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Copyright © 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
Table Of Contents
1. INTRODUCTION ..................................................................... 3
1.1 Purpose ........................................................................................................3
1. Regulatory Information .........................................................................3
1.3 Abbreviations.............................................................................................5
2. PERFORMANCE ...................................................................... 7
.1 H/W Features ..............................................................................................7
. Technical Specification ...........................................................................9
3. TECHNICAL BRIEF ................................................................ 14
3.1 Digital Main Processor ......................................................................... 14
3. Power Management ............................................................................ 18
3.3 FEM with integrated Power Amplifier Module
(SKY7754/SKY77543, U401) ........................................................... 30
3.4 Crystal(6 MHz, X101) ......................................................................... 3
3.5 RF Subsystem of PMB8810 (U101) ................................................. 3
3.6 MEMORY(M36W0R5040U6S, U10) ............................................ 36
3.7 SIM Card Interface ................................................................................. 38
3.8 LCD Interface ........................................................................................... 39
3.9 Battery Charger Interface ................................................................... 41
3.10 Keypad Interface ................................................................................. 4
3.11 Audio Front-End .................................................................................. 44
3.1 KEY BACLKLIGHT LED Interface .................................................... 50
3.13 Vibrator Interface ................................................................................ 51
3.14 HALL IC .................................................................................................... 5
4. TROUBLE SHOOTING .......................................................... 53
4.1 RF Component ....................................................................................... 53
4. RX Trouble ................................................................................................ 54
4.3 TX Trouble ................................................................................................. 58
4.4 Power On Trouble .................................................................................. 6
4.5 Charging Trouble ................................................................................... 65
4.6 Vibrator Trouble ..................................................................................... 67
4.7 LCD Trouble ............................................................................................. 69
4.8 Speaker Trouble ..................................................................................... 73
4.9 Earphone Trouble .................................................................................. 76
4.10 Microphone Trouble .......................................................................... 79
4.11 SIM Card Interface Trouble .............................................................. 81
4.1 KEY backlight Trouble ....................................................................... 83
4.13 FM Radio Trouble ................................................................................ 85
5. DOWNLOAD ......................................................................... 88
6. BLOCK DIAGRAM ...............................................................101
7. CIRCUIT DIAGRAM ............................................................102
8. BGA Pin Map ......................................................................107
8.1 BGA PIN MAP (Top View) ..................................................................107
9. PCB LAYOUT .......................................................................109
10. ENGINEERING MODE ......................................................113
11. AUTO CALIBRATION ........................................................114
11.1 Overview ..............................................................................................114
11. Configuration of Tachyon ..............................................................114
11.3 Description of Basic File ................................................................115
11.4 Procedure .............................................................................................116
11.5 AGC .........................................................................................................118
11.6 APC .........................................................................................................118
11.7 ADC .........................................................................................................118
11.8 Target Power .......................................................................................119
12. EXPLODED VIEW & REPLACEMENT PART LIST .............120
1.1 EXPLODED VIEW ................................................................................10
1. Replacement Parts ...........................................................................11
1.3 Accessory .............................................................................................135
