HDK8450 (SM8450P) Processor User Guide
Main board
80-28453-2 Rev. C Confidential
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MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Subsystem /
Connectors
Feature Set
Description
Specification
PM8450
The PM8450 device integrates most of the wireless
product’s power management, general housekeeping, and
IC-level interface support functions into a single mixed-
signal IC.
▪
PM8450 is optimized for the SM8450 chipset.
▪
Six FTS520 SMPS
▪
Four LDO512 linear regulators
▪
Overtemperature protection
▪
SPMI
▪
Four GPIOs
▪
81-pin fan-out wafer-level pico-scale package
(81 FOWPSP)
PM8350
The PM8350 device integrates most of the wireless
product’s power management, general housekeeping, and
IC-level interface support functions into a single mixed-
signal IC.
▪
PM8350 is optimized for the SM8450 chipset.
▪
Three HFS510 SMPS and nine FTS520 SMPS
▪
10 LDO512 linear regulators
▪
On-chip ADC
▪
Overtemperature protection
▪
SPMI
▪
10 GPIOs
▪
144-pin fan-out wafer-level nano-scale package (144
FOWNSP)
PM8350C
The PM8350C PMIC supplements the core PM8350
PMIC and the slave PM8350B PMIC to integrate all
wireless handset power management, general
housekeeping, IC-level interface, and user interface
support functions into an integrated solution.
▪
PM8350C is optimized for the SM8450 chipset.
▪
Nine FTS520 SMPS and one HFS515 SMPS
regulators
▪
13 LDO linear regulators
▪
System rail buck-or-boost (BoB) SMPS regulator
▪
RGB LED drivers and camera flash drivers
▪
Overtemperature protection
▪
SPMI
▪
9 GPIOs
▪
143-pin fanout wafer-level nanoscale package
(FOWNSP143)
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