13. EXPLODED VIEW & REPLACEMENT PART LIST
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Copyright © 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Level LocationNo.
Description
PartNumber
Spec
Remark
6
L304
Inductor
Wire Wound,Chip
ELCP0009409
LQM2HPN2R2MG0L 2.2UH 20% - 1.3A - -
0.08OHM - - SHIELD 2.5X2X1MM NONE R/TP
MURATA MANUFACTURING CO.,LTD.
6
MIC901
Microphone
Condenser
EAB62670801 MOE-C110R38-K1 -38DB 300OHM OMNI 1.5 TO
3.6V 3.76x2.95x1.1 SMD BSE CO., LTD.
6
L601
Inductor
Multilayer,Chip
EAP62227601
LG HK 0603 6N8J-T 6.8NH 5% - 250mA - -
0.39OHM 3.9GHZ 5 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
6
C429
Capacitor
Ceramic,Chip
ECZH0003503
GRM188R61E105K 1uF 10% 25V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING
CO.,LTD.
6
C322
Capacitor
Ceramic,Chip
ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6
SW101
Connector,RF
ENWY0008701
MS-156C NONE STRAIGHT SOCKET SMD
T/REEL AU 50OHM 400mDB HIROSE KOREA
CO.,LTD
5
EBR071700 PCB Assembly
Main,SMT Top
EBR76680702 LGE450.ACISWH 1.0 Main
6
EAX010000 PCB,Main
EAX65058301 LGE455F.ABRABK 1.0 FR-4 Staggered via 10 0.8T
Main
6
R403
Resistor,Chip
ERHY0009501 MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP -
ROHM.
6
L169
Inductor
Multilayer,Chip
EAP61767801
LQP03TN2N4B02D 2.4NH 0.1NH - 500mA - -
0.2OHM 6GHZ 14 SHIELD NONE 0.6X0.3X0.3MM
R/TP MURATA MANUFACTURING CO.,LTD.
6
ZD503
ZD504
Capacitor
Ceramic,Chip
ECZH0000844
C1005C0G1H680JT000F 68pF 5% 50V NP0 -
55TO+125C 1005 R/TP - - TDK KOREA
COOPERATION
6
C401
C409
C411
C500
C611
C634
C635
C646
Capacitor
Ceramic,Chip
EAE62286801
CL03A104KP3NNNC 0.0000001F 10% 10V X5R -
55TO+85C 0603 R/TP 0.3 - SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
R200
R201
R202
R203
Resistor,Chip
ERHY0009516 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP
- ROHM.