Installation and Operation
2019 Microchip Technology Inc.
DS50002846A-page 12
FIGURE 2-3:
Motherboard Used to Evaluate the Mini-Module with DDPAK
Footprint.
2.2.1
Power Input and Output Connection
2.2.1.1
POWERING MCP1663 MINI-MODULE SEPIC CONVERTER
EVALUATION BOARD
The MCP1663 Mini-Module SEPIC Converter Evaluation pin information is presented
below.
FIGURE 2-4:
MCP1663 SEPIC DDPAK Mini-Module Bottom View and Pins
Description.
Surface mounted pads are available for input voltage, output load and ground connec-
tions. The maximum applied input voltage should not exceed 5.5V.
Soldered pads are available in order to allow connecting a load. The peak current limit
of the MCP1663 will provide a safe maximum current value. The maximum output cur-
rent for the converter will vary with the input voltage, as shown in
Bottom View
DDPAK
13 x 9.5 mm
Symbol
Description
1
V
IN
Input Voltage Pin
2
EN
Enable Control Input Pin
3
V
OUT
Output Voltage Pin
4
GND
Ground Pin
