This Data Sheet may be revised by subsequent versions ©2003 Eon Silicon Solution, Inc., www.essi.com.tw
or modifications due to changes in technical specifications.
25
EN29F040A
Rev. B, Issue Date: 2004/04/01
Table 11. ERASE AND PROGRAMMING PERFORMANCE
Limits
Parameter
Typ Max Unit
Comments
Sector Erase Time
0.3
5
sec
Chip Erase Time
3
35
sec
Excludes 00H programming prior to
erasure
Byte Programming Time
7
200
µs
Chip Programming Time
2
5
sec
Excludes system level overhead
Erase/Program Endurance
100K
cycles
Minimum 100K cycles guaranteed
Table 12. LATCH UP CHARACTERISTICS
Parameter Description
Min
Max
Input voltage with respect to Vss on all pins except I/O pins
(including A9 and OE )
-1.0 V
12.0 V
Input voltage with respect to Vss on all I/O Pins
-1.0 V
Vcc + 1.0 V
Vcc Current
-100 mA
100 mA
Note :
These are latch up characteristics and the device should never be put under
these conditions. Refer to Absolute Maximum ratings for the actual operating limits.
Table 13. 32-PIN PLCC PIN CAPACITANCE @ 25°C, 1.0MHz
Parameter Symbol
Parameter Description
Test Setup
Typ
Max
Unit
C
IN
Input Capacitance
V
IN
= 0
4 6 pF
C
OUT
Output Capacitance
V
OUT
= 0
8 12 pF
C
IN2
Control Pin Capacitance
V
IN
= 0
8 12 pF
Table 14. 32-PIN TSOP PIN CAPACITANCE @ 25°C, 1.0MHz
Parameter Symbol
Parameter Description
Test Setup
Typ
Max
Unit
C
IN
Input Capacitance
V
IN
= 0
6 7.5 pF
C
OUT
Output Capacitance
V
OUT
= 0
8.5 12 pF
C
IN2
Control Pin Capacitance
V
IN
= 0
7.5 9 pF