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Lantronix Qualcomm HDK8450, Руководство пользователя

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Lantronix Qualcomm HDK8450 Скачать руководство пользователя страница 13

HDK8450 (SM8450P) Processor User Guide 

Main board 

80-28453-2 Rev. C  Confidential 

– Qualcomm Technologies, Inc. and/or its affiliated companies – May Contain Trade Secrets

13 

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 

Subsystem / 

Connectors 

Feature Set 

Description 

Specification 

PM8350B 

The PM8350B/PM8350BH/PM8350BHS interface PMIC, 
supplements the master core PM8350 PMIC and the 
slave core PM8350C PMIC to integrate all wireless 
handset power management, general housekeeping, and 
user interface support functions into an integrated three-
IC solution.  

▪

Best in class high-efficiency 6A 3-level buck/Div2
charge pump combination architecture Li-ion battery
charger (> 97% peak efficiency)

▪

Dedicated paths for USB and wireless charging with
charger operation up to 21.5 V (25 V absolute max)

▪

Supports up to a 6A charge current (single path) and a
12 A charge current (dual path using
SMB1396/SMB1398 companion ICs)

▪

Supports USB Type-C Specification Rev. 1.4 and USB
Power Delivery Specification Rev. 3.0

▪

Supports Qualcomm® Quick Charge™ 2.0, Quick
Charge 3.0, and Quick Charge 4.0 technology

▪

Supports 2S battery with charge balancing (SMB1399
needed). See Section 1.3 for details.

▪

Simultaneous wireless charging and OTG support
using external 5 V boost

▪

Simultaneous USB charging and reverse wireless
charging support using external 5 V boost

▪

Qualcomm battery gauge with improved SoC accuracy

▪

Analog-to-digital converter (ADC) subsystem with
analog multiplexer (AMUX) and voltage/current analog-
to-digital converter (VADC/IADC)

▪

Battery interface module (BIM) that includes battery
serial interface (BSI) or PMIC serial interface (PSI) and
battery missing detection (BMD)

▪

Battery current limiting (BCL) subsystem that provides
both hardware and software alarms, which are used by
the system for reducing battery current.

▪

Triple supply high performance and high efficiency
boost regulators for OLED panels

▪

Full H-bridge haptics driver with dedicated 5 V to 10 V
programmable boost for LRA application and
SoundWire interface. See Section 1.3 for details.

▪

SPMI interface

▪

Eight GPIOs

▪

165-pin fan-out wafer-level nanoscale package (165
FOWNSP)

tech.intrinsyc.com

Confidential -- Lantronix, Inc. Lantronix NDA Required

Содержание Qualcomm HDK8450

Страница 1: ...evealed in any manner to others without the express written permission of Qualcomm Technologies Inc All Qualcomm products mentioned herein are products of Qualcomm Technologies Inc and or its subsidia...

Страница 2: ...ERNATIONAL EXPORT CONTROLLED INFORMATION Revision history Revision Date Description A September 2021 Initial release B September 2021 Optimize mainboard top bottom items list sequence C November 2021...

Страница 3: ...3 4 4 Headset jack 22 3 4 5 USB3 1 Type C connector 22 3 4 6 HDMI connector 22 3 4 7 SD socket 23 3 4 8 Rear Camera card connector 23 3 4 9 Front camera card connector 26 3 4 10 Sensor1 expansion GenX...

Страница 4: ...Connector 23 Figure 3 15 J5902 Sensor1 Expansion GenX Connector 27 Figure 3 16 J5903 Sensor2 Expansion GenX Connector 28 Figure 3 17 J5901 Vertigo Connector 30 Figure 3 18 J6001 High Speed Expansion C...

Страница 5: ...d deploy applications that can utilize the Qualcomm Snapdragon 8450 series technology 1 2 Conventions Function declarations function names type declarations attributes and code samples appear in a dif...

Страница 6: ...T CONTROLLED INFORMATION 2 System block diagram The HDK8450 development platform consists of two major components Main board Display card Display panel Expansion card The following diagrams show the t...

Страница 7: ...nfidential Qualcomm Technologies Inc and or its affiliated companies May Contain Trade Secrets 7 MAY CONTAIN U S AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Figure 2 2 HDK8450 platform bottom t e...

Страница 8: ...V out using USB C Digital AV Adapter Headset Audio INO 0650G40422 V2 Truly 6 497 FHD 1080x2400 120Hz TDDI NT36672C NOVATEK Battery HDK8450 SDR735 4G 5G sub6 SM8450P GPU Audio Multimedia EBI CSI SPMI J...

Страница 9: ...eatures with minimal integration efforts for end users It contains the followings Snapdragon 8450 SM8450P main application processor Memory 256 GB UFS 3 0 LPDDR5 up to 3200 MHz 12 GB RAM PMIC PMK8450...

Страница 10: ...l the processing occurs It is connected to the Expansion Card via two 60 pin high speed and one 40 pin low speed board to board connectors The purpose of the connectors is to bring out essential signa...

Страница 11: ...audio playback Qualcomm Snapdragon Sensors Core Technology for contextual awareness and always on sensor support Qualcomm Secure Processing Unit SPU260 for advanced secure use cases Qualcomm Hexagon...

Страница 12: ...general housekeeping and IC level interface support functions into a single mixed signal IC PM8350 is optimized for the SM8450 chipset Three HFS510 SMPS and nine FTS520 SMPS 10 LDO512 linear regulato...

Страница 13: ...3 0 Supports Qualcomm Quick Charge 2 0 Quick Charge 3 0 and Quick Charge 4 0 technology Supports 2S battery with charge balancing SMB1399 needed See Section 1 3 for details Simultaneous wireless char...

Страница 14: ...It integrates all the necessary power management housekeeping and interface support functions into a single IC One HFS515 SMPS and two FTS520 SMPS Seven LDO linear regulators On chip ADC Four GPIOs SP...

Страница 15: ...ntial input 1 x I2S reserved interface on expansion card Digital input output Display Expansion 2 x 4 Lane MIPI DSI DPHY or 2 x 3 Trio MIPI DSI CPHY 2 x 60 pin High Speed Display Connector D PHY1 2 2...

Страница 16: ...t is disconnected Default out of the box configuration is OFF The detailed configuration for boot sequence choice is listed in below table Table 3 4 Boot Sequence FAST_BOOT GPIO Boot Sequence 59 161 1...

Страница 17: ...y select DSI0 data path between display panel and HDMI Default route DSI0 to the display panel Default out of the box configuration is OFF DSI1_SW S5702 8 Manually select DSI1 data path between displa...

Страница 18: ...INTERNATIONAL EXPORT CONTROLLED INFORMATION Figure 3 4 HDMI Mode Setup 3 3 3 Development kit setup emergency download Put switch1 of S5701 on when entering Emergency Download EDL mode Remember to swit...

Страница 19: ...rted by WCD9385 Normal Open support US Standard CTIA headset by default Audio headset support USB 1x Type C USB3 1 Type C USB3 1 GEN2 10Gbps Data transfer HDMI HDMI2 0 4K60Hz HDMI output SD Card Micro...

Страница 20: ...RT I2S and GPIOs via the 40 pin connector Support sensor connectors and Power Volume Buttons on the Expansion Card WLAN Antenna 2x PCB Antenna 2 4GHz 5GHz On board antenna LED 1x Power LED Blue Adapto...

Страница 21: ...of the PMICs are outlined below Source various regulated power rails Source system clock Support for battery charging The charging port in PM8350B is configurable on the platform The main board can e...

Страница 22: ...ug UART over USB 3 4 4 Headset jack The headset jack is standard 3 5mm Normal Open style The hardware supports US Standard CTIA headset by default Figure 3 9 J4501 Headset Jack 3 4 5 USB3 1 Type C con...

Страница 23: ...SI3 Support for 3D camera configuration Separate I2C control CCI0 1 2 3 On board Amphenol 11828 1DA connector for expanding MIPI MCLK CCI GPIOs and Power rails The recommended mating connector on a ca...

Страница 24: ...CSI3 data A20 CSI1_B0_LN0_P CSI1 data B20 CSI3_B0_LN0_P CSI3 data A21 CSI1_A0_CLK_M CSI1 clock B21 CSI3_A0_CLK_M CSI3 clock A22 CSI1_NC_CLK_P CSI1 clock B22 CSI3_NC_CLK_P CSI3 clock A23 GND Ground B23...

Страница 25: ...d D18 GND C19 GND Ground D19 CAM_MCLK2 GPIO102 C20 GND Ground D20 CAM2_RESET_N GPIO106 C21 GND Ground D21 GND Ground C22 GND Ground D22 CAM_MCLK3 GPIO103 C23 CAM_SPI0_CLK_CO NN GPIO54 D23 CAM3_RESET_N...

Страница 26: ...9 CSI5_C2_LN3_M CSI5 Data J901 10 GND Ground J901 11 CSI5_C2_LN3_P CSI5 Data J901 12 CSI5_A2_LN2_M CSI5 Data J901 13 GND Ground J901 14 CSI5_C1_LN2_P CSI5 Data J901 15 CSI5_B1_LN1_M CSI5 Data J901 16...

Страница 27: ...VREG_L6I_2P8 2 8V power supplier 3 4 10 Sensor1 expansion GenX connector The sensor expansion connector allows for a 60 pin connection to an external sensor card There are two GenX connectors on the M...

Страница 28: ...R_SPI2_ CS_N GPIO201 J5902 44 NC J5902 45 MAG_I2C_SDA_ 1P2 GPIO190 J5902 46 NC J5902 47 NC J5902 48 NC J5902 49 NC J5902 50 NC J5902 51 NC J5902 52 SENSOR_I2C_SDA GPIO 196 J5902 53 NC J5902 54 SENSOR_...

Страница 29: ...3 J5903 25 NC J5903 2 6 PRESS_INT GPIO83 J5903 27 NC J5903 2 8 IMU1_INT GPIO15 J5903 29 NC J5903 3 0 ALSP_INT_N GPIO14 J5903 31 NC J5903 3 2 HALL_INT_N GPIO13 J5903 33 NC J5903 3 4 MAG_I2C_SCL GPIO191...

Страница 30: ...e team Figure 3 16 J5901 Vertigo Connector 3 4 13 High speed expansion connector Figure 3 17 J6001 High Speed Expansion Connector High speed expansion connector provides DSI0 CSI4 5 and other signals...

Страница 31: ...I0_LANE0_ M_DISP DSI0 data J6001 30 GND J6001 31 GND Ground J6001 32 NC J6001 33 MIPI_DSI0_LANE1_ P_DISP DSI0 data J6001 34 NC J6001 35 MIPI_DSI0_LANE1_ M_DISP DSI0 data J6001 36 NC J6001 37 GND Groun...

Страница 32: ...M8350 B J6101 14 VREG_L13C_3P0 3 0V power supplier J6101 15 DISP0_RESET_N GPIO32 J6101 16 VREG_L8C_1P8 1 8V power supplier J6101 17 MDP_VSYNC_P GPIO86 J6101 18 VREG_L3C_3P0 3 0V power supplier J6101 1...

Страница 33: ..._JTAG_TMS JTAG J6101 60 VPH_PWR VPH_PWR 3 4 15 Low speed expansion connector Figure 3 19 J6201 Low Speed Expansion Connector Table 3 12 Low Speed Expansion Connector Pinout Pin Signal Description Pin...

Страница 34: ...O80 J6201 33 CAM5_RESET_N GPIO115 J6201 34 SAR_INT_N GPIO91 J6201 35 VREG_S10B_1P8 1 8V J6201 36 DC_IN 12V J6201 37 VREG_5P0 5 0V J6201 38 DC_IN 12V J6201 39 GND ground J6201 40 GND ground 3 4 16 On b...

Страница 35: ...and or its affiliated companies May Contain Trade Secrets 35 MAY CONTAIN U S AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 3 4 17 M 2 connector The on board M 2 connector supports M B card Figure 3...

Страница 36: ...the Expansion Card The supported features are Copies of Power on Vol buttons of the Main Board Dual MIPI DSI Powers for OLED display and capacitive touch I2C or SPI for Capacitive touch panel together...

Страница 37: ...40pin low speed board to board connectors Figure 4 1 HDK Display Card 4 2 Expansion card connectors and features Table 4 2 Expansion Card Connectors and Features Domain Description Specification Usage...

Страница 38: ...ector Pinout Pin Signal Description Pin Signal Description J701 1 NC J701 2 NC J701 3 NC J701 4 IMU_SPI_MOSI GPIO 193 J701 5 NC J701 6 IMU_SPI_MISO GPIO 192 J701 7 NC J701 8 IMU_SPI_SCLK GPIO 194 J701...

Страница 39: ...4 Legacy Sensor Connector Table 4 4 Sensor4 Expansion GenX Connector Pinout Pin Signal Description Pin Signal Description J702 1 SENSOR_I3C_SDA GPIO188 J702 2 IMU1_INT GPIO15 J702 3 SENSOR_I3C_SCL GPI...

Страница 40: ...gnal J601 10 GND GND J601 11 NC J601 12 GND GND J601 13 TDO TDO Signal Target Data Out J601 14 GND GND J601 15 SRST_N Source RESET_N signal J601 16 GND GND J601 17 NC NC J601 18 GND GND J601 19 NC NC...

Страница 41: ...ND INTERNATIONAL EXPORT CONTROLLED INFORMATION 4 3 Display panel This display panel comes preinstalled on the HDK8450 expansion card Below are the Panel specifications Resolution FHD 1080x2400 ROHS Di...

Страница 42: ...nfig is 913 00453 FactoryTest mode Phone mode 0x00 Phone mode 0x00 FTM mode 0x01 Before measuring the rock bottom current make sure NV00453 is set to 0x00 so that device can suspend sleep 5 2 CDT Plat...

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