MCP1663 MINI-MODULE SEPIC
CONVERTER EVALUATION
BOARD USER’S GUIDE
2019 Microchip Technology Inc.
DS50002846A-page 3
Table of Contents
Introduction............................................................................................................ 4
Document Layout .................................................................................................. 4
Conventions Used in this Guide ............................................................................ 5
Recommended Reading........................................................................................ 6
The Microchip Website.......................................................................................... 6
Customer Support ................................................................................................. 6
Document Revision History ................................................................................... 6
1.1 Introduction ..................................................................................................... 7
1.2 MCP1663 Short Overview .............................................................................. 7
1.3 What is the MCP1663 Mini-Module SEPIC Converter Evaluation Board? ..... 8
1.4 What the MCP1663 Mini-Module SEPIC Converter Evaluation Board Kit
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 10
2.2 Getting Started ............................................................................................. 11
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 14
A.2 Board – Schematic ....................................................................................... 15
A.3 Board – Top Silk .......................................................................................... 16
A.4 Board – Top Copper and Silk ....................................................................... 16
A.5 Board – Top Copper .................................................................................... 16
A.6 Board – Bottom Copper ............................................................................... 17
A.7 Board – Bottom Copper and Silk ................................................................. 17
A.8 Board – Bottom Silk ..................................................................................... 17
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .................................................................................... 19