Lucent Technologies DDM-2000 OC-3, Руководство пользователя и обслуживания

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363-206-285 System Turnup:
NTP-003
Issue 2, February 2000 Page 3 of 6
DDM-2000 OC-3 M
ULTIPLEXER
DO ITEMS BELOW IN ORDER LISTED . . . . .FOR DETAILS, GO TO
5.
!
CAUTION:
No service LOW SPEED DS1 slot locations should be left
empty in groups equipped with MXRVO and protection
HDSL
circuit packs.
!
CAUTION:
When a HDSL circuit pack is switched to protection, removal
of any other HDSL circuit pack or 177A Retainer Card in the
same group will result in a loss of service to the protected
HDSL
and the removed HDSL circuit pack.
NOTE:
177A Retainer Cards are used to disconnect the
cross-connect wiring associated with unused service DS1
slot locations from the DDM-2000’s internal protection bus.
Install 177A Retainer Cards into all unused service DS1 slots in
groups equipped with MXRVO and protection HDSL circuit packs.
6. Use the
set-t1:
command to set the characteristics of the DS1
port of the circuit being established.
7. At each HDSL terminating node, make the appropriate cable
connection(s) to the HDSL cross-connect point(s) or equivalent
connection point(s) for the circuit being added.
8. Verify that no LEDs or alarms are activated. If any LEDs or alarms
are activated, refer to Trouble Clearing: IXL-001 and follow the
appropriate trouble-clearing procedure.
9. If one of the terminating nodes is equipped with STS1E circuit
packs for an EC-1 interface to support services being established,
establish initial EC-1 low speed interface [NTP-034].
10.
NOTE:
Ring releases support only manual VT1.5 and STS-1
cross-connections. Manual STS-1 and/or DS1
cross-connections have to be made at each shelf to
configure the transmission path for each circuit being
established. Either terminating (drop) cross-connections or
"drop and continue" cross-connections are made at
terminating nodes and pass-through cross-connections are
made at intermediate nodes.