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MeiG Smart product technical information

SLM500

Hardware Design Guide

Page 59

band,  and  the  10pF  capacitor  mainly  filters  out  the  interference  of  the  DCS1800  band.  The
coupling interference of TDD has a great relationship with the PCB design of the user. In some
cases, the TDD of the GSM850/EGSM900 frequency band is more serious, and in some cases,
the TDD interference of the DCS1800 frequency band is more serious. Therefore, the user can
select  the  required  filter  capacitor  according  to  the  actual  test  result,  and  sometimes  even  do
not need to paste the filter capacitor.
The  GSM  antenna  is  the  main  source  of  coupling  interference  for  TDD,  so  users  should  pay
attention  to  keeping  the  audio  trace  away  from  the  GSM  antenna  and  VBAT  during  PCB
layout  and  routing.  The  filter  capacitor  of  the  audio  is  preferably  placed  close  to  the  module
end and placed next to the interface end. The audio output should be routed according to the
differential signal rules.
The conducted interference is mainly caused by the voltage drop of VBAT. If the Audio PA is
directly powered by VBAT, it is easier to hear the “zizi” sound at the SPK output. Therefore, it
is better to connect in  parallel with the input of the Audio PA in the schematic design. Some
large capacitance capacitors and series magnetic beads.

The conducted interference is also strongly related to TDD and GND. If GND is not

handled well, many high-frequency interference signals will interfere with MIC and Speaker
through devices such as bypass capacitors, so users should ensure good performance of GND
during PCB design.

5.2.7. Other

Because the outer ring pad of the module is designed with stamp hole, it is necessary to

expand the pad to enhance the tin climbing ability when making the SMD steel mesh.
Therefore, a sufficient safety distance should be reserved between the module pad and other
main board devices. The recommended safe distance is 3mm, as shown in the following figure:

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Содержание SLM500

Страница 1: ...product technical information SLM500 Hardware Design Guide Page 1 SLM500 Hardware Design Guide Released Date 2020 07 File name SLM500 Hardware Design Guide Version Number V1 00 Company MeiG Smart Technology Co Ltd ...

Страница 2: ...entation or warranty either express or implied for any content in this document and will not be liable for any specific merchantability and applicable or any indirect particular and collateral damage CONFIDENTIALITY All information contained here including any attachments is confidential The recipient acknowledges the confidentiality of this document and except for the specific purpose this docume...

Страница 3: ...MeiG Smart product technical information SLM500 Hardware Design Guide Page 3 SLM500 Hardware Design Guide_V1 00 ...

Страница 4: ...ration method The company does not assume responsibility for property damage or personal injury caused by improper operation of the user Users are requested to develop the corresponding products according to the technical specifications and reference designs in the manual Also pay attention to the general safety issues that mobile products should focus on Before the announcement the company has th...

Страница 5: ...e 44 4 8 1Receiver Interface Circuit 44 4 8 2 Microphone receiving Circuit 45 4 8 3 Headphone Interface Circuit 45 4 8 4 Speaker Interface Circuit 46 4 8 5 I2S Interface 46 4 9 USB Interface 46 4 9 1 USB OTG 47 4 10 Charging Interface 48 4 10 1 Charging Detection 49 4 10 2 Charge Control 49 4 10 3 BAT_CON_TEM 49 4 11 UIM Card Interface 49 4 12 SD Card Interface 50 4 13 I2C Bus Interface 51 4 14 An...

Страница 6: ... Band 63 6 11 RF Characteristics 64 6 12 Module Conduction Receiving Sensitivity 64 6 13 WIFI Main RF Performance 66 6 14 BT Main RF Prformance 67 6 15 GNSS Main RF Performance 67 7 Production 68 7 1 Top And Bottom Views Of The Module 68 7 2 Recommended Soldering Furnace Temperature Curve 69 69 7 3 Humidity Sensitivity MSL 69 7 4 Baking Requirements 70 8 Support Peripheral Device List 71 9 Appendi...

Страница 7: ...MeiG Smart product technical information SLM500 Hardware Design Guide Page 7 Version History Date Version Change description Author 2020 07 02 1 00 First edition MeiG Hardware ...

Страница 8: ...n arm cotex A53 four core processor with the highest main frequency of 4 1 3GHz and the memory supports single channel 32 bit LPDDR3 672MHz This module is suitable for broadband intelligent wireless communication modules of TD LTE FDD LTE WCDMA EVDO TD SCDMA CDMA GSM network standards The physical interface of the module is a 272 pin pad that provides the following hardware interfaces Three 1 8V U...

Страница 9: ...u Glonass Data Acces s TD LTE Cat4 TD LTE 117 30Mbps FDD LTE Cat4 FDD LTE 150 50Mbps DC HSPA 42 11 2Mbps TD HSPA 2 8 2 3Mbps EVDO Rev A 3 1 1 8Mbps EDGE Class12 236 8kbps 236 8kbps GPRS Class12 85 6kbps 85 6kbps SIM DSDS Dual Sim Dual Stanby 3 0 1 8V Support SIM hot plug L W G G with CSFB to W G L TDS G G with CSFB to TDS G L EVDO CDMA1X G L W TDS G CDMA1X Don t support dual CDMA SIM card Display ...

Страница 10: ... BLSP2 7 4 bits each multiplexed serial interface functions UART 3 Max up to 4 Mbps I2C 5 Support SPI master only Support ADC 1 Support PWM 1 Support Charge Max up to 1 44A Vibrator Support GPIO 40 GPIOs Excluded BLSP multiplexing GPIO VCOIN Real time clock backup battery RF Interface Multimode LTE main antenna Multimode LTE diversity antenna The GPS antenna 2 4G 5G WiFi BT antenna Audio One main ...

Страница 11: ...figure lists the main functional parts of the module baseband chip power management chip Transceiver chip WCN3660 WIFI BT Two in one chip Antenna interface LCD CAM MIPI interface EMCP memory chip AUDIO interface UART SD card interface SIM card interface I2Cinterface etc Figure 2 1 module function block diagram ...

Страница 12: ...MeiG Smart product technical information SLM500 Hardware Design Guide Page 12 3 Module Package 3 1 Pin distribution diagram Figure 3 1 module pin diagram top view ...

Страница 13: ...ect 3V button batteries or large capacitors VREG_L5_1P8 111 O 1 8V power output Power supply always available for IO port pull up and level conver sion not for peripheral power supply 50mA VREG_L6_1P8 125 O 1 8 V power output standby will be closed used for Camera LCD and other small current power supply 100mA VREG_L10_2P8 156 O 2 8V power output used for Sensor TP power supply 150mA VREG_L17_2P85...

Страница 14: ...4_LCD_TE0 50 I O LCD frame sync signal UART 1 8V GPIO0_UART1_TXD 154 I UART1 data transmit GPIO1_UART1_RXD 153 O UART1 data receive GPIO4_DBG_UART_TX 94 I UART2 data receive GPIO5_DBG_UART_RX 93 O UART2 data transmit GPIO16_UART5_TXD 34 I UART5 data receive GPIO17_UART5_RXD 35 O UART5 data transmit GPIO18_UART5_CTS 36 I UART5 Clear To Send CTS GPIO19_UART5_RTS 37 O UART5 Request To Send RTS UIM ca...

Страница 15: ...M 63 I O Rear Camera MIPI clock MIPI_CSI1_CLK_P 64 I O MIPI_CSI1_LANE0_M 65 I O Rear Camera MIPI data MIPI_CSI1_LANE0_P 66 I O MIPI_CSI1_LANE1_M 67 I O MIPI_CSI1_LANE1_P 68 I O MIPI_CSI1_LANE2_M 72 I O MIPI_CSI1_LANE2_P 73 I O MIPI_CSI1_LANE3_M 70 I O MIPI_CSI1_LANE3_P 71 I O GPIO26_MCAM_MCLK0 74 I O Rear Camera main clock GPIO128_MCAM_RST_N 79 I O Rear Camera reset GPIO126_MCAM_PWDN 80 I O Rear C...

Страница 16: ...CARD_D1 42 I O SDC2_SDCARD_D2 43 I O SDC2_SDCARD_D3 44 I O I2C GPIO29_CAM_I2C_SDA0 84 I O Special I2C signal can only be used for CAM Pullup to VREG_L6_1P 8 GPIO30_CAM_I2C_SCL0 83 I O GPIO31_DCAM_I2C_SDA1 205 I O Default for DCAM GPIO32_DCAM_I2C_SCL1 166 I O GPIO14_SENSOR_I2C4_SDA 92 I O Special I2C signal can only be used for SENSOR GPIO15_SENSOR_I2C4_SCL 91 I O GPIO10_TP_I2C3_SDA 48 I O Universa...

Страница 17: ...08 I O The default configuration is the gyroscope interrupt signal GPIO34 170 I O Generic GPIO without default configuration GPIO85 265 I O Generic GPIO MI2S1 SCK GPIO86 239 I O Generic GPIO MI2S1 D1 GPIO87 105 I O Generic GPIO MI2S1 WS GPIO88 264 I O Generic GPIO MI2S1 D0 GPIO32_DCAM_I2C_SCL1 166 I O default configuration Depth camera I2C GPIO31_DCAM_I2C_SDA1 205 I O default configuration Depth c...

Страница 18: ...O95 103 I O Generic GPIO without default configuration GPIO127 169 I O Generic GPIO without default configuration GPIO25 90 I O Generic GPIO without default configuration GPIO130 97 I O Generic GPIO without default configuration GPIO104_RFFE3_CLK 260 I O GRFC only used for RF Tuner control not for general GPIO GPIO106_RFFE3_DATA 262 I O GNSS_LNA_EN 194 I O External GPS LNA enable Other functional ...

Страница 19: ...178 179 180 183 184 192 232 242 246 249 252 253 254 257 263 270 Table 3 2 Pin Characteristics PIN SLM500 Pin name GPIO Interrupt Pad characteristics Functional description 1 VBAT PI PO Battery 3 5V 4 2V default 3 8V 2 VBAT PI PO Battery 3 5V 4 2V default 3 8V 3 GND GND GND 4 MIC_IN1_P AI Microphone 1 input plus 5 MIC_GND GND Microphone bias filter ground 6 MIC_IN2_P AI Microphone 2 input plus 7 GN...

Страница 20: ...3 GPIO33 B PD nppukp Configurable I O 34 GPIO16_UART5_TXD GPIO16 B PD nppukp Configurable I O UART5 TX 35 GPIO17_UART5_RXD GPIO17 B PD nppukp Configurable I O UART5 RX 36 GPIO18_UART5_CTS GPIO18 B PD nppukp Configurable I O UART5 CTS 37 GPIO19_UART5_RTS GPIO19 B PD nppukp Configurable I O UART5 RTS 38 VREG_L11_SDC PO PMIC output 2 95V for SD card power 39 SDC2_SDCARD_CLK BH NP pdpukp Secure digita...

Страница 21: ...IPI camera serial interface 0 lane0 67 MIPI_CSI1_LANE1_M AI MIPI camera serial interface 0 lane1 68 GND GND GND 69 MIPI_CSI1_LANE3_M AI MIPI camera serial interface 1 lane3 70 MIPI_CSI1_LANE3_P AI MIPI camera serial interface 1 lane3 71 MIPI_CSI1_LANE2_M AI MIPI camera serial interface 1 lane2 72 MIPI_CSI1_LANE2_P AI MIPI camera serial interface 1 lane2 73 GPIO26_MCAM_MCLK0 GPIO26 B PD nppukp Conf...

Страница 22: ...Configurable I O 103 GPIO95 GPIO95 B PD nppukp Configurable I O 104 GPIO94 GPIO94 B PD nppukp Configurable I O 105 GPIO87 GPIO87 B PD nppukp Configurable I O MI2S1 WS 106 GPIO66 GPIO66 B PD nppukp Configurable I O 107 GPIO43_ALSP_INT_N GPIO43 B PD nppukp Configurable I O ALSP INT 108 GPIO63_GYRO_INT GPIO63 B PD nppukp Configurable I O GYRO INT 109 GPIO44_MAG_INT GPIO44 B PD nppukp Configurable I O...

Страница 23: ..._HPH_L AO Headphone output left channel 139 CDC_HSDET_L AI MBHC mechanical insertion removal detection 140 GND GND GND 141 VBUS PI PO USB Voltage 142 VBUS PI PO USB Voltage 143 GND GND GND 144 GND GND GND 145 VBAT PI PO Battery 3 5V 4 2V default 3 8V 146 VBAT PI PO Battery 3 5V 4 2V default 3 8V 147 MIC_BIAS1 AO Microphone bias 1 148 MIC_IN3_P AI Microphone 3 input plus 149 GND GND GND 150 RESERVE...

Страница 24: ...pukp Configurable I O I2C2 SCL 169 GPIO127 GPIO127 B PD nppukp Configurable I O 170 GPIO34 GPIO34 B PD nppukp Configurable I O 171 GND GND GND 172 GND GND GND 173 RESERVED Reserved 174 RESERVED Reserved 175 RESERVED Reserved 176 GND GND GND 177 GPIO90 GPIO90 B PD nppukp Configurable I O 178 RESERVED Reserved 179 RESERVED Reserved 180 RESERVED Reserved 181 NFC_CLK DO NFC CLK 182 NFC_CLK_REQ DO Z DI...

Страница 25: ...9 GPIO39 B PD nppukp Configurable I O 202 GND GND GND 203 GND GND GND 204 GND GND GND 205 GPIO31_DCAM_I2C_SDA1 GPIO31 B PD nppukp Configurable I O Dedicated camera I2C1 SDA 206 GND GND GND 207 GND GND GND 208 GND GND GND 209 GND GND GND 210 GND GND GND 211 GND GND GND 212 GND GND GND 213 GND GND GND 214 GND GND GND 215 GND GND GND 216 GND GND GND 217 GND GND GND 218 GND GND GND 219 GND GND GND 220...

Страница 26: ... GND GND 248 GND GND GND 249 RESERVED Reserved 250 GND GND GND 251 GND GND GND 252 RESERVED Reserved 253 RESERVED Reserved 254 RESERVED Reserved 255 GND GND GND 256 GND GND GND 257 RESERVED Reserved 258 GND GND GND 259 GND GND GND 260 GPIO104_RFFE3_CLK GPIO104 B PD nppukp Configurable I O RFFE3 CLK 261 GND GND GND 262 GPIO106_RFFE3_DATA GPIO106 B PD nppukp Configurable I O RFFE3 DATA 263 RESERVED ...

Страница 27: ...ake up system interrupt pin B Bidirectionaldigital with CMOS input H High voltage tolerant NP pdpukp defaultno pull with programmable options following the colon PD nppukp defaultpulldown with programmable options following the colon PU nppdkp defaultpullup with programmable options following the colon KP nppdpu defaultkeeper with programmable options following the colon 3 3 Mechanical Dimensions ...

Страница 28: ...MeiG Smart product technical information SLM500 Hardware Design Guide Page 28 Figure 3 2 Module 3D size unit mm Figure 3 3 Recommended PCB package size unit mm ...

Страница 29: ...r regulator close to VBAT It is recommended to use two 47uF ceramic capacitors Parallel 33PF and 10PF capacitors can effectively remove high frequency interference To prevent damage to the chip due to ESD and surge it is recommended to use a suitable TVS tube and a 5 1V 500mW Zener diode at the VBAT pin of the module For PCB layout the capacitors and diodes should be as close as possible to the VB...

Страница 30: ...w Figure 4 2 DC DC power supply circuit Note If the user does not use battery power please note that a 47K resistor is connected to the 134 pin BAT_THERM of the module and pulled down to GND to prevent the software from judging the abnormal battery temperature after the module is turned on resulting in shutdown The connection diagram is as follows Figure 4 3 Connection diagram when not powered by ...

Страница 31: ...e transmit burst mode Figure4 4 VBAT lowest voltage drop 4 2 Power on and off Do not turn on the module when the module s temperature and voltage limits are exceeded In extreme cases such operations can cause permanent damage to the module 4 2 1 Module Boot The user can power on the module by pulling the KYPD_PWR_N pin 114 low The pull down time is at least 5 seconds This pin has been pulled up to...

Страница 32: ...art product technical information SLM500 Hardware Design Guide Page 32 Figure 4 6 Booting with the button circuit The following figure is the boot timing description Figure 4 7 Using PWRKEY boot timing diagram ...

Страница 33: ...module detects the shutdown action a prompt window pops up on the screen to confirm whether to perform the shutdown action The user can achieve a forced shutdown by pulling PWRKEY down for a long time pulling down for at least 15 seconds 4 2 3 Module Reset The SLM500 module supports a reset function that allows the user to quickly restart the module by pulling the RESET_N pin 225 of the module low...

Страница 34: ...nput high level 1 V Input low level 0 65 V Pull down effective time 500 ms 4 3 VCOIN Power When VBAT is disconnected the user needs to save the real time clock The VCOIN pin cannot be left floating It should be connected to a large capacitor or battery When external capacitor is connected the recommended value is 100uF and the real time clock can be kept for 1 minute The reference design circuit i...

Страница 35: ...ce Table 4 2 Power Description Signal Default Voltage V Drive Current mA VREG_L5_1P8 1 8 100 VREG_L6_1P8 1 8 100 VREG_L10_2P8 2 8 150 VREG_L11_SDC 2 95 600 VREG_L12_SDC 2 95 50 VREG_L14_UIM1 1 8 2 95 55 VREG_L15_UIM2 1 8 2 95 55 VREG_L16_AVDD 2 8 55 VREG_L17_2P85 2 85 300 4 5 Serial Port The SLM500 provides three serial ports for communication And corresponding to one groups of I2C interfaces can ...

Страница 36: ...O18_UART5_CTS 36 I UART5 Clear To Send CTS GPIO19_UART5_RTS 37 O UART5 Request To Send RTS Please refer to the following connection method Figure 4 13 Serial Port Connection Diagram When the serial level used by the user does not match the module in addition to adding the level shifting IC the following figure can also be used to achieve level matching Only the matching circuits on TX and RX are l...

Страница 37: ... the RS232 signal cannot be directly connected If necessary please use the RS232 conversion chip 2 If the 1 8V output of the module cannot meet the high level range of the user terminal please add a level shifting circuit 4 6 MIPI Interface The SLM500 supports the Moble Industry Processor Interface MIPI interface for Camera and LCD The module supports HD 1440 720 display The MIPI interface Main Ca...

Страница 38: ...LCD The LCD interface is as follows Table 4 5 Primary screen interface definition Main screen interface MIPI_DSI0_CLK_M 52 O MIPI_LCD clock line MIPI_DSI0_CLK_P 53 O MIPI_DSI0_LANE0_M 54 I O MIPI_LCD data line MIPI_DSI0_LANE0_P 55 I O MIPI_DSI0_LANE1_M 56 I O MIPI_DSI0_LANE1_P 57 I O MIPI_DSI0_LANE3_M 60 I O MIPI_DSI0_LANE3_P 61 I O MIPI_DSI0_LANE2_M 58 I O MIPI_DSI0_LANE2_P 59 I O GPIO60_LCD_RESE...

Страница 39: ...ware Design Guide Page 39 Figure 4 16 LCD interface circuit PMIC does not support backlight drive LCD backlight driver circuit needs to be added by customers Please refer to the following figure for specific circuit Figure 4 17 Backlight drive schematic ...

Страница 40: ...ra interface Name Name Name Name GPIO26_MCAM_MCLK0 74 O Main camera clock signal GPIO128_MCAM_RST_N 79 O Main camera reset signal GPIO126_MCAM_PWDN 80 O Main camera sleep signal MIPI_CSI1_CLK_M 63 I Main camera MIPI clock signal MIPI_CSI1_CLK_P 64 I MIPI_CSI1_LANE0_M 65 I O Main camera MIPI data signal MIPI_CSI1_LANE0_P 66 I O MIPI_CSI1_LANE1_M 67 I O MIPI_CSI1_LANE1_P 68 I O MIPI_CSI1_LANE2_M 72 ...

Страница 41: ...DD VREG_L17_2P85 129 O 2 8V AFVDD If the user designs to use the CAMERA module with autofocus function please note that the I2C of the module cannot be directly connected to the AF device The I2C of the AF device should be connected to the driver chip of CAMERA and the correct connection is as follows Figure 4 18 Correct CAMERA connection diagram The MIPI interface has a high rate The user should ...

Страница 42: ...MeiG Smart product technical information SLM500 Hardware Design Guide Page 42 Figure 4 19 MIPI Camera Reference Circuit ...

Страница 43: ... provides a set of I2C interfaces that can be used to connect capacitive touches while providing the required power and interrupt pins The default interface pins for capacitive touch software are defined as follows Table 4 7 Capacitive Touch Interface Definitions Name Pin Input Output Description GPIO10_TP_I2C3_SDA 48 I O The capacitive touch I2C interface needs to be pulled up toVREG_L5_1P8 GPIO1...

Страница 44: ...dphone MIC noise reduction MIC negative MIC_IN3_P 148 I Noise reduction MIC positive MIC_BIAS1 147 O BIAS voltage of the main MIC for silicon wheat MIC_BIAS2 155 O BIAS voltage of the headphone MIC for silicon wheat design CDC_HPH_R 136 O Headphone right channel CDC_HPH_L 138 O Headphone left channel CDC_HSDET_L 139 I Headphone plug detection CDC_HPH_REF 137 I Headphone reference ground EAR_M 9 O ...

Страница 45: ...n of the module can be set as an interrupt In software this pin is the earphone interrupt by default The user can use this pin to detect the plugging and unplugging of the earphone Figure 4 23 Headphone Interface Circuit Note 1 The earphone holder in Figure 4 24 is normally closed If the user is using the normally open mode earphone holder please modify the detection circuit according to the actua...

Страница 46: ...rates a Class D audio amplifier with an output power of 800mW and an output signal of SPKR_OUT_P SPKR_OUT_M 4 24 Recommended circuit with Internal audio amplifier 4 8 5 I2S Interface There are one sets of GPIO compatible I2S interfaces inside the module The pins used by this function are as follows Name Pin Intput Output Description GPIO88 264 O I2S1 Data out GPIO87 105 O I2S1 WS GPIO86 239 I I2S1...

Страница 47: ... effectively suppress EMI interference At the same time the USB interface is an external interface The DM DP must add a TVS tube to prevent static damage caused by plugging and unplugging the data cable When selecting the TVS the user should pay attention to the load capacitance of less than 1pf VBUS also needs to increase the TVS tube If there is anti surge demand it is also necessary to increase...

Страница 48: ...rging chip by default The chip is in liner mode Trickle charging it is divided into two parts trickle charging A the charging current is 90mA when the battery voltage is lower than 2 8V trickle charging B the charging current is 450mA when the battery voltage is between 2 8V and 3 2V Constant current charging when the battery voltage is between 3 2V 4 2V the charging current is 1 44A when charging...

Страница 49: ...ery At present the software s charge cut off voltage is 4 2V and the back off voltage is 4 05V 4 10 3 BAT_CON_TEM The SLM500 module has battery temperature detection and can be implemented by BAT_THERM 134 PIN This requires the internal integration of a 47KΩ thermistor negative temperature coefficient inside the battery to connect the thermistor to the BAT_THERM pin During the charging process the...

Страница 50: ...mmended to use TVS devices for electrostatic protection The device of the peripheral circuit of the SIM card should be close to the SIM card holder The reference circuit is as follows Figure 4 30 UIM card interface circuit 4 12 SD Card Interface SLM500 supports SD card interface The reference circuit is as follows Figure 4 31 SD Card Interface Circuit moduler SIM card ...

Страница 51: ...for TP GPIO11_TP_I2C3_SCL 47 GPIO6 167 Universal I2C Note To use the 2 2KΩ pull up resistor to 1 8V Gpio14 15 can only be used to connect sensor devices in Qualcomm QVL not other devices 4 14 Analog to Digital Converter ADC The SLM500 module provides two MPP function signals from the power management chip PWM 29PIN and ADC 128PIN MPP can be configured as an ADC or PWM signal The ADC signal is 16 b...

Страница 52: ...re that the user s products have good wireless performance the antenna selected by the user should meet the requirement that the input impedance is 50 ohms in the working frequency band and the VSWR is less than 2 4 17 1 Main Antenna The module provides the MAIN antenna interface pin Pin1 RF_MAIN The antenna on the user s main board should be connected to the antenna pin of the module using a 50 o...

Страница 53: ...n the above figure R101 defaults to 0R and C101 and C102 do not paste by default 4 17 2 DRX Antenna The module provides the DRX antenna interface pin RF_DIV and the antenna on the user s motherboard should be connected to the module s antenna pins using a 50 ohm characteristic microstrip or strip line In order to facilitate antenna debugging and certification testing an RF connector and antenna ma...

Страница 54: ...n Circuit In the above figure R102 defaults to 0R C103 and C104 are not attached by default 4 18 3 GPS Antenna The module provides the GNSS antenna pin RF_GPS The antenna on the user s main board should be connected to the antenna pin of the module using a 50 ohm characteristic microstrip line or strip line The LNA is integrated inside the module To improve GNSS reception performance customers can...

Страница 55: ...t diagram is as follows Figure 4 40 WiFI_BT antenna interface connection circuit In the figure R301 C301 and C302 are antenna matching devices and the specific component values can be determined after the antenna factory debugs the antenna Among them R301 defaults to 0R C301 and C302 do not paste by default If there are fewer components between the antenna and the module output or if the RF test h...

Страница 56: ...display so the PCB design requirements when using the SLM500 module is much higher than the previous 2G module please read this chapter carefully reduce the subsequent hardware debugging cycle When using the SLM500 module the user is required to use at least 4 layers of via holes for the PCB to facilitate impedance control and signal line shielding 5 1 Module PIN distribution Before the PCB layout...

Страница 57: ...e Make sure that the GND path of these exposed copper areas to the power supply is the shortest and smoothest This ensures that the current path of the entire power supply is the shortest and the interference is minimal 5 2 3 SIM Card The SIM card has a large area and does not have an anti EMI interference device It is relatively susceptible to interference Therefore in the layout first ensure tha...

Страница 58: ...he group is controlled within 1mm The length error between groups is controlled within 2 mm 5 2 5 USB The module supports high speed USB interface at a rate of 480Mbps The user recommends adding a common mode inductor during the schematic design phase to effectively suppress EMI interference If you need to increase the static protection please select a TVS tube with a parasitic capacitance of less...

Страница 59: ... interface end The audio output should be routed according to the differential signal rules The conducted interference is mainly caused by the voltage drop of VBAT If the Audio PA is directly powered by VBAT it is easier to hear the zizi sound at the SPK output Therefore it is better to connect in parallel with the input of the Audio PA in the schematic design Some large capacitance capacitors and...

Страница 60: ...MeiG Smart product technical information SLM500 Hardware Design Guide Page 60 ...

Страница 61: ...ow shows the operating temperature range of the module Table 6 2 Module Operating Temperature Parameter Minimum Typical Maximum Unit Working temperature 25 75 Storage temperature 40 90 6 3 Working Voltage Table 6 3 Module Operating Voltage Parameter Minimum Typical Maximum Unit VBAT 3 4 4 2 V VBUS 4 5 6 V Hardware shutdown voltage 2 5 2 8 V 6 4 Digital Interface Features Table 6 4 Digital Interfac...

Страница 62: ...Y High level 1 4 V Low level 0 6 V Effective time 2000 ms 6 7 VCOIN Feature Table 6 7 VCOIN Characteristics Parameter Description Minimum Typical Maximum Unit VCOIN IN VCOIN input voltage 2 3 3 25 V IRTC IN VCOIN Current consumption 3 uA VCOIN OUT VCOIN Output voltage 3 V IRTC OUT VCOIN Output current 2 mA 6 8 Current Consumption VBAT 3 8V Table 6 8 Current consumption Parameter Descriptio n Condi...

Страница 63: ...t electrostatic discharge Therefore users must pay attention to electrostatic protection when producing assembling and operating modules 6 10 Module Operating Frequency Band The table below lists the operating frequency bands of the module and complies with the 3GPP TS 05 05 technical specification Table 6 9 Module Operating Band Frequency band Receive Transmission Physical channel GSM850 869 894M...

Страница 64: ... 100MHz 2555 2655 MHz the channel is 40240 41240 6 11 RF Characteristics The following table lists the conducted RF output power of the module in accordance with 3GPP TS 05 05 technical specification 3GPP TS 134121 1 standard Table 6 10 Conducted Output Power Frequency band Standard output power dBm Output power tolerance dBm GSM850 EGSM900 33dBm 2 DCS1800 30dBm 2 WCDMA 24 dBm 1 3 CDMABC0 25 dBm 2...

Страница 65: ...101 7 98 7 97 94 92 2 91 FDD 4 104 7 101 7 100 97 95 2 94 FDD 5 103 2 100 2 98 95 FDD 6 100 97 FDD 7 98 95 93 2 92 FDD 8 102 2 99 2 97 94 FDD 9 99 96 94 2 93 FDD 10 100 97 95 2 94 FDD 11 100 97 FDD 12 101 7 98 7 97 94 FDD 13 97 94 FDD 14 97 94 FDD 17 97 94 FDD 18 1007 977 95 27 FDD 19 100 97 95 2 FDD 20 97 94 91 2 90 FDD 21 100 97 95 2 FDD 22 97 94 92 2 91 FDD 23 104 7 101 7 100 97 95 2 94 FDD 24 ...

Страница 66: ...rformance 2 4G 802 11B 802 11G 802 11N Transmit power minimum rate 18 18 18 dBm Transmit power maximum rate 18 14 5 13 dBm EVM maximum rate 20 27 30 dB Receiving performance 2 4G Receiving sensitivity 802 11B 802 11G 802 11N Minimum rate 92 91 90 dBm Maximum rate 89 74 5 72 5 dBm Transmission performance 5G 802 11a 802 11n 802 11a Transmit power minimum rate 17 17 dBm 17 Transmit power maximum rat...

Страница 67: ...5 2DH5 3DH5 14 14 14 dBm Receiving performance Receiving sensitivity DH5 2DH5 3DH5 94 5 94 5 86 dBm 6 15 GNSS Main RF Performance The table below lists the main RF performance under GNSS conduction Table 6 15 Main RF performance parameters under GNSS conduction GNSS working frequency band 1575 42MHZ GNSS carrier to noise ratio CN0 40dB Hz GNSS sensitivity Capture cold start Capture hot start Track...

Страница 68: ...MeiG Smart product technical information SLM500 Hardware Design Guide Page 68 7 Production 7 1 Top And Bottom Views Of The Module Figure 48 Module top and bottom views ...

Страница 69: ...nt conditions of temperature 30 degrees and relative humidity 60 Under ambient conditions of temperature 40 degrees and relative humidity 90 the shelf life is at least 6 months without unpacking After unpacking Table 22 lists the shelf life of the modules for different moisture sensitivity levels Table 7 1 Humidity sensitivity level distinction Grade Factory environment 30 60 RH 1 Indefinite quali...

Страница 70: ...e should be no more than 96 hours at temperatures above 90 C and as high as 125 C 7 4 Baking Requirements Due to the humidity sensitivity of the module the SLM500 should be thoroughly baked prior to reflow soldering otherwise the module may cause permanent damage during reflow soldering The SLM500 should be baked for 192 hours in a cryogenic vessel at 40 C 5 C 0 C and a relative humidity of less t...

Страница 71: ...5K4H7 8M Sunny optical S5K5E8 5M Table 8 3 Support for touch screen model list Vendor Drive IC Specification GOODIX GT5688 5 Table 8 4 Support for G Sensor Model List Vendor Model Specification Bosch BMI120 9 axis 16bit 16bit Table 8 5 Support for Ecompass Model List Vendor Model Specification GMEMS GMC303 3 Axis 14 bit Table 8 6 Support PS ALS Sensor Model List Vendor Model Specification LITEON L...

Страница 72: ...lar telecommunications system Phase 2 Specification of the Subscriber Identity Module Mobile Equipment SIM ME interface 6 GSM 03 38 Digital cellular telecommunications system Phase 2 Alphabets and language specific information 7 GSM 11 10 Digital cellular telecommunications system Phase 2 Mobile Station MS conformance specification Part 1 Conformance specification 8 AN_Serial Port AN_Serial Port 9...

Страница 73: ... MSISDNs list RC Mobile Equipment list of received calls SM SIM phonebook NC Not connect OEM requirement and guidance for host manufactures The module is limited to OEM installation ONLY The OEM integrator is responsible for ensuring that the end user has no manual instruction to remove or install module In case that FCC identification number and IC identification number is not visible when the mo...

Страница 74: ...power e i r p is not more than that necessary for successful communication Conformé ment àla ré glementation d Industrie Canada le pré sent é metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou infé rieur approuvépour l é metteur par Industrie Canada Dans le but de ré duire les risques de brouillage radioé lectrique àl intention des autres utilisateurs il faut choisir...

Страница 75: ... 2014 53 EU RF Exposure Information This device has been tested and meets applicable limits for Radio Frequency RF exposure The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range BE EE HR IT CY LV LT BG IE LU HU MT NL AT CZ EL PL PT RO SI SK DK ES FI SE DE FR LI NO IS CH TR UK NI 1 Operational use conditions if your module has professional users use cond...

Страница 76: ...ich is installed and operating with the module is in compliant with Part 15B requirements Please note that For a Class B or Class A digital device or peripheral the instructions furnished the user manual of the end user product shall include statement set out in 15 105 Information to the user or such similar statement and place it in a prominent location in the text of host product manual Original...

Страница 77: ...OSI TX 17 35 MISO RX 18 36 CS_N CTS SDA 19 37 CLK RTS SCL 20 119 MOSI TX 21 118 MISO RX 22 117 CS_N CTS SDA 23 116 CLK RTS SCL 85 265 MOSI 86 239 MISO 87 105 CS_N 88 264 CLK Note Blue is the default function 9 4 Safety Warning Pay attention to the following safety precautions when using or repairing any terminal or mobile phone that contains modules The user should be informed of the following saf...

Страница 78: ... transmits radio frequency energy when it is turned on It can interfere with TV radio computer or other electrical equipment Road safety first Do not use a handheld terminal or mobile phone while driving please use a hands free device Stop before using your handheld terminal or mobile phone GSM mobile terminals operate under RF signals and cellular networks but are not guaranteed to be connected i...

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