Microchip Technology MCP2515, Руководство пользователя

Страница: 27 / 29

MCP2515 CAN BUS MONITOR
DEMO BOARD USER’S GUIDE

2008-2014 Microchip Technology Inc. DS50001757B-page 27
Appendix B. Bill Of Materials (BOM)
TABLE B-1: BILL OF MATERIALS (BOM)
Qty Reference Description Manufacturer Part Number
3 C1, C11, C12 CAP 10 µF 16V CERAMIC X7R 0805 Taiyo Yuden Co., Ltd. EMK212BB7106MGT
4 C2, C6, C7,
C8 CAP 10 µF 50V CERAMIC X7R 0805 KEMET
®
C0805C104K5RACTU
1 C3 CAP .22 µF 16V CERAMIC X7R 0805 Panasonic
®
– ECG ECJ-2VB1C224K
4 C4, C5, C9,
C10 CAP CERAMIC 22 pF 50V NP0 0805 Yageo
®
CC0805JRNP09BN220
10 D1<->D10 LED THIN 635 NM RED DIFF 0805
SMD Lumex
®
Inc. SML-LXT0805IW-TR
2 DS1, DS2 DIODE SCHOTTKY 20V 0.5A
SOD123 ON Semiconductor
®
MBR0520LT1G
1 J1 CONN RECEPT MINI USB 2.0 5POS
(mini USB) Hirose Electronic Co.,
Ltd. UX60-MB-5ST
0 J2
DO NOT POPULATE
— —
0 J3
DO NOT POPULATE
— —
2 J4, J8 CONN HEADER VERT 6 POS .100
TIN TE Connectivity, Ltd. 3-644695-6
1 J5 CONN HEADER VERT 7 POS .100
TIN TE Connectivity, Ltd. 3-644695-7
0 J6
DO NOT POPULATE
— —
1 J7 CONN HEADER LOPRO R/A 10POS
15AU TE Connectivity, Ltd. 103310-1
1 JP1 CONN HEADER VERT 2 POS .100
TIN TE Connectivity, Ltd. 3-644695-2
1 PCB RoHS Compliant Bare PCB, CAN Bus
Monitor Demonstration Board Microchip Technology
Inc. 104-000108
2 Q1, Q2 (NDS352P) MPSFET P-CH - 20V .5 Ω
SSOT3
Fairchild
Semiconductor
®
NDS352P
4 R1, R2, R10,
R11 RES 270 Ω 1/8W 5% 0805 SMD Panasonic – ECG ERJ-6GEYJ271V
0 R3, R4
DO NOT POPULATE
— —
6 R5, R6, R7,
R8, R20, R21 RES 470 Ω 1/8W 5% 0805 SMD Panasonic – ECG ERJ-6GEYJ471V
3 R9, R12, R22 RES 10 k Ω 1/8W 5% 0805 SMD Panasonic – ECG ERJ-6GEYJ103V
1 R14 RES 120 Ω 1/8W 5% 0805 SMD Panasonic – ECG ERJ-6GEYJ121V
1 R15 RES 33.2 k Ω 1/8W 1% 0805 SMD Panasonic – ECG ERJ-6ENF3322V
2 R18, R19 RES 10 k Ω 1/8W 1% 0805 SMD Panasonic – ECG ERJ-6ENF1002V
1 R23 RES 4.7 k Ω 1/8W 5% 0805 SMD Panasonic – ECG ERJ-6GEYJ472V
2 SW1, SW2 SWITCH LT TOUCH 6X3.5 100GF
SMD Panasonic – ECG EVQ-PJS04K
Note:
The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.