Installation
Installation option
66
Lenze • BA v200-C v800-.C • 1.1
4
Installation
4.1
Installation option
This device is designed for integration. For installation and operation reasons (connector
access), the installation location must be accessible from the rear. The wall thickness of the
installation location must be between 2 and 13 mm. We recommend at least 3 mm for proper
installation with IP65 on the front.
Attention
To avoid overheating in operation: The device must not be exposed to direct radiation by
sunlight or any other light source.
If the device is installed in a panel, casing or similar, it must be ensured that no heat
accumulation occurs. The maximum permissible ambient temperature must not be exceeded.
Devices with data drives must only be installed vertically. IP65 on the front is only achieved
with proper installation.
Attention
When selecting the enclosure for integration, the total power dissipation of the system
including installed PCBs must be taken into account. The housing must be dimensioned so
that the max. permissible ambient temperature is not exceeded.
