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10.3 Technical Specifications of used Modules
10.3.1 Technical Specifications - CPU
CPU:
825 MHz Cortex A9 Dual Core on SOC
Ethernet Interfaces:
4 x GBIT SFP - Slot
USB Interfaces:
USB to serial console
Micro-USB type B
USB Host
USB connector CPU management
USB type A
Profiles:
IEEE 1588v2 Default Profile
Enterprise Profile
IEC 61850-9-3 Power Profile
IEEE C.37.238-2011 Power Profile
IEEE C.37.238-2017 Power Profile
ITU-T G.8265.1 Telecom Frequency Profile
ITU-T G.8275.1 Telecom Phase / Time Profile (full timing support)
ITU-T G.8275.2 Telecom Phase / Time Profile (partial timing support)
SMPTE ST 2059-2 Broadcast Profile
IEEE 802.1AS TSN/AVB Profile
AES67 Media Profile
DOCSIS 3.1
PTP Modes:
Multicast/Unicast Layer 2 (IEEE 802.3)
Multicast/Unicast Layer 3 (UDP IPv4/IPv6)
Hybrid Mode
E2E / P2P Delay Mechanism
Up to 128 messages/second per client
1588 Clock Mode:
1-Step, 2-Step for both Master and Slave operation
Time Stamp Accuracy:
8 ns
NTP Req./Sec:
10,000
NTP Mode:
NTP Server mode
Synchronous Ethernet:
Master and Slave Capability
Compliant to ITU-T G.8261, G.8262 and G.8264
Ethernet Synchronization Messaging Channel (ESMC)
Network Protocols:
IPv4, IPv6
DHCP, DHCPv6
DSCP
IEEE 802.1q VLAN filtering/tagging
IEEE 802.1p QOS
58
Date: 22nd June 2020
microSync
Содержание HR101HQ/DC20
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