DS3234
Extremely Accurate SPI Bus RTC
with Integrated Crystal and SRAM
Maxim Integrated | 20
www.maximintegrated.com
Chip Information
SUBSTRATE CONNECTED TO GROUND
PROCESS: CMOS
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 SO
W20#H2
21-0042
90-0108
Package Information
For the latest package outline information and land patterns (foot-
prints), go to
www.maximintegrated.com/packages
. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.