Midland 70-1341, Руководство по обслуживанию

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SERVICING
70-1341/1344/1441/1444
1. Place the solder iron tip directly on the defective component to melt the glue under the component, then
solder as shown in Figure 4 - 1 . Remove the component with tweezers or longnose pliers. Discard the
component
CAUTION: Application of too much solder can create solder bridges between PC patterns under the soldered
component and around the pad.
4 - 4
Figure 4 - 1
2. Completely remove old solder, old glue, and any other contaminants from the area with desoldering-wick and
solvent.
3. Apply only enough fresh solder to coat the clean PC pad as shown in Figure 4 - 2.
Figure 4 - 2