1-4
SERVICING PRECAUTIONS
CAUTION: Before servicing the HD/SD PRESONAL VIDEO
RECORDER & RECEIVER WITH GEMSTAR covered by
this service data and its supplements and addends, read and
follow the
SAFETY PRECAUTIONS. NOTE:
if unforeseen
circumstances create conflict between the following servic-
ing precautions and any of the safety precautions in this pub-
lications, always follow the safety precautions.
Remember Safety First:
General Servicing Precautions
1. Always unplug the HD/SD PRESONAL VIDEO RECORDER
& RECEIVER WITH GEMSTAR AC power cord from the
AC power source before:
(1) Removing or reinstalling any component, circuit board,
module, or any other assembly.
(2) Disconnecting or reconnecting any internal electrical
plug or other electrical connection.
(3) Connecting a test substitute in parallel with an elec-
trolytic capacitor.
Caution:
A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may result
in an explosion hazard.
2. Do not spray chemicals on or near this HD/SD PRESON-
AL VIDEO RECORDER & RECEIVER WITH GEMSTAR
or any of its assemblies.
3. Unless specified otherwise in this service data, clean
electrical contacts by applying an appropriate contact
cleaning solution to the contacts with a pipe cleaner,
cotton-tipped swab, or comparable soft applicator.
Unless specified otherwise in this service data, lubrication
of contacts is not required.
4. Do not defeat any plug/socket B+ voltage interlocks with
which instruments covered by this service manual might
be equipped.
5. Do not apply AC power to this HD/SD PRESONAL VIDEO
RECORDER & RECEIVER WITH GEMSTAR and / or any
of its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
6. Always connect the test instrument ground lead to an
appropriate ground before connecting the test instrument
positive lead. Always remove the test instrument ground
lead last.
Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet and turn
the power on. Connect an insulation resistance meter (500V)
to the blades of the attachment plug. The insulation resis-
tance between each blade of the attachment plug and acces-
sible conductive parts (Note 1) should be more than 1M-
ohm.
Note 1:
Accessible Conductive Parts include Metal panels,
Input terminals, Earphone jacks,etc.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field
effect transistors and semiconductor chip components.
The following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor compo-
nent or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known
earth ground. Alternatively, obtain and wear a commer-
cially available discharging wrist strap device, which
should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such
as aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static solder removal device. Some
solder removal devices not classified as “anti-static” can
generate electrical charges sufficient to damage ES
devices.
5. Do not use freon-propelled chemicals. These can
generate an electrical charge sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protec-
tive package until immediately before you are ready to
install it. (Most replacement ES devices are packaged with
leads electrically shorted together by conductive foam,
aluminum foil,or comparable conductive material).
7. Immediately before removing the protective material from
the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the
device will be installed.
Caution: Be sure no power is applied to the chassis or
circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Normally harmless motion such
as the brushing together of your clothes fabric or the lifting
of your foot from a carpeted floor can generate static elec-
tricity sufficient to damage an ES device.)
Содержание LST-3410A
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Страница 64: ...3 41 3 42 WAVEFORMS 1 SYSTEM PART 1 1 1 2 2 System Reset System Main Clock 33 333MHz ...
Страница 67: ...3 47 3 48 4 VIDEO PART 2 2 1 4 3 HD 2 VDP Clock 27MHz VCXO Clock HD 2 NTSC Clock HD 2 PWM Signal ...
Страница 70: ...3 53 3 54 7 VIDEO IN DVI OUT 3 1 4 2 DVI Clock Digital Video H Sync Out VPX3226F X Tal Clock 656 Clock ...
Страница 71: ...3 55 3 56 8 PVR PART 1 2 1 Variable Audio_L Out SPDIF Out Signal ...
Страница 72: ...3 57 3 58 9 PVR PART 2 1 2 BCM7040 Memory Clock BCM7040 Clock ...
Страница 74: ...3 61 3 62 11 CVBS OUT 4 1 3 2 DVI Clock Digital Video H Sync Out VPX3226F X Tal Clock 656 Clock ...
Страница 75: ...3 63 3 64 12 1394 PART 1 2 1394 TP Out Clock 1394 X Tal Clock ...
Страница 76: ...3 65 3 66 13 GEMSTAR PART 3 1 2 Gemstar Memory Clock to MiCOM Gemstar Memory Clock Gemstar X Tal Clock ...
Страница 77: ......
Страница 79: ...3 72 3 73 2 CPU CIRCUIT DIAGRAM 1 SMEM_DATA S_MEM ADR PER_DATA PER_ADDR CPU CLOCK ...
Страница 80: ...3 74 3 75 3 BOOT STRAPPING CLOCK CPLD CIRCUIT DIAGRAM PER DATA PER ADR TO CPU P8 P9 P4 ...
Страница 81: ...3 76 3 77 4 SYSTEM MEMORY FLASH I2 C COT CIRCUIT DIAGRAM PER ADDR CLOCK P3 S MEM DATA S MEM ADDR PER DATA ...
Страница 82: ...3 78 3 79 5 HD II CIRCUIT DIAGRAM PES CLOCK PER ADDR PER DATA Valid TP DATA CLK ...
Страница 83: ...6 HD2 MEMORY PLL CIRCUIT DIAGRAM 2 PER ADDR VSB PDR TP DATA CLK VALID TP DATA CLK VALID 3 80 3 81 ...
Страница 84: ...3 82 3 83 7 AUDIO PROCESSOR SPDIF OUT CIRCUIT DIAGRAM ...
Страница 85: ...3 84 3 85 8 NTSC DECODER DVI OUTPUT CIRCUIT DIAGRAM ...
Страница 86: ...3 86 3 87 9 TPN II MEMORY CIRCUIT DIAGRAM ...
Страница 87: ...3 88 3 89 10 MPEG ENCODER MEMORY CIRCUIT DIAGRAM ...
Страница 88: ...3 90 3 91 11 PCI2IDE CONTROLLER CIRCUIT DIAGRAM ...
Страница 89: ...3 92 3 93 12 ATSC QAM NTSC NIM TUNER CIRCUIT DIAGRAM ...
Страница 90: ...3 94 3 95 13 AUDIO VIDEO OUT CIRCUIT DIAGRAM ...
Страница 91: ...3 96 3 97 14 1394 CIRCUIT DIAGRAM ...
Страница 92: ...3 98 3 99 15 MICOM POWER I F FRONT I F CIRCUIT DIAGRAM ...
Страница 93: ...3 100 3 101 16 FRONT CIRCUIT DIAGRAM ...
Страница 94: ...3 102 3 103 17 GEMSTAR CONTROLLER CIRCUIT DIAGRAM ...
Страница 95: ...3 104 3 105 18 GEMSTAR MEMORY CIRCUIT DIAGRAM ...
Страница 96: ...3 106 3 107 19 GEMSTAR MICOM I F CIRCUIT DIAGRAM ...
Страница 97: ...3 108 3 109 PRINTED CIRCUIT DIAGRAMS 1 DIGITAL MAIN PRINTED CIRCUIT DIAGRAMS TOP ...
Страница 98: ...3 110 3 111 2 DIGITAL MAIN PRINTED CIRCUIT DIAGRAMS BOTTOM LOCATION GUIDE ...
Страница 99: ...3 112 3 113 3 SMPS POWER PRINTED CIRCUIT DIAGRAM LOCATION GUIDE ...
Страница 100: ...3 114 3 115 5 GEMSTAR PRINTED CIRCUIT DIAGRAM BOTTOM 4 GEMSTAR PRINTED CIRCUIT DIAGRAM TOP ...
Страница 101: ...3 116 3 117 6 KEY PRINTED CIRCUIT DIAGRAM 7 TIMER PRINTED CIRCUIT DIAGRAM LOCATION GUIDE ...
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