Linear Technology Analog Devices LT8607, Техническое описание

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LT8607/LT8607B
19
Rev. C
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PACKAGE DESCRIPTION
MSOP (MSE) 0213 REV I
0.53
±
0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8 9 10
10
1
7 6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118
±
.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
1.68
±
0.102
(.066
±
.004)
1.88 ± 0.102
(.074 ± .004)
0.50
(.0197)
BSC
0.305
±
0.038
(.0120
±
.0015)
TYP
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.68
(.066)
1.88
(.074)
0.1016 ± 0.0508
(.004 ± .002)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.05 REF
0.29
REF
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I)