
5: Carrier Board
Snapdragon 845 HDK Hardware Development Kit User Guide
23
Domain
Description
Specification
Usage
LCD Display and Touch
connector
100 pin for LCD signals from
B2B boards for display
4-lane MIPI DSI0 , DSI1
I2C/SPI/GPIO
Backlight
MIPI Allie Specification v1.2
MIPI D-PHY Specification
v0.65,v0.81, v0.90, v1.01,
V1.2
MIPI C-PHY Specification
v1.0
Can work as one dual DSI or
both independent display
Sensor header
24 pin sensor header
24 pin sensor header
Header to connect sensor
board.
SIM Card
WWAN SIM card connector
(optional)
2x 4bit Micro SIM card
support
For WWAN mini PCI express
cards (for internal use only –
not supported)
CSI Camera connectors
1 x 120pin connector with
MCLK, GPIOS, CCI
1 x 120pin connector with
MCLK, GPIOS, CCI
Supports CSI0, CSI1 and
CSI2 via one 120pin
connector
3 x MIPI-CSI each 4 lane
External flash driver control
Support for 3D camera
configuration
Separate MCLK / CCI control
Supports CSI3 via one 23pin
connector on Processor
board
1 x MIPI-CSI 2 lane
Separate MCLK / CCI control
MIPI Allie Specification v1.2
for Camera Serial Interface
Single Rear, Front camera
Dual Camera
Iris Camera
The following sections will provide in depth information on each expansion headers and connectors on the
carrier board. The information listed below is of particular use for those who want to interface other external
hardware devices with the HDK845.
Before connecting anything to the development kit, ensure the device
meets the specific hardware requirements of the processor.