3. TECHNICAL BRIEF
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Copyright © 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
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3. TECHNICAL BRIEF
3.1.1 General
•
Integrated power management unit, analog baseband and radio circuitry.
• Package:
– 12.1x11.6mm
– 0.5 mm pitch
– TFBGA 354balls, 0.5mm pitch package
3.1.2 MCU Subsystem
• ARM926EJ
-S
TM
32-bit RISC processor
• Java hardware acceleration for fast Java
-based games and applets
• High performance multi
-layer AHB bus
• Operating frequency : Max. 416MHz with dynamic clock gating
• Dedicated DMA bus with 18 DMA channels
• On
-chip boot ROM for Factory Flash Programming
• Watchdog timer for system crash recovery
• 4 sets of General Purpose Timer
• Circuit Switch Data coprocessor
• Division coprocessor
3.1.3 External Memory Interface
• Supports up to 2 external devices
• Supports 16
-bit memory components with maximum size of up to 256M Bytes for each bank
• Supports mobile DDR SDRAM and cellular RAM
• Support Flash and SRAM/PSRAM with burst mode
• Support multi
-media companion chips with 8/16 bits data width
• Configurable driving strength for memory interface
3.1.4 User Interface
• 8
-row x 8-column keypad control with hardware scanner
• Support multiple key press for gaming
• Dual SIM/USIM Controller with hardware T=0/T=1 protocol control
• Real Time Clock(RTC) operating with a low quiescent current power supply
• General Purpose I/Os (GPIOs) available for auxiliary application
• 2 sets of Pulse Width Modulation(PWM) Output
• 15 external interrupt lines
• 2 external channel auxiliary 12 bit A/D converter
3.1.5 Security
• Support security key and 128bit chip random ID
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