications Supply Voltage Range 3 3 4 2V type3 8V Dimensions 30mm 30mm 2 65mm Package 94 pin LCC Operation Temperature Range 40 85 Storage Temperature Range 45 90 Antenna Main Antenna Diversity Antenna L Y N Q C O N F I D E N T I A L ...
Страница 8: ...sign Copyright Shanghai Mobiletek Communication Ltd 7 Weight Approx 5g 1 4 Interfaces IIC PCM Digital audio interface SIM Support 1 8V 3V UART High speed UART USB 2 0 High Speed 480Mbps L Y N Q C O N F I D E N T I A L ...
Страница 9: ...42 41 82 GND ANT1 GND GND GPIO49 GPIO44 GPIO28 GPIO52 GPIO46 NETLIGHT GPIO54 WAKE UP GPIO0 STATUS GPIO51 GPIO53 NC NC GPIO17 NC GND NC GND ANT2 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 G N D N C G N D G N D PC M_ C L K PC M_ SYN C PC M_ DI N PC M_ DO U T UART 0_ DT R UART 0_ T X UART 0_ DC D UART 0_ RI N G UART 0_ RX UART 0_ C T S UART 0_ RT S G N D G N D V BAT V BAT G N D 21 22...
Страница 10: ...Ground GND 2 GND G Ground GND 3 PWRKEY I Powerkey button 0 4 2V Open 4 SYSRSTB I System reset signal DVDD18 Open 5 GND G Ground GND 6 GPIO47 I O General input output PIN DVDD18 Open 7 URXD1 DI UART1 RX DVDD18 Open 8 UTXD1 DO UART1 TX DVDD18 Open 9 GPIO50 I O General input output PIN DVDD18 Open 10 GND G Ground GND 11 NC NC 12 USB_DM DIO USB port differential data line Open 13 USB_DP DIO Open 14 GN...
Страница 11: ...output voltage 1 8 3 0V Open 21 NC NC 22 NC NC 23 NC NC 24 NC NC 25 NC NC 26 NC NC 27 GPIO39 I O General input output PIN DVDD18 Open 28 NC NC 29 GPIO30 I O General input output PIN DVDD18 Open 30 NC NC 31 NC NC 32 NC NC 33 NC NC 34 NC NC 35 NC NC 36 NC NC 37 GND G Ground GND 38 VBAT P Power supply 3 3 4 2V VBAT 39 VBAT VBAT 40 GND G Ground GND 41 GND G Ground GND 42 NC NC L Y N Q C O N F I D E N ...
Страница 12: ...O Output PIN as LED control for network status DVDD18 Open 52 GPIO46 I O General input output PIN DVDD18 Open 53 GPIO52 I O General input output PIN DVDD18 Open 54 GPIO28 I O General input output PIN DVDD18 Open 55 GPIO44 I O General input output PIN It can be used as IIC clock DVDD18 Open 56 GPIO49 I O General input output PIN It can be used as IIC data DVDD18 Open 57 GND G Ground GND 58 GND G Gr...
Страница 13: ... UART0_DTR DI UART0 Data terminal ready DVDD18 Open 73 PCM_DOUT I O PCM I F data out DVDD18 Open 74 PCM_DIN I O PCM I F data in DVDD18 Open 75 PCM_SYNC I O PCM interface sync DVDD18 Open 76 PCM_CLK I O PCM interface clock DVDD18 Open 77 GND G Ground GND 78 GND G Ground GND 79 NC NC 80 GND G Ground GND 81 GND G Ground GND 82 ANT2 ANT Pin number L306E A L306G Open Pin59 Main_ANT NC Pin82 MIMO_ANT Ma...
Страница 14: ...INPUT DI DIGITAL INPUT O OUTPUT DO DIGITAL OUTPUT ANT ANTENNA DIO DIGITAL INPUT OUTPUT NC NOT CONNECT 2 3 Package Information 2 3 1 Dimensions The L306 mechanical dimensions are described as following figure Top view Back view Side view Notes Module provides all IO ports need to be out of floating in the boot process If the IO is pulled up by the external voltage before booting it may cause the mo...
Страница 15: ...L306 Hardware Design Copyright Shanghai Mobiletek Communication Ltd 14 Figure 2 2 Mechanical Dimensions 2 3 2 Product labeling L Y N Q C O N F I D E N T I A L ...
Страница 16: ...l Item Description A Logo of company B PID number C Environment friendly use period D QR code include IMEI number E IMEI number F SN number G CE H Pin1 mark I Module name J Module configuration stands for E A or G refer to table 2 1 and table 2 2 K WEEE L QR code include SN number M CCC N RoHS L Y N Q C O N F I D E N T I A L ...
Страница 17: ...L306 Hardware Design Copyright Shanghai Mobiletek Communication Ltd 16 2 3 3 Module size L Y N Q C O N F I D E N T I A L ...
Страница 18: ...L306 Hardware Design Copyright Shanghai Mobiletek Communication Ltd 17 Figure 2 4 Module Size back view L Y N Q C O N F I D E N T I A L ...
Страница 19: ...L306 Hardware Design Copyright Shanghai Mobiletek Communication Ltd 18 2 3 4 Recommend Pad L Y N Q C O N F I D E N T I A L ...
Страница 20: ...L306 Hardware Design Copyright Shanghai Mobiletek Communication Ltd 19 Figure 2 5 Recommend pad front view L Y N Q C O N F I D E N T I A L ...
Страница 21: ...acitor voltage is recommended to use near VBAT pins and the capacitor s value is the bigger the better In order to improve the continued flow of large current it is recommended to use a low impedance tantalum 470uF or larger During layout the capacitors are close to the VBAT pins Figure 3 1 Power Supply circuit Notes According to the environment please select capacitor as large value as possible a...
Страница 22: ...ll have an impact on the performance of the product In addition there are a total of 12 83 94 heat sink and fixed pad 3 1 3 Hardware Power On Off Module third pin is the Power on off key Pulling down the PWRKEY continuously the module will boot Releasing the PWRKEY the module will shutdown There is internally pulled up resistor If using the power on the boot form and the PWRKEY is grounded directl...
Страница 23: ...oot circuit 3 1 4 Hardware reset Module fourth pin is the hardware reset input The module will power off when it receives a 20ms low level signal The system has an internal pull up the typical value is 1 8V and do not need to pull up externally Figure 3 3 System Reset L Y N Q C O N F I D E N T I A L ...
Страница 24: ...he module 20 USIM_VCC USIM output voltage USIM card power supply output by the module 3 2 2 USIM application USIM card signal group PIN number 17 18 19 20 near the USIM card seat on the line Please note to increase the ESD protection device In order to meet the requirements of 3GPP TS 51 010 1 protocol and EMC certification the proposed USIM card is arranged near the position module USIM card inte...
Страница 25: ...ugh the USB interface USB bus is mainly used for data transmission software upgrade module program testing Working in the USB mode of the high speed line if you need ESD design ESD protection devices must meet the junction capacitance value of 3pf otherwise the larger junction capacitance will cause waveform distortion and affect the bus communication The differential impedance of differential dat...
Страница 26: ...smit Note If you use the serial port communication the DM DP reserved test points respectively in order to download software If DM DP is used to communicate with the MCU the position of the DM DP signal near the module needs to reserve a test point and the DM DP requires a series 0R resistor The resistor is placed near the module and the test point is placed between module and resistor L Y N Q C O...
Страница 27: ...lt use 1 8V power supply 12M output active crystal The power control pin of the PCM uses the PIN45 by default And NAU8814YG connected circuit from the device is shown in figure 3 7 Figure 3 7 NAU8814YG peripheral Circuit L306 as Main device 3 5 IIC Interface L306 module does not have a dedicated IIC interface if you need to use the IIC interface for communication you should use the GPIO port to si...
Страница 28: ... two groups of UART port support programmable data width stop bits and parity bits with separate TX and Rx FIFOs 512 bytes each The max baud rate of normal application of UART non Bluetooth is 115200bps The default baud rate is 115200bps Table 3 2 UART Pin Description Pin NO Pin Name I O Function Description 7 URXD1 DI UART1 receive data input only for debugging 8 UTXD1 DO UART1 transmit output on...
Страница 29: ...evel is 1 8V the connection mode is shown in Figure 3 9 and figure 3 10 You can use the complete RS232 mode 4 wires or 2 wires mode connection Module interface level is 1 8V If the AP interface level does not match you must increase the level conversion circuit Figure 3 9 Connect to AP method 4lines Figure 3 10 Connect to AP method L306 Serial Port TXD RXD CTS RTS DTR DCD RING GND AP Serial Port T...
Страница 30: ...0 WAKE UP GPIO0 I O General input output Port It can be used as wake up signal to module from host If it is unused left open 3 8 LED Interface 3 8 1 LED Control circuit GPIO54 PIN51 can be used to control the network status of the lam GPIO17 PIN45 can be used as an indicator of the power supply connected or not Note If need to use more GPIO ports you can refer to table 2 1 User can read and write ...
Страница 31: ...D State description GPIO17 is used as the enable pin Table 3 4 lists the LED status Table 3 4 LED Status LED Status Module Status Always On Power on OFF Power off GPIO54 is used as the enable pin Table 3 5 lists the LED status Table 3 5 LED Status LED Status Module Status L Y N Q C O N F I D E N T I A L ...
Страница 32: ...sign Copyright Shanghai Mobiletek Communication Ltd 31 Always On Searching Network Call Connect 300ms ON 300ms OFF Data Transmit 800ms ON 800ms OFF Registered network OFF Power off Sleep L Y N Q C O N F I D E N T I A L ...
Страница 33: ...4 2 V Peak current 0 3 2 0 A 4 2 Temperature characteristic Table 4 2 Temperature characteristic State Min Nom Max Unit Working 40 25 85 Storage 45 25 90 Notes The over low voltage can t power on the module Over high voltage may be danger to damage the module Using the DCDC supply please ensure the capacity of DCDC over 2 0A We don t suggest the LDO as the power supplier L Y N Q C O N F I D E N T ...
Страница 34: ...ions Table 4 4 Recommended operating range PIN Name Description Min Typ Max Unit DVDD18 Digital power input for IO 1 7 1 8 1 9 V 4 5 Power consumption Table 4 5 Power Consumption Parameter Conditions Min Average Max Unit Standby Flight mode Suspend state 1 0 mA Note All the GPIOs of module are 1 8V Note When the temperature is over the range the RF performance may be dropped It also may cause powe...
Страница 35: ...248 232 mA GSM900 MAX Power 235 238 mA DCS1800 MAX Power 183 162 mA PCS1900 MAX Power 181 186 mA WCDMA CH3012 MAX Power 393 490 mA WCDMA CH4408 MAX Power 397 490 mA WCDMA CH1638 MAX Power 487 mA WCDMA CH9800 MAX Power 450 475 mA WCDMA CH10700 MAX Power 378 482 mA Peak current Max power mode burst current 2 0 A Power consumption of L306G L Y N Q C O N F I D E N T I A L ...
Страница 36: ...uence diagram 4 7 Digital Interface Characteristics Table 4 6 Digital IO Voltage Parameter Description Min Typical Max Unit VIH High level input voltage 1 62 1 8 1 98 V VIL Low level input voltage 0 0 7 V VOH High level output voltage 1 62 1 8 1 98 V VOL Low level output voltage 0 0 3 V L Y N Q C O N F I D E N T I A L ...
Страница 37: ...ir discharge VBAT 4KV 8KV GND 4KV 8KV RF_ANT 4KV 8KV Enhanced ESD performance method 1 If the customer to the adapter plate the adapter plate anchor as much as possible and the uniform distribution of conduction path width 2 Key reset key need to add ESD device reset key to walk the line do not rely on the edge of the board 3 USB UART and other plug connection need to add ESD devices the other fro...
Страница 38: ... add ESD device ESD Cpf 0 5pF Notes For ESD protect please add ESD methods according to upper ways High speed circuits like USB TF and SIM card should be added ESD with low capacity value ESD components include varistors and TVS For better performance please use TVS L Y N Q C O N F I D E N T I A L ...
Страница 39: ...Hz 1805 MHz 1880 MHz PCS1900 1850 MHz 1910 MHz 1930 MHz 1990 MHz UMTS2100 1920 MHz 1980 MHz 2110 MHz 2170 MHz UMTS1900 1850 MHz 1910 MHz 1930 MHz 1990 MHz UMTS1732 1710 MHz 1755 MHz 2110 MHz 2155 MHz UMTS850 824 MHz 849MHz 869 MHz 894 MHz UMTS900 880 MHz 915 MHz 925 MHz 960 MHz Table 5 2 Output power Frequency Max output power Min output power GSM850 33dBm 2dB 5dBm 5dB E GSM900 33dBm 2dB 5dBm 5dB ...
Страница 40: ... 1 3dB 56dBm 5dB UMTS850 24dBm 1 3dB 56dBm 5dB UMTS900 24dBm 1 3dB 56dBm 5dB Table 5 3 Receive sensitivity Frequency Receive sensitivity GSM850 109dBm E GSM900 109dBm DCS1800 109dBm PCS1900 109dBm UMTS2100 109dBm UMTS1900 109dBm UMTS1732 109dBm UMTS850 109dBm UMTS900 109dBm 5 2 Data link L306 supports GPRS EDGE CLASS12 and HSDPA HSDPA R8 The actual application depends on the local network operator...
Страница 41: ...tenna efficiency Antenna efficiency is the ratio of the input power and radiant power Because of the return loss material loss and coupling loss of the antenna the radiant power is always lower than the input power The ratio is recommended to be controlled over 40 4dB S11 or VSWR S11 indicates the matching level of the 50 Ohm impedance for the antenna It affects the antenna efficiency in a certain...
Страница 42: ...is the collection of the efficiency and directivity of the antenna It is recommended that antenna gain is less than or equal to 3dBi Interference In addition to antenna performance some other interference from the PCB will also affect the module performance To ensure the high performance of the module the interference must be under control Suggestions keep speaker LCD CPU FPC wire routing audio ci...
Страница 43: ... Connector RF in the figure is used for testing and conducting test for example CE FCC etc which need to be placed as far as possible by the module the RF path from the module to the antenna feed point should be kept 50 ohm impedance control Figure 5 2 Div Antenna Design Figure R3 C3 C5 and R5 composition of the antenna matching network for antenna debugging the default R3 R5 paste 0 ohm resistor ...
Страница 44: ...L306 Hardware Design Copyright Shanghai Mobiletek Communication Ltd 43 Note L306G do not support MIMO Antenna which main antenna Pad is PIN82 L Y N Q C O N F I D E N T I A L ...
Страница 45: ... and the humidity is below 90 under good air circulation Humidity level is descripted detail as follows Table 6 1 Humidity level Rank Factory Environment 30 C 60 RH 1 No controll 30 C 85 RH 2 One year 2a 4 weeks 3 168 hours 4 72 hours 5 48 hours 5a 24 hours 6 Baking before using SMT during the time table signs Notes Moving storage production of module must meet the demand of IPC JEDEC J STD 033 6 ...
Страница 46: ...cuum bag desiccant and humidity indicator card Please pay attention to the moisture control before SMT and the confirmation of the following aspects Demand of Baking confirmation Smart module uses vacuum sealed bag which can make it stored for 6 months under the condition of temp 30 C and humidity 60 The module should be baked before reflowing soldering if any of the conditions below happen 1 Stor...
Страница 47: ...nment for a long time please properly extend the baking time such as 125 C 36 hours 6 2 2 SMT reflow attentions The module has the BGA chips chip resistances and capacitances internally which will melt at high temperature If module melt completely encountered a large shock such as excessive vibration of reflux conveyor belt or hit the board internal components will easily shift or be false welding...
Страница 48: ...te is controlled below the 2 10000 6 2 3 SMT stencil design and the problem of less tin soldering Part of customers found false welding or circuit short when reflowing The main reason is module tin less PCB distortion or tins too large Suggestions are as follows Suggest use ladder stencil which means the depth of the region of module is thicker than other areas Please adjust validation according t...
Страница 49: ... the reflow oven more than 8 temperature zones and strictly control the furnace temperature curve Recommended temperature B constant temperature zone temperature 160 190 C time 60s 100s E recirculation zone PEAK temperature 235 245 C time over 220 C 30s 60s Note customer s board deformation must be controlled well By reducing the number of imposition or increasing patch clamp to reduce the deforma...
