MCP1633 SEPIC
LED DRIVER
DEMONSTRATION BOARD
USER’S GUIDE
2020 Microchip Technology Inc.
DS50002945A-page 23
Appendix B. Bill of Materials (BOM)
TABLE B-1:
MCP1633 SEPIC LED DRIVER DEMONSTRATION BOARD –
BILL OF MATERIALS (BOM)
Qty
Reference
Description
Manufacturer
Part Number
2
C1, C6
Ceramic Capacitor, 1 µF, 50V,
20%, Y5V, Surface Mount, 0805
Samsung
Electro-Mechanics
America, Inc.
CL21F105ZBFNNNE
2
C10, C13
Ceramic Capacitor, 10000 pF,
50V, 20%, X7R, Surface Mount,
0603
AVX Corporation
C1608X7R1H103M080AA
2
C11, C16
Ceramic Capacitor, 1000 pF, 50V,
20%, X7R, Surface Mount, 0603
TDK Corporation
C1608X7R2A102K080AA
1
C12
Ceramic Capacitor, 33 pF, 50V,
5%, C0G, Surface Mount, 0603
Murata Electronics
North America, Inc.
GRM1885C1H330JA01D
1
C14
Ceramic Capacitor, 47 pF, 50V,
5%, NP0, Surface Mount, 0603
KEMET
C0603C470J5GACTU
2
C15, C20
Ceramic Capacitor, 0.1 µF, 16V,
10%, X7R, Surface Mount, 0603
Taiyo Yuden Co., Ltd. EMK107B7104KA-T
1
C18
Ceramic Capacitor, 100 pF, 50V,
5%, NP0, Surface Mount, 0603
Cal-Chip
Electronics Inc.
GMC10CG101J50NTLF
1
C19
Aluminum Capacitor, 33 µF, 20%,
50V, Surface Mount, D8
Nichicon Corporation
UWT1H330MCL1GS
5
C2, C3, C7, C8,
C9
Ceramic Capacitor, 10 µF, 50V,
20%, X7S, Surface Mount, 1210
TDK Corporation
C3225X7S1H106M250AB
1
C4
Ceramic Capacitor, 4.7 µF, 25V,
10%, X7R, Surface Mount, 0805
TDK Corporation
C2012X7R1E475K125AB
2
C5, C17
Ceramic Capacitor, 1 µF, 25V,
10%, X7R, Surface Mount, 0805
AVX Corporation
08053C105K4Z2A
1
D1
Schottky Diode, 60V, 2A, Surface
Mount, SOD-128, AEC-Q101
ROHM
Semiconductor
RBR2LAM60BTFTR
1
D3
Diode, LED, Red, 1.8V, 40 mA,
10 mcd, Clear, Surface Mount,
0603
Lite-On
®
, Inc.
LTST-C190KRKT
2
J1, J2
Connector, Terminal, 2.54 mm,
1x2, Female, 20-30AWG, 6A,
Through-Hole, Right Angle
PHOENIX CONTACT 1725656
3
J3, J6, J7
Connector, Header, 2.54 mm,
Male, 1x2, Gold, 5.84 MH,
Through-Hole, Vertical
Amphenol
Commercial
77311-118-02LF
1
J4
Connector, Header, 2.54 mm,
Male, 1x3, Tin, 5.84 MH,
Through-Hole, Vertical
Samtec, Inc.
TSW-103-07-T-S
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.