BTM44X Hardware Integration Guide
Bluetooth
®
Enhanced Data Module
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Laird Technologies
ensure oven temperatures during reflow meet the requirements of the solder paste. Laird Technologies’
surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
Figure 10: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 21.
Table 8: Recommended Maximum and minimum temperatures
Recommended Max & Min's
Specification
Value
Unit
Temperature Inc./Dec. Rate (max)
3
°C / Sec
Temperature Decrease rate (goal)
2-3
°C / Sec
Soak Temp Increase rate (goal)
.5 - 1
°C / Sec
Flux Soak Period (Min)
60
Sec
Flux Soak Period (Max)
90
Sec
Flux Soak Temp (Min)
150
°C
Flux Soak Temp (max)
190
°C
Time Above Liquidous (max)
60
Sec
Time Above Liquidous (min)
20
Sec
Time In Target Reflow Range (goal)
30
Sec
Time At Absolute Peak (max)
30
Sec
Liquidous Temperature (SAC305)
217
°C
Lower Target Reflow Temperature
225
°C
Upper Target Reflow Temperature
250
°C
Absolute Peak Temperature
260
°C
IMPORTANT: During reflow, modules should not be above 260°C and not for more than 30
