BL600-Sx
Single Mode BLE Module
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
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CONN-UM-BL600_v1_0
8.3
Reflow Parameters
Laird Technologies surface mount modules are designed to be easily manufactured, including reflow soldering
to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to
ensure oven temperatures during reflow meet the requirements of the solder paste. Laird Technologies’
surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 8-2: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in
Table 9: Recommended Maximum and minimum temperatures
Specification
Value
Unit
Temperature Inc./Dec. Rate (max)
1~3
°C / Sec
Temperature Decrease rate (goal)
2-4
°C / Sec
Soak Temp Increase rate (goal)
.5 - 1
°C / Sec
Flux Soak Period (Min)
70
Sec
Flux Soak Period (Max)
120
Sec
Flux Soak Temp (Min)
150
°C
Flux Soak Temp (max)
190
°C
Time Above Liquidous (max)
70
Sec
Time Above Liquidous (min)
50
Sec
Time In Target Reflow Range (goal)
30
Sec
Time At Absolute Peak (max)
5
Sec
Liquidous Temperature (SAC305)
218
°C
Lower Target Reflow Temperature
240
°C
Upper Target Reflow Temperature
250
°C
Absolute Peak Temperature
260
°C
