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ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-
face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL
OTHER SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen-
erate static electricity sufficient to damage an ESD device).
CAUTION. GRAPHIC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED “DANGER-
OUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC
SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.
Содержание LH-D6240A
Страница 5: ... 1 5 SPECIFICATIONS ...
Страница 6: ... 1 6 LOCATION OF CUSTOMER CONTROLS FRONT PANEL DISPLAY WINDOW ...
Страница 7: ... 1 7 REAR PANEL ...
Страница 8: ... 1 8 Remote Control ...
Страница 9: ... 2 1 SECTION 2 AUDIO PART AUDIO TROUBLESHOOTING GUIDE 1 POWER SUPPUY CIRCUIT ...
Страница 10: ... 2 2 2 FRONT CIRCUIT 1 2 ...
Страница 11: ... 2 3 3 FRONT CIRCUIT 2 2 ...
Страница 12: ... 2 4 MEMO ...
Страница 13: ... BLOCK DIAGRAM 2 5 2 6 ...
Страница 14: ...2 7 2 8 SCHEMATIC DIAGRAMS POWER SMPS SCHEMATIC DIAGRAM ...
Страница 15: ...2 9 2 10 µ COM SCHEMATIC DIAGRAM ...
Страница 16: ...2 11 2 12 FRONT POWER 2nd SCHEMATIC DIAGRAM ...
Страница 17: ...2 13 2 14 DAP SCHEMATIC DIAGRAM ...
Страница 18: ...2 15 2 16 AMP SCHEMATIC DIAGRAM ...
Страница 19: ...2 17 2 18 WIRING DIAGRAM ...
Страница 20: ...2 19 2 20 PRINTED CIRCUIT BOARD DIAGRAMS MAIN P C BOARD DIAGRAM SOLDER SIDE ...
Страница 21: ...2 21 2 22 MAIN P C BOARD DIAGRAM COMPONENT SIDE ...
Страница 22: ...2 23 2 24 POWER SMPS P C BOARD SOLDER SIDE ...
Страница 23: ...2 25 2 26 FRONT P C BOARD DIAGRAM SOLDER SIDE ...
Страница 24: ... 3 1 SECTION 3 DVD PART DVD TROUBLESHOOTING GUIDE 1 Power check flow ...
Страница 25: ... 3 2 2 Test debug flow ...
Страница 26: ... 3 3 ...
Страница 27: ... 3 4 ...
Страница 28: ... 3 5 ...
Страница 29: ... 3 6 ...
Страница 30: ... 3 7 ...
Страница 32: ... 3 9 3 RS232 waveform during procedure Downloading 4 Flash R W enable signal during download Downloading ...
Страница 33: ... 3 10 2 SDRAM CLOCK 1 MT1379 main clock is at 27MHz X501 3 TRAY OPEN CLOSE SIGNAL 1 Tray open close waveform ...
Страница 34: ... 3 11 2 Tray close waveform 3 Tray open waveform ...
Страница 35: ... 3 12 4 SLED CONTROL RELATED SIGNAL NO DISC CONDITION 5 LENS CONTROL RELATED SIGNAL NO DISC CONDITION ...
Страница 36: ... 3 13 6 LASER POWER CONTROL RELATED SIGNAL NO DISC CONDITION 7 DISC TYPE JUDGEMENT WAVEFORM ...
Страница 37: ... 3 14 ...
Страница 38: ... 3 15 8 FOCUS ON WAVEFORM ...
Страница 39: ... 3 16 9 SPINDLE CONTROL WAVEFORM NO DISC CONDITION ...
Страница 40: ... 3 17 10 TRACKING CONTROL RELATED SIGNAL System checking ...
Страница 41: ... 3 18 11 RF WAVEFORM 12 MT1379 AUDIO OPTICAL AND COAXIAL OUTPUT ASPDIF ...
Страница 42: ... 3 19 13 MT1379 VIDEO OUTPUT WAVEFORM 1 Full colorbar signal CVBS 2 Y ...
Страница 43: ... 3 20 3 C 14 AUDIO OUTPUT FORM AUDIO DAC 1 Audio related Signal ...
Страница 44: ...3 21 3 22 DVD PART SCHEMATIC DIAGRAMS MPEG SCHEMATIC DIAGRAM ...
Страница 45: ...3 23 3 24 SERVO SCHEMATIC DIAGRAM ...
Страница 46: ...3 25 3 26 AUDIO SCHEMATIC DIAGRAM ...
Страница 47: ...3 27 3 28 VOLTAGE SHEET IC TR ...
Страница 48: ...3 29 3 30 PRINTED CIRCUIT DIAGRAM DVD P C BOARD SOLDER SIDE ...
Страница 49: ...3 31 3 32 DVD P C BOARD COMPONENT SIDE ...
Страница 51: ...4 3 4 4 DECK MECHANISM EXPLODED VIEW ...
Страница 52: ...4 5 4 6 MEMO MEMO ...
Страница 53: ... 5 1 SECTION 5 SPEAKER SECTION MODEL LHS D6240W 856 859 859 855 853 861 860 852 851 ...
Страница 54: ... 5 2 MODEL LHS D6240T 861 854 853 860 852 851 850 ...