Maxim Integrated MAX9277, Руководство пользователя

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AVDD to AGND ....................................................-0.5V to +1.9V
DVDD to AGND ....................................................-0.5V to +1.9V
IOVDD to AGND ...................................................-0.5V to +3.9V
LVDSVDD to AGND .............................................-0.5V to +3.9V
GND to AGND ......................................................-0.5V to +0.5V
LMN_ to AGND (15mA current limit) ....................-0.5V to +3.9V
OUT+, OUT- to AGND ..........................................-0.5V to +1.9V
All Other Pins to AGND .......................-0.5V to (V
IOVDD
+ 0.5V)
OUT+, OUT- Short Circuit to Ground or Supply ........Continuous
Continuous Power Dissipation (T
A
= +70ºC)
TQFN (derate 40mW/ºC above +70ºC) ........................ 3200mW
Junction Temperature ......................................................+150ºC
Storage Temperature ......................................... -65ºC to +150ºC
Lead Temperature (soldering, 10s) .................................+300ºC
Soldering Temperature (reflow) ....................................... +260ºC
TQFN
Junction-to-Case Thermal Resistance (θ
JC
) ................ 1°C/W Junction-to-Ambient Thermal Resistance (θ
JA
) ......... 25°C/W
(Note 2)
(V
AVDD
= V
DVDD
= 1.7V to 1.9V, V
IOVDD
= 1.7V to 3.6V, V
LVDSVDD
= 3.0V to 3.6V, R
L
= 100Ω ±1% (differential), T
A
= -40° C to +105 ° C,
unless otherwise noted. Differential input voltage |V
ID
| = 0.1V to 1.2V, input common-mode voltage V
CM
= |V
ID
/2| to 2.4V - |V
ID
/2|.
Typical values are at V
AVDD
= V
DVDD
= V
IOVDD
= 1.8V, V
LVDSVDD
= 3.3V, T
A
= +25°C.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SINGLE-ENDED INPUTS (CX/TP, PWDN , MS/CNTL0, CDS/CNTL3, SD, SCK, WS, AUTOS , CNTL1, CNTL2, HIM)
High-Level Input Voltage V
IH1
(CX/TP, PWDN , MS/CNTL0, CDS/
CNTL3,
AUTOS
, HIM)
0.65 x
V
IOVDD
V
SD, SCK, WS, CNTL1, CNTL2
0.7 x
V
IOVDD
Low-Level Input Voltage V
IL1
0.35 x
V
IOVDD
V
Input Current I
IN1
V
IN
= 0V to V
IOVDD
-10 +20 µA
THREE-LEVEL LOGIC INPUTS (CONF0, CONF1, ADD0, ADD1, BWS)
High-Level Input Voltage V
IH
0.7 x
V
IOVDD
V
Low-Level Input Voltage V
IL
0.3 x
V
IOVDD
V
Mid-Level Input Current I
INM
(Note 4) -10 +10 µA
Input Current I
IN
-150 +150 µA
SINGLE-ENDED OUTPUT (GPO)
High Level Output Voltage V
OH1
I
OUT
= -2mA
V
IOVDD
-
0.2
V
Low Level Output Voltage V
OL1
I
OUT
= 2mA 0.2 V
OUTPUT Short-Circuit
Current
I
OS
V
OUT
= 0V
V
IOVDD
= 3.0V to 3.6V 16 35 64
mA
V
IOVDD
= 1.7V to 1.9V 3 12 21
MAX9277/MAX9281 3.12Gbps GMSL Serializers for Coax or
STP Output Drive and LVDS Input
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Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Note 1:
AGND, GND connected to PCB ground.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
DC Electrical Characteristics