miniDSP Ltd, Hong Kong /
/ Features and specifications subject to change without prior notice
7
2
H
ARDWARE CONNECTIVITY
2.1
B
OARD OVERVIEW
The UMA-8-SP has few exposed headers to help for customization of the product.
Note that MEMS are up-firing( through the board) and SW1/2/3/4 must be at the top for correct microphone
pickup.
J3.1 - I2S_OUT_0
J3.2 - I2S_IN_0
J3.3 - I2S_OUT_1
J3.4 - I2S_IN_1
J3.5 - I2S_OUT_2
J3.6 - I2S_IN_2
J3.7 - I2S_OUT_3
J3.8 - I2S_OUT_4
J3.9 - MCLK
J3.10 - I2S_BCLK
J3.11 - GND
J3.12 -
I2S_LRCLK
J2.1 - GND
J2.2 - 3.3V
J2.3 - GND
J2.4 - 3.3V
J2.5 - N/A
J2.6 - UART_TX
J2.7 - UART_RX
J2.8 -
XMOS_RST
J2.9 - I2C_SDATA
J2.10 - I2C_SCLK
J2.11 - N/A
J2.12 - N/A
J3 / Audio data & clocks (Future)
J2 / Control IO pins (Future)
Bottom VIEW