2.2.2 Thermal Design and Analysis (4W COB PKG)
17
A simulation is an effective procedure with regard to thermal design. Simulation results
from when the COB PKG was attached to the heat sink with TIM* are shown as below.
- Simulation S/W : Flotherm (Mentor Graphics)
- Environmental conditions(Ta) : 25
℃
- Heat dispersion condition : natural convection
- Thermal Grease : 4.5W/mK
- Heatsink material : Al (thermal conductivity :180W/mK)
- Heatsink dimension : 44 (W) x 25 (H) x 40 (L
h
) mm
- Fin number : 5ea
- Fin length : 20mm
- Fin thickness : 2.5mm
H
G
Junction temperature vs. Surface area of heat sink**
* TIM : Thermal Interface Material
** The surface area of heat sink is controlled with variation of L
h
.
The junction temperature vs. power consumption
2.2 Thermal Properties and Simulation
2. Product & Technical Guide
