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LA02303B BLE Module Specification

 

 

www.leedarson.com 

Better Life with Better IoT Innovation                                                                                                        1 / 20 

 

TABLE OF CONTENTS 

1 Introduction .............................................................................................................................................. 3

 

1.1 Overview ....................................................................................................................................... 3

 

1.2 Block Diagram ............................................................................................................................... 4

 

1.3 Ordering Information .................................................................................................................... 4

 

2 Electrical Characteristics .......................................................................................................................... 5

 

2.1 Absolute Maximum Ratings .......................................................................................................... 5

 

2.2 General Operating Conditions ...................................................................................................... 5

 

2.3 DC Specifications ........................................................................................................................... 6

 

2.4 RF Specifications ........................................................................................................................... 6

 

2.5 Antenna Specifications ................................................................................................................. 7

 

3 Pin Definition ............................................................................................................................................ 7

 

3.1 Default and Multiplexing Pin Definition ....................................................................................... 7

 

3.2 Trap Pins ........................................................................................................................................ 9

 

4 Design Guidelines ................................................................................................................................... 10

 

4.1 Power Supply ............................................................................................................................... 10

 

4.2 Module Placement ...................................................................................................................... 10

 

5 Package Specifications ........................................................................................................................... 12

 

5.1 Dimension ................................................................................................................................... 12

 

5.2 PCB Pads Information ................................................................................................................. 13

 

5.3 Plug-in Land Pattern Example ..................................................................................................... 13

 

5.4 SMD Land Pattern Example ........................................................................................................ 14

 

6 Production Guide.................................................................................................................................... 15

 

6.1 Handing Precaution .................................................................................................................... 15

 

6.2 Soldering Recommendation ....................................................................................................... 15

 

7 Package Information ............................................................................................................................... 16

 

7.1 Tape and Reel .............................................................................................................................. 16

 

7.2 Package and Weight .................................................................................................................... 16

 

8 Declaration .............................................................................................................................................. 16

 

 
 

 

Содержание LA02303B

Страница 1: ...ator 40MHz 32 768KHz Power supply voltage 2 0V 3 6V Operating temperature 40 100 Operating frequency 2400 2483 5MHz TX output power 8dBm Typical BLE Receiving sensitivity 95dBm 1Mbps 92dBm 2Mbps 98dBm...

Страница 2: ...6 2 4 RF Specifications 6 2 5 Antenna Specifications 7 3 Pin Definition 7 3 1 Default and Multiplexing Pin Definition 7 3 2 Trap Pins 9 4 Design Guidelines 10 4 1 Power Supply 10 4 2 Module Placement...

Страница 3: ...ce between Module and Plastic 12 Figure 5 1 Module Dimensions 12 Figure 5 2 Pad Size 13 Figure 5 3 Plug in PCB Land Pattern 13 Figure 5 4 Plug in PCB View 14 Figure 5 5 SMD Land Pattern 14 Figure 6 1...

Страница 4: ...darson developed universal Bluetooth SMART BLE module It uses the Realtek Inc RTL8762DKF System in Package that integrates an embedded 1MB flash Figure 1 1 Module It also integrates antenna on PCB whi...

Страница 5: ...tchable ROM 256KB Crystal 40MHz IO PINMUX UART x2 SPIx2 I2C x2 GPIOs Timers AUXADC IR RC Log UART PGA SDM_ADC PMU RTL8762DKF Chip Diagram Key Scan Watchdog Low Power Comparator DC DC Converter 6 chann...

Страница 6: ...re 40 125 MSL Moisture sensitivity level 3 ESD HBM Human body mode 3 5 KV 2 2 General Operating Conditions This table specifies the general operating temperature range and supply voltage range for all...

Страница 7: ...resistance 20 100 k ITX Peak Pout 7dBm 17 7 mA IRX Rx average current 5 8 mA Note The current is measured with the module running the RF test Firmware it is provided here for reference only 2 4 RF Spe...

Страница 8: ...rk Different products have different configurations which will result in different antenna performances The above parameters are based on the module being mounted on the evaluation board horizontally...

Страница 9: ...able low active Pull Down I 11 19_P4_1 PWM6 IO5 PWM Channel 6 output GPIO 5 Pull Down I O 12 2_P2_2 ADC0 IO6 Analog to Digital Converter 0 GPIO 6 Pull Down I O 13 49 GND Ground of Module 14 17_P4_3 TX...

Страница 10: ...d 0 9V in this mode and AUXADC full scale voltage is about 0 9V If the input voltage exceeds the ADC range IC will be damaged Divide mode range 0 3 3V In this mode AUXADC full scale is 3 3V in this mo...

Страница 11: ...best RF performance the power supply for the module is recommended to have the output current higher than 30mA and have the ripple voltage less than 100mV 4 2 Module Placement Figure 4 1 Antenna Area...

Страница 12: ...ce on the application board For better performance keep metal away from the module as far as possible especially heavy metal components The best position we suggest is at the edge of the application b...

Страница 13: ...ween Module and Plastic Remark due to the size and the shape of the application board could have impact on antenna patterns and efficiency and different components make different coupling different en...

Страница 14: ...rinting is PCB slot the size tolerance should be 0 1 0mm the thickness of the PCB should be 1 2mm or 1 6mm The red solder pad is to drag solder water across it is not the solder pad for the module Dur...

Страница 15: ...een the module pad and PCB slots to improve connectivity See the recommended lay out in Figure 5 4 Figure 5 4 Plug in PCB View 5 4 SMD Land Pattern Example Figure 5 5 SMD Land Pattern Note Antenna are...

Страница 16: ...ss including rework process must be completed in 168 hours after the bag is opened including any other processes All the operators shall use ESD protective floor mats wrist straps ESD protective footw...

Страница 17: ...dicated Figure 7 1 Carrier Tape Dimensions Figure 7 2 Reel Dimensions 7 2 Package and Weight Each reel contains 700 pcs weight of single module is 1 47g 15 1 25g 1 69g 8 Declaration FCC Statement This...

Страница 18: ...ny interference received including interference that may cause undesired operation Any changes or modifications not expressly approved by the party responsible for compliance could void the user s aut...

Страница 19: ...talled must also display a label referring to the enclosed module This exterior label can use wording such as the following Contains IC 10256A LA02303B any similar wording that expresses the same mean...

Страница 20: ...or a stand alone modular transmitter in a host host manufacturer have to consult with module manufacturer for the installation method in end system Any company of the host device which install this mo...

Страница 21: ...e 15 b ices 003 accueillir le fabricant est fortement recommand de confirmer la conformit avec les exigences de la fcc metteur lorsque le module est install dans l h te le dispositif d accueil doivent...

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